The XCZU21DR-1FFVD1156I is a high-performance Zynq UltraScale+ RFSoC from AMD (formerly Xilinx) that combines programmable logic, ARM processors, and direct RF sampling technology in a single chip. This advanced Xilinx FPGA solution is ideal for 5G wireless infrastructure, software-defined radio (SDR), and defense applications requiring superior signal processing capabilities.
XCZU21DR-1FFVD1156I Overview and Key Features
The XCZU21DR-1FFVD1156I belongs to the first generation of Zynq UltraScale+ RFSoC devices. As a result, it delivers exceptional integration by combining a powerful processing system with UltraScale architecture programmable logic and RF data converters on a single die.
Why Choose the XCZU21DR-1FFVD1156I?
This RFSoC device eliminates the need for external ADC/DAC components, which significantly reduces power consumption and PCB complexity. Moreover, the integrated RF-ADC and RF-DAC converters enable direct RF sampling up to 6 GHz analog bandwidth.
XCZU21DR-1FFVD1156I Technical Specifications
General Specifications Table
| Parameter |
Specification |
| Manufacturer |
AMD (Xilinx) |
| Part Number |
XCZU21DR-1FFVD1156I |
| Family |
Zynq UltraScale+ RFSoC |
| Process Technology |
16nm FinFET+ |
| Package Type |
FCBGA (Flip Chip Ball Grid Array) |
| Package Code |
FFVD1156 |
| Pin Count |
1156 Balls |
| Speed Grade |
-1 (Standard Performance) |
| Temperature Grade |
Industrial (-40°C to +100°C) |
| RoHS Compliance |
Yes |
Programmable Logic Resources
| Resource |
Quantity |
| System Logic Cells |
930,300 |
| CLB Flip-Flops |
850,560 |
| CLB LUTs |
425,280 |
| Block RAM (Kb) |
22,680 |
| UltraRAM (Kb) |
16,875 |
| DSP Slices |
4,272 |
Processing System Specifications
| Component |
Details |
| Application Processing Unit (APU) |
Quad-core ARM Cortex-A53 @ 1.5 GHz |
| Real-Time Processing Unit (RPU) |
Dual-core ARM Cortex-R5F @ 600 MHz |
| L1 Cache (APU) |
32KB Instruction / 32KB Data per core |
| L2 Cache (APU) |
1MB Shared |
| On-Chip Memory |
256KB with ECC |
| External Memory Support |
DDR4, LPDDR4 |
RF Data Converter Subsystem Features
The XCZU21DR-1FFVD1156I integrates a comprehensive RF data converter subsystem. This subsystem is essential for software-defined radio and wireless infrastructure applications.
RF-ADC Specifications
| Parameter |
Value |
| Maximum Sample Rate |
Up to 4.096 GSPS |
| Resolution |
12-bit |
| Analog Input Bandwidth |
Up to 6 GHz |
| Number of Channels |
Multiple configurable channels |
| Digital Down Converter (DDC) |
Integrated with NCO and mixer |
RF-DAC Specifications
| Parameter |
Value |
| Maximum Sample Rate |
Up to 6.554 GSPS |
| Resolution |
14-bit |
| Analog Output Bandwidth |
Up to 6 GHz |
| Number of Channels |
Multiple configurable channels |
| Digital Up Converter (DUC) |
Integrated with interpolation and NCO |
Soft-Decision Forward Error Correction (SD-FEC)
The XCZU21DR-1FFVD1156I includes hardened SD-FEC blocks that provide exceptional error correction performance. These blocks support multiple coding schemes essential for modern communication systems.
SD-FEC Capabilities
| Feature |
Support |
| LDPC Decode/Encode |
Yes |
| Turbo Decode |
Yes |
| Throughput |
Over 1 Gbps |
| Target Applications |
5G NR, LTE, DOCSIS 3.1, Backhaul |
Connectivity and Interface Options
High-Speed Serial Transceivers
| Interface Type |
Specification |
| GTY Transceivers |
Up to 32.75 Gbps |
| GTH Transceivers |
Available |
| PCI Express |
Gen3 x16 via PCIE4 blocks |
| PS-GTR Transceivers |
4x up to 6 Gbps |
Processing System I/O
| Interface |
Details |
| MIO Pins |
Up to 78 multiplexed I/O |
| USB |
USB 2.0/3.0 support |
| Gigabit Ethernet |
Multiple GEM controllers |
| UART/SPI/I2C |
Multiple interfaces |
| SD/eMMC |
SDIO 3.0 / eMMC 4.51 |
| QSPI Flash |
Quad SPI controller |
XCZU21DR-1FFVD1156I Operating Conditions
Electrical Characteristics
| Parameter |
Condition |
Value |
| VCCINT (Core Voltage) |
Nominal |
0.85V |
| VCCINT (Low Power Mode) |
Optional |
0.72V |
| VCCAUX |
Auxiliary |
1.8V |
| VCCO (I/O Banks) |
Configurable |
1.0V – 3.3V |
Environmental Specifications
| Parameter |
Industrial Grade (-1I) |
| Operating Temperature |
-40°C to +100°C (Tj) |
| Storage Temperature |
-65°C to +150°C |
| Humidity |
85% RH (non-condensing) |
Target Applications for XCZU21DR-1FFVD1156I
The XCZU21DR-1FFVD1156I is specifically designed for demanding RF and signal processing applications:
Wireless Infrastructure
- 5G New Radio (NR) base stations
- Massive MIMO systems
- Small cell and macro cell deployments
- LTE Advanced Pro systems
Defense and Aerospace
- Software-defined radio (SDR) platforms
- Electronic warfare systems
- Phased array radar
- Satellite communications (SATCOM)
Cable and Broadband
- DOCSIS 3.1 cable modems
- Remote PHY nodes
- Distributed access architecture
Test and Measurement
- RF signal analyzers
- Arbitrary waveform generators
- Protocol analyzers
Development Tools and Software Support
Vivado Design Suite Compatibility
The XCZU21DR-1FFVD1156I is fully supported by AMD Vivado Design Suite. Development tools include:
- Vivado ML Standard/Enterprise Edition
- Vitis Unified Software Platform
- PetaLinux for embedded Linux development
- Model Composer for DSP design
IP Core Support
| IP Category |
Available Cores |
| RF Data Converter |
Xilinx RF Data Converter IP |
| SD-FEC |
Soft-Decision FEC IP |
| DSP |
FIR Compiler, DDS, FFT |
| Connectivity |
PCIe, Ethernet, JESD204B/C |
| Processing |
MicroBlaze, Arm IP |
Part Number Decoder: XCZU21DR-1FFVD1156I
Understanding the part number helps identify exact device specifications:
| Code Segment |
Meaning |
| XC |
Xilinx Commercial |
| ZU21 |
Zynq UltraScale+ Device 21 |
| DR |
RFSoC with Data Converters |
| -1 |
Speed Grade 1 |
| FF |
Flip-Chip package |
| V |
Pb-free (RoHS compliant) |
| D |
Package variant |
| 1156 |
1156 ball count |
| I |
Industrial temperature range |
Related XCZU21DR Part Numbers
| Part Number |
Speed Grade |
Temperature |
Package |
| XCZU21DR-1FFVD1156I |
-1 |
Industrial |
FFVD1156 |
| XCZU21DR-1FFVD1156E |
-1 |
Extended |
FFVD1156 |
| XCZU21DR-2FFVD1156I |
-2 |
Industrial |
FFVD1156 |
| XCZU21DR-2FFVD1156E |
-2 |
Extended |
FFVD1156 |
Ordering Information
When ordering the XCZU21DR-1FFVD1156I, ensure you specify:
- Complete part number for correct speed grade and temperature range
- Required quantity for volume pricing
- Packaging preference (tape and reel or tray)
- Lead time requirements
Summary: XCZU21DR-1FFVD1156I Benefits
The XCZU21DR-1FFVD1156I Zynq UltraScale+ RFSoC delivers a revolutionary single-chip solution for RF signal processing applications. Key benefits include:
- Integrated RF Data Converters – Eliminates external ADC/DAC components
- Reduced Power Consumption – Up to 50% lower power than discrete solutions
- Smaller Footprint – Single-chip integration reduces PCB area
- Simplified Design – Removes complex JESD204B/C interfaces
- Software Flexibility – Programmable digital signal processing
- Industrial Reliability – -40°C to +100°C operating range
For engineers designing next-generation wireless, defense, and test equipment, the XCZU21DR-1FFVD1156I provides unmatched performance and integration in the RFSoC family.
