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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCVU37P-L2FSVH2892E: AMD Virtex UltraScale+ HBM FPGA with 8GB High Bandwidth Memory

Product Details

The XCVU37P-L2FSVH2892E is a high-performance Xilinx FPGA from AMD’s Virtex UltraScale+ HBM family. This FPGA integrates 8GB of HBM DRAM adjacent to the FPGA die, enabling massive memory bandwidth and a much smaller PCB footprint. AMD Designed for compute-intensive applications, this device delivers exceptional processing power for AI inference, data center acceleration, and high-speed networking solutions.

XCVU37P-L2FSVH2892E Key Features and Benefits

The Virtex UltraScale+ HBM FPGAs provide the highest on-chip memory density with up to 500 Mb of total integrated memory, plus up to 16 GB of HBM Gen2 integrated in-package for 460 GB/s of memory bandwidth. AMD The XCVU37P variant specifically offers 8GB HBM capacity with industry-leading bandwidth performance.

Why Choose the XCVU37P-L2FSVH2892E FPGA?

The 460 GB/s of HBM bandwidth delivers 20X more bandwidth than a DDR4 DIMM. AMD This revolutionary architecture eliminates memory bottlenecks that traditionally limit system performance. Extended AXI ports and an integrated port switch provide any-port-to-any-address access, minimizing design size, complexity, and time to market. AMD

XCVU37P-L2FSVH2892E Technical Specifications

Core Specifications Table

Parameter Value
Manufacturer AMD (Xilinx)
Part Number XCVU37P-L2FSVH2892E
Series Virtex UltraScale+ HBM
Device Type Field Programmable Gate Array (FPGA)
System Logic Cells 2,852K Farnell
Process Technology 20nm Octopart
Speed Grade -2L (Low Power)

Memory and Processing Resources

Resource Specification
HBM DRAM Capacity 8 GB Farnell
HBM Bandwidth Up to 460 GB/s Farnell
DSP Slices 9,024 Farnell
Block RAM + UltraRAM 340.9 Mb Farnell
Total RAM Bits 74,344,038 digikey

I/O and Connectivity

Feature Value
User I/O (HP) 624 Farnell
GTY Transceivers (28.12Gb/s) 96 Farnell
Package Type 2892-BBGA, FCBGA digikey
Mounting Type Surface Mount

Electrical and Environmental Specifications

Parameter Specification
Supply Voltage (VCCINT) 0.72V / 0.85V Octopart
Operating Temperature 0°C to +100°C (TJ)
RoHS Status RoHS3 Compliant
Part Status Active

XCVU37P-L2FSVH2892E Applications and Use Cases

Artificial Intelligence and Machine Learning

Virtex UltraScale+ HBM FPGAs provide programmable functionality most suitable for continually evolving machine learning and artificial intelligence architectures. AMD The integrated HBM allows AI inference applications to process large datasets at maximum speed while reducing power requirements.

Data Center and Cloud Computing

Virtex UltraScale+ HBM FPGAs alleviate bandwidth bottlenecks and power consumption associated with using parallel memories like DDR4 in compute, database, and network acceleration applications. AMD

Network Security and Firewall Applications

An HBM implementation using Virtex UltraScale+ FPGAs provides up to 5X higher look-up rate because of HBM bandwidth, and 80X more search entries than commercially available TCAMs. AMD

Video Transcoding and Streaming

Virtex UltraScale+ HBM FPGAs offer a variety of serial interfaces, including 58G PAM4, and form factors to deliver high performance designed for compute-intensive video and image processing applications. AMD

XCVU37P-L2FSVH2892E Speed Grade and Power Options

The Xilinx Virtex UltraScale+ FPGAs are available in -3, -2, -1 speed grades, with -3E devices having the highest performance. FPGAkey The XCVU37P-L2FSVH2892E features the -2L designation, indicating:

The -2LE devices can operate at VCCINT voltage at 0.85V or 0.72V and provide lower maximum static power. When operated at VCCINT = 0.72V, the -2LE performance and static/dynamic power is reduced. FPGAkey

Development Tools and Ecosystem Support

Vivado Design Suite Compatibility

In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use and very user-friendly in synthesis and implementation. FPGAkey The XCVU37P-L2FSVH2892E is fully supported by the complete AMD development ecosystem.

VCU128 Evaluation Kit

The VCU128 evaluation kit is optimized for quickly prototyping applications using Virtex UltraScale+ HBM FPGAs. AMD This kit features:

  • Quad 28.12Gb/s QSFP28 interfaces AMD
  • PCIe Gen3 x16 and Gen4 x8 AMD
  • VITA 57.4 FMC+ interface AMD
  • Multiple external memory interfaces (RLDRAM3, QDR-IV, DDR4) AMD

XCVU37P-L2FSVH2892E Ordering Information

Attribute Detail
Full Part Number XCVU37P-L2FSVH2892E
Manufacturer AMD (formerly Xilinx)
Package 2892-Pin FCBGA
Packaging Tray
Lead-Free Status Lead-Free / RoHS Compliant

Why the XCVU37P-L2FSVH2892E is Ideal for Your Design

The integrated HBM controller and breakthrough integration enable maximum bandwidth, efficient routing and logic utilization, and optimized power efficiency for workloads that process large datasets. AMD Whether you’re developing next-generation AI accelerators, high-performance computing solutions, or advanced networking equipment, the XCVU37P-L2FSVH2892E delivers the performance, memory bandwidth, and flexibility your application demands.

With typical lifespans extending well past 15 years, you can depend on AMD devices for the life of your design—extending AMD UltraScale+ FPGAs and adaptive SoCs through 2045.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.