Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCVU37P-2FSVH2892E: High-Performance Virtex UltraScale+ HBM FPGA

Product Details

The XCVU37P-2FSVH2892E is a cutting-edge Field Programmable Gate Array (FPGA) from the AMD/Xilinx Virtex UltraScale+ HBM family. This system-level semiconductor device features 2852K logic cells, 2607360 CLB flip-flops, and 70.9Mb of RAM. Quarktwin Designed for demanding applications in artificial intelligence, machine learning, and data center acceleration, the XCVU37P contains 8 GB High Bandwidth Memory (HBM) DRAM and offers an ASIC equivalent capacity up to 15 million gates. Design Reuse

If you’re searching for premium Xilinx FPGA solutions, the XCVU37P-2FSVH2892E delivers exceptional performance for bandwidth-intensive computing needs.


XCVU37P-2FSVH2892E Key Features and Benefits

Integrated High Bandwidth Memory (HBM) Technology

The HBM in this FPGA uses silicon stacking technology where FPGA fabric and DRAM are placed next to each other in the same package. This method offers significant improvements in performance and latency compared to external chips soldered on PCBs. Design Reuse

Ultra-High-Speed GTY Transceivers

The module achieves point-to-point speeds of more than 1.4 Gbps single-ended over regular FPGA I/Os and performance of up to 25 Gbps over the multi-gigabit transceivers (GTY). Design Reuse The FPGA provides 64 high speed serial transceivers (MGTs) for high speed interfaces like PCIe Gen3, Gen4, DDR4 memories, QSFP+ or QSFP28. Xilinx

Advanced DSP Processing Capabilities

The DSP slice, with its 96-bit-wide XOR functionality, 27-bit pre-adder, and 30-bit A input, performs numerous independent functions including multiply accumulate, multiply add, and pattern detect. Mouser


XCVU37P-2FSVH2892E Technical Specifications Table

Parameter Specification
Manufacturer AMD / Xilinx
Product Family Virtex UltraScale+ HBM
Part Number XCVU37P-2FSVH2892E
System Logic Cells 2,851,800
CLB Flip-Flops 2,607,360
Block RAM 70.9 Mb
DSP Slices 5,952
HBM Capacity 8 GB
Maximum User I/O 624 (HP)
GTY Transceivers 64
Speed Grade -2 (Mid Speed)
Package Type 2892-FCBGA
Package Dimensions 55mm × 55mm
Ball Pitch 1.0 mm
Mount Type Surface Mount

XCVU37P-2FSVH2892E Electrical Characteristics

Parameter Value
Core Voltage (VCCINT) 0.825V – 0.876V
Temperature Range Extended (0°C to 100°C TJ)
PCIe Support Gen3 x16 / Gen4 Compatible
DDR4 Support Up to 2,666 Mb/s
Compliance RoHS3 Compliant
Part Status Active

XCVU37P-2FSVH2892E Speed Grade Options

The Xilinx Virtex UltraScale+ FPGAs are available in -3, -2, -1 speed grades, with -3E devices having the highest performance. FPGAkey The XCVU37P-2FSVH2892E features the -2 speed grade, providing optimal balance between performance and power consumption.

Speed Grade Performance Level Application Focus
-3E Highest Maximum Performance
-2 Mid (This Device) Balanced Performance
-1 Standard Power Optimized

Target Applications for XCVU37P-2FSVH2892E FPGA

This FPGA addresses ASIC designers who need an extremely efficient and best-performing FPGA-based prototyping solution for AI, Deep Learning, Data Centre, image/video analysis and other bandwidth-intensive applications. Design Reuse

Primary Application Areas

  • Artificial Intelligence & Machine Learning Acceleration
  • High-Performance Computing (HPC)
  • Data Center Workload Optimization
  • Network Packet Processing & 100G Ethernet
  • ASIC Prototyping & Verification
  • Advanced Radar & Signal Processing
  • Video Analytics & Image Processing
  • Financial Trading Systems

XCVU37P-2FSVH2892E Ordering Information

Attribute Detail
Full Part Number XCVU37P-2FSVH2892E
Device XCVU37P
Speed Grade -2
Package Code FSVH
Pin Count 2892
Temperature Grade E (Extended: 0°C to 100°C)

Why Choose the XCVU37P-2FSVH2892E for Your Design?

Up to 38 TOPs (22 TeraMACs) of DSP compute performance are optimized for fixed and floating point compute including INT8 for AI inference. Up to 128 transceivers on a device enable backplane, chip-to-optics, and chip-to-chip applications. AMD

The XCVU37P-2FSVH2892E combines massive parallel processing capability with revolutionary in-package HBM memory, eliminating traditional memory bottlenecks that limit system performance.


Development Tools and Software Support

This FPGA is fully supported by AMD Vivado Design Suite, providing comprehensive design, implementation, and debugging tools. The device is compatible with:

  • Vivado Design Suite (Synthesis & Implementation)
  • Vitis Unified Software Platform
  • VCU128 Evaluation Board for Development

Related Virtex UltraScale+ HBM FPGA Variants

Part Number HBM Capacity Logic Cells GTY Transceivers
XCVU33P 4 GB ~1.3M 32
XCVU35P 8 GB ~1.7M 64
XCVU37P 8 GB ~2.85M 64
XCVU47P 16 GB ~2.85M 64

This product description is optimized for search terms including: XCVU37P-2FSVH2892E, Virtex UltraScale+ FPGA, HBM FPGA, high bandwidth memory FPGA, Xilinx FPGA, AMD FPGA, 2892FCBGA, AI FPGA accelerator, and data center FPGA.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.