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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCVU47P-L2FSVH2892E: AMD Xilinx Virtex UltraScale+ HBM FPGA with 16GB High Bandwidth Memory

Product Details

The XCVU47P-L2FSVH2892E is a high-performance Field Programmable Gate Array (FPGA) from AMD’s Virtex UltraScale+ HBM family. This powerful FPGA features 2,851,800 system logic cells, 9,024 DSP slices, and 16GB of integrated High Bandwidth Memory (HBM). DigiKey Designed for data-intensive applications requiring exceptional compute performance and memory bandwidth, this device represents the pinnacle of programmable logic technology.


XCVU47P-L2FSVH2892E Key Features and Benefits

The XCVU47P-L2FSVH2892E delivers industry-leading performance for demanding workloads. Each VU47P FPGA offers up to 28 TOPS of DSP compute performance when processing INT8 values. AWS The integrated HBM provides massive memory bandwidth essential for AI, machine learning, and high-performance computing applications.

Why Choose the Virtex UltraScale+ VU47P FPGA?

Built on UltraScale architecture with FinFET node technology, the Virtex UltraScale+ HBM family delivers the highest signal processing bandwidth at 21.2 TeraMACs of DSP compute performance. AMD This Xilinx FPGA is ideal for engineers designing next-generation systems requiring substantial computational resources.


XCVU47P-L2FSVH2892E Technical Specifications

Logic Resources

Parameter Specification
System Logic Cells 2,851,800
CLB Flip-Flops 2,607,360
CLB Look-Up Tables (LUTs) 1,303,680
Maximum Distributed RAM 36.7 Mb

Memory Resources

Parameter Specification
Block RAM 70.9 Mb (2,016 blocks)
UltraRAM 270.0 Mb (960 blocks)
HBM DRAM Capacity 16 GB
HBM AXI Interfaces 32

DSP and Processing Capabilities

Parameter Specification
DSP Slices 9,024
Peak INT8 Performance 28.1 TOP/s
Clock Management Tiles (CMTs) 12

I/O and Connectivity

Parameter Specification
Package Type 2892-BBGA (FCBGA)
Maximum HP I/O 624
GTY Transceivers 96
Transceiver Speed 32.75 Gb/s
PCIe Support Gen3/Gen4 with CCIX

Electrical Characteristics

Parameter Specification
Process Technology 16nm FinFET
Speed Grade -2L (Low Power)
Core Voltage (VCCINT) 0.85V or 0.72V

Understanding the XCVU47P-L2FSVH2892E Part Number

The part number provides essential information about device configuration:

Code Meaning
XC Xilinx Commercial
VU47P Virtex UltraScale+ 47P device
L2 Low-power -2 speed grade
FSVH Package designator
2892 2892-ball BGA package
E Extended temperature range

The -2LE devices can operate at VCCINT voltage of 0.85V or 0.72V, providing lower maximum static power consumption. FPGAkey


Target Applications for XCVU47P-L2FSVH2892E

F2 instances powered by VU47P FPGAs are ready to accelerate genomics, multimedia processing, big data, satellite communication, networking, silicon simulation, and live video workloads. AWS

The XCVU47P-L2FSVH2892E excels in these demanding applications:

  • Artificial Intelligence (AI) and Machine Learning (ML) acceleration
  • High-frequency trading and financial computing
  • Data center acceleration and cloud computing
  • 5G wireless infrastructure
  • Video transcoding and broadcast equipment
  • Network packet processing and security appliances
  • Scientific computing and research applications
  • Automotive ADAS development platforms

High Bandwidth Memory (HBM) Technology Advantages

Each FPGA Accelerator Card provides 16 GiB of High Bandwidth Memory with up to 460 GiB/s bandwidth. AWS This revolutionary memory architecture eliminates traditional memory bottlenecks by integrating HBM directly into the FPGA package.

HBM Benefits for System Designers

Feature Advantage
In-Package Integration Reduced latency and power consumption
32 AXI Interfaces Parallel memory access channels
460+ GB/s Bandwidth Massive data throughput capability
16GB Capacity Large working datasets in-memory

Development Tools and Ecosystem Support

Virtex UltraScale+ HBM FPGAs are supported by comprehensive development tools, reference designs, an IP catalog, and evaluation platforms. Xilinx

Designers working with the XCVU47P-L2FSVH2892E can leverage:

  • Vivado Design Suite for synthesis and implementation
  • Vitis Unified Software Platform for accelerated application development
  • Extensive IP libraries and reference designs
  • Hardware evaluation boards and development kits

Package Information and PCB Design Considerations

The XCVU47P-L2FSVH2892E utilizes a 2892-ball Fine-pitch Ball Grid Array (FCBGA) package with 1.0mm ball pitch. Packages with the same footprint identifier code are footprint compatible, enabling design migration within the UltraScale+ family. Mouser

Package Specifications Summary

Parameter Value
Package Style FCBGA
Ball Count 2892
Ball Pitch 1.0mm
Mounting Type Surface Mount

XCVU47P-L2FSVH2892E Ordering Information

When ordering this Virtex UltraScale+ HBM FPGA, ensure you specify the complete part number XCVU47P-L2FSVH2892E to receive the correct speed grade, package, and temperature range configuration.

The XCVU47P-L2FSVH2892E represents AMD’s commitment to delivering cutting-edge programmable logic solutions for the most demanding applications in data centers, telecommunications, and high-performance computing environments.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.