The XCVU47P-3FSVH2892E is a premium-grade Field Programmable Gate Array (FPGA) from the AMD/Xilinx Virtex UltraScale+ HBM family. This powerful IC features 624 I/O pins and comes in a 2892-BBGA FCBGA package DigiKey, making it an ideal solution for demanding high-bandwidth memory applications.
Designed for compute-intensive workloads, this Xilinx FPGA delivers exceptional performance for AI inference, video transcoding, network acceleration, and data center applications.
Key Features of XCVU47P-3FSVH2892E FPGA
The VU47P device offers 2,851,800 system logic cells with 2,607,360 CLB flip-flops and 1,303,680 CLB LUTs Mouser. Each VU47P FPGA contains 2.85 million system logic cells along with 9,024 DSP slices capable of delivering up to 28 TOPS of DSP compute performance when processing INT8 values AWS.
Memory Architecture Specifications
The XCVU47P provides 36.7 Mb of distributed RAM, 2,016 block RAM units totaling 70.9 Mb, and 960 UltraRAM blocks providing 270.0 Mb of ultra-fast on-chip memory. Additionally, this device includes 16 GB of HBM DRAM Mouser.
The Virtex UltraScale+ HBM architecture delivers up to 460 GB/s of memory bandwidth, providing 20X more bandwidth than a DDR4 DIMM AMD. This massive bandwidth makes the XCVU47P perfect for memory-bound applications requiring rapid data access.
XCVU47P-3FSVH2892E Technical Specifications Table
| Parameter |
Value |
| Manufacturer |
AMD (formerly Xilinx) |
| Part Number |
XCVU47P-3FSVH2892E |
| Family |
Virtex UltraScale+ HBM |
| Package Type |
2892-BBGA, FCBGA |
| Package Dimensions |
55mm x 55mm |
| Ball Pitch |
1.0mm |
| Speed Grade |
-3 (Highest Performance) |
| Process Technology |
16nm FinFET |
| Maximum I/O Pins |
624 |
Logic and Processing Resources
| Resource |
Quantity |
| System Logic Cells |
2,851,800 |
| CLB Flip-Flops |
2,607,360 |
| CLB LUTs |
1,303,680 |
| DSP48E2 Slices |
9,024 |
| Maximum DSP Performance |
28 TOPS (INT8) |
On-Chip Memory Configuration
| Memory Type |
Capacity |
| Distributed RAM |
36.7 Mb |
| Block RAM (36Kb each) |
70.9 Mb (2,016 blocks) |
| UltraRAM (288Kb each) |
270.0 Mb (960 blocks) |
| Total On-Chip Memory |
~377.6 Mb |
| HBM Gen2 (In-Package) |
16 GB |
| HBM Bandwidth |
460 GB/s |
High-Speed Transceiver Capabilities
The XCVU47P in the FSVH2892 package supports 624 HP I/O pins and 96 GTY transceivers Mouser. These transceivers enable high-speed serial communication essential for modern networking and data center infrastructure.
| Transceiver Feature |
Specification |
| GTY Transceivers |
96 |
| Maximum GTY Data Rate |
32.75 Gb/s |
| HP I/O Pins |
624 |
| PCIe Support |
Gen3 x16 / Gen4 x8 |
XCVU47P-3FSVH2892E Applications
The XCVU47P is well-suited for AI inference applications that need to process large datasets at maximum speed while reducing power requirements AMD. Amazon Web Services utilizes the VU47P FPGA in their F2 instances for FPGA-accelerated solutions in genomics, multimedia processing, big data, network security, and cloud-based video broadcasting AWS.
Primary Application Areas
- Artificial Intelligence and Machine Learning: Deep learning inference engines and neural network acceleration
- Data Center Acceleration: Database acceleration and search applications
- Video Processing: Real-time video transcoding and streaming infrastructure
- Network Security: Next-generation firewalls and intrusion detection systems
- High-Performance Computing: Scientific simulations and financial modeling
- Telecommunications: 100G/400G Ethernet infrastructure
Speed Grade Information
The Virtex UltraScale+ FPGAs are available in -3, -2, and -1 speed grades, with -3 devices offering the highest performance FPGAkey. The XCVU47P-3FSVH2892E designation indicates this is the fastest speed grade available for this device.
| Speed Grade |
Performance Level |
Typical Application |
| -3 |
Highest |
Maximum frequency designs |
| -2 |
Standard |
General-purpose applications |
| -1 |
Economy |
Cost-sensitive designs |
Power Supply Requirements
| Supply Rail |
Voltage |
Description |
| VCCINT |
0.85V / 0.72V |
Core supply voltage |
| VCCBRAM |
0.85V |
Block RAM supply |
| VCCAUX |
1.8V |
Auxiliary supply |
| VCCO |
1.0V – 1.8V |
I/O bank supply (HP) |
| VMGTAVCC |
0.9V |
GTY transceiver analog supply |
| VMGTAVTT |
1.2V |
GTY transceiver termination supply |
Environmental and Operating Conditions
| Parameter |
Minimum |
Maximum |
| Operating Temperature (Extended) |
0°C |
100°C |
| Maximum Junction Temperature (VU47P) Device Report |
– |
120°C |
| Storage Temperature |
-65°C |
150°C |
Package Information: FSVH2892
The FSVH2892 package is a flip-chip ball grid array designed specifically for HBM-enabled Virtex UltraScale+ devices. This lidless package with stiffener ring optimizes thermal performance for high-power applications.
| Package Parameter |
Value |
| Package Code |
FSVH2892 |
| Body Size |
55mm x 55mm |
| Ball Count |
2892 |
| Ball Pitch |
1.0mm |
| Package Style |
FCBGA (Flip-Chip BGA) |
Why Choose XCVU47P-3FSVH2892E?
Marrying HBM with high-end programmable logic brings significant benefits to network and security applications. An HBM implementation simplifies PCB design and decreases memory subsystem complexity compared to traditional DIMM-based solutions AMD.
The F2 instances powered by VU47P FPGAs deliver up to 60% better price performance than previous generation FPGA instances AWS, demonstrating the exceptional value this device provides for cloud and enterprise deployments.
Key Advantages
- Integrated HBM Controller: Reduces logic footprint by approximately 250K LUTs
- Low Power Memory Access: Approximately 7 pJ/bit for HBM operations
- Extended AXI Ports: Any-port-to-any-address access capability
- Simplified Board Design: Eliminates need for external DIMM modules
- 16nm FinFET Process: Optimal balance of performance and power efficiency
Ordering Information
| Attribute |
Detail |
| Manufacturer Part Number |
XCVU47P-3FSVH2892E |
| Manufacturer |
AMD (Xilinx) |
| Product Status |
Active |
| RoHS Status |
Compliant |
| Packaging |
Tray |
Related Products in the VU47P Family
| Part Number |
Speed Grade |
Key Difference |
| XCVU47P-1FSVH2892E |
-1 |
Economy speed grade |
| XCVU47P-2FSVH2892E |
-2 |
Standard speed grade |
| XCVU47P-3FSVH2892E |
-3 |
Highest performance |
| XCVU47P-L2FSVH2892E |
-2LE |
Low-power extended variant |
Conclusion
The XCVU47P-3FSVH2892E represents the pinnacle of FPGA technology for memory-intensive applications. With its integrated 16 GB HBM delivering 460 GB/s bandwidth, nearly 2.9 million logic cells, and over 9,000 DSP slices, this device enables breakthrough performance for AI inference, video processing, networking, and data center acceleration workloads.
Whether you are developing cloud-scale solutions or edge computing platforms, the XCVU47P-3FSVH2892E provides the processing power, memory bandwidth, and I/O flexibility required for next-generation systems.
