Overview of AMD XCVU47P-2FSVH2892E FPGA
The XCVU47P-2FSVH2892E is a cutting-edge Field Programmable Gate Array (FPGA) from AMD’s Virtex UltraScale+ family, designed to deliver exceptional performance for high-bandwidth, compute-intensive applications. This advanced Xilinx FPGA combines massive logic capacity with integrated High Bandwidth Memory (HBM) technology, making it the ideal solution for data center acceleration, AI/ML workloads, and high-performance computing applications.
Key Features of XCVU47P-2FSVH2892E
Advanced Architecture and Logic Capacity
The XCVU47P-2FSVH2892E represents the pinnacle of AMD FPGA technology, offering unparalleled processing capabilities:
- 2,851,800 Logic Cells: Massive logic capacity for complex digital designs
- 624 User I/O Pins: Extensive connectivity options for multi-interface systems
- 16nm FinFET+ Technology: Advanced manufacturing process for superior power efficiency
- -2 Speed Grade: Balanced performance and power consumption characteristics
- 0.85V Core Voltage (VCCINT): Optimized for power-efficient operation
Package and Physical Specifications
| Specification |
Details |
| Package Type |
2892-pin FCBGA (Flip Chip Ball Grid Array) |
| Package Code |
FSVH2892E |
| Mounting Type |
Surface Mount Technology (SMT) |
| Operating Temperature |
Industrial grade (-40°C to +100°C) |
| Logic Elements |
2,851,800 cells |
| Total I/O Count |
624 programmable I/Os |
Technical Specifications and Performance
Core Architecture Details
The XCVU47P-2FSVH2892E FPGA integrates several advanced features that set it apart:
Processing Resources
| Resource Type |
Specification |
| CLB (Configurable Logic Blocks) |
893,060 CLBs |
| DSP Slices |
2,160 DSP48E2 slices |
| Block RAM |
74.3 Mb total block RAM |
| UltraRAM |
360 Mb distributed memory |
| System Clock Rate |
Up to 775 MHz |
High Bandwidth Memory (HBM) Integration
The XCVU47P features integrated HBM2 memory technology:
- HBM2 Memory Capacity: 8GB on-package memory
- Memory Bandwidth: Up to 460 GB/s aggregate bandwidth
- Memory Channels: Multiple independent memory controllers
- Low Latency Access: Direct FPGA-to-memory connection
Power and Thermal Characteristics
| Parameter |
Value |
| Core Voltage (VCCINT) |
0.85V typical |
| I/O Voltage (VCCO) |
1.2V to 1.8V (dependent on bank) |
| Maximum Junction Temperature |
100°C |
| Thermal Resistance |
Package dependent |
Applications and Use Cases
Primary Application Domains
The XCVU47P-2FSVH2892E excels in demanding computational environments:
Data Center and Cloud Computing
- Machine learning inference acceleration
- Database query processing
- Network packet processing and filtering
- Video transcoding and streaming
High-Performance Computing
- Scientific simulation and modeling
- Computational fluid dynamics (CFD)
- Genomic sequencing analysis
- Financial risk modeling
Aerospace and Defense
- Radar signal processing
- Software-defined radio (SDR) systems
- Image and video processing
- Electronic warfare applications
Test and Measurement
- High-speed data acquisition systems
- Real-time signal analysis
- Protocol testing equipment
- Oscilloscope and logic analyzer backends
Development Tools and Ecosystem
Design Software Support
| Tool Category |
Supported Software |
| Design Suite |
Vivado Design Suite 2018.3 or later |
| Simulation |
Vivado Simulator, ModelSim, VCS |
| Debug Tools |
Vivado Logic Analyzer, ChipScope |
| Programming |
Vivado Hardware Manager |
| High-Level Synthesis |
Vitis HLS, Vitis Unified Software Platform |
IP Core Compatibility
The XCVU47P-2FSVH2892E supports extensive IP core integration:
- PCI Express Gen3/Gen4 hard IP blocks
- 100G Ethernet MAC/PCS cores
- Interlaken protocol support
- Memory interface generators for DDR4, DDR3
- Video processing IP libraries
Comparison with Alternative FPGA Options
Speed Grade Variants
| Part Number |
Speed Grade |
Core Voltage |
Performance Level |
| XCVU47P-1FSVH2892E |
-1 |
0.85V |
Standard performance |
| XCVU47P-2FSVH2892E |
-2 |
0.85V |
Mid-range performance |
| XCVU47P-3FSVH2892E |
-3 |
0.85V |
Highest performance |
| XCVU47P-L2FSVH2892E |
-2LE |
0.85V/0.72V |
Low power variant |
Quality and Compliance
Manufacturing Standards
- RoHS Compliant: Lead-free package options available
- Moisture Sensitivity Level (MSL): MSL3 rating
- Manufacturing Location: Advanced semiconductor fabrication facilities
- Quality Certifications: ISO 9001 certified manufacturing
- Reliability Testing: Military-grade screening available
ESD and Handling Precautions
The XCVU47P-2FSVH2892E requires proper ESD protection during handling:
- Use proper grounding straps and mats
- Store in anti-static packaging when not in use
- Follow IPC-A-610 guidelines for assembly
- Maintain controlled humidity environments
Ordering Information and Availability
Part Number Breakdown
XCVU47P-2FSVH2892E decodes as follows:
- XC: Xilinx (now AMD) commercial temperature device
- VU47P: Virtex UltraScale+ 47 with HBM (P designation)
- -2: Speed grade (-2 commercial)
- FSVH2892: Package type and pin count
- E: Extended temperature range (Industrial grade)
Package and Delivery
| Ordering Option |
Details |
| Standard Packaging |
Tray packaging for production volumes |
| Minimum Order Quantity |
Contact distributor for MOQ |
| Lead Time |
Typically 12-16 weeks for standard orders |
| Custom Orders |
Available for volume customers |
Design Considerations and Best Practices
Power Supply Requirements
Implementing the XCVU47P-2FSVH2892E requires careful power supply design:
- Multi-rail Power Architecture: Separate supplies for core, I/O, and auxiliary functions
- Power Sequencing: Proper startup and shutdown sequencing critical
- Decoupling Capacitors: Extensive local bypassing required
- Voltage Regulators: High-current, low-noise regulators recommended
Thermal Management Strategies
| Cooling Method |
Recommended Application |
| Heat Sinks |
Standard operating conditions |
| Active Cooling |
High-utilization applications |
| Liquid Cooling |
Maximum performance scenarios |
| Thermal Interface Materials |
Required for all installations |
PCB Design Guidelines
Critical considerations for board layout:
- Minimum 10-layer PCB recommended
- Controlled impedance routing for high-speed signals
- Proper ground plane design and segmentation
- BGA escape routing following AMD guidelines
- Signal integrity analysis for critical paths
Frequently Asked Questions
What is the difference between XCVU47P-2FSVH2892E and standard Virtex UltraScale+ FPGAs?
The “P” designation indicates this is a premium version featuring integrated HBM2 memory, providing significantly higher memory bandwidth compared to standard external memory interfaces.
Can I use this FPGA for AI acceleration?
Yes, the XCVU47P-2FSVH2892E is well-suited for AI/ML acceleration, particularly for inference workloads requiring high memory bandwidth and massive parallel processing capabilities.
What development boards are available?
AMD offers Virtex UltraScale+ HBM evaluation platforms, though availability varies. Contact AMD or authorized distributors for current development board options.
Is this device suitable for military applications?
While the -2FSVH2892E uses industrial temperature range, military-screened versions with extended specifications are available under separate part numbers.
Conclusion
The AMD XCVU47P-2FSVH2892E represents a flagship solution in the Virtex UltraScale+ family, combining massive logic capacity with integrated HBM technology. This FPGA delivers the performance, bandwidth, and flexibility required for next-generation data center, HPC, and aerospace applications. With its advanced 16nm architecture, extensive I/O capabilities, and comprehensive development tool support, the XCVU47P-2FSVH2892E provides engineers with a powerful platform for solving today’s most challenging computational problems.
For technical support, documentation, and ordering information, contact authorized AMD distributors or visit the official AMD FPGA product pages.
