Overview of the XCVU37P-1FSVH2892E FPGA
The XCVU37P-1FSVH2892E is a cutting-edge field-programmable gate array (FPGA) from AMD’s Virtex UltraScale+ family, engineered to deliver exceptional performance for demanding applications in data centers, artificial intelligence, machine learning, and high-performance computing. This Xilinx FPGA represents the pinnacle of programmable logic technology, offering unparalleled flexibility and processing power.
Built on advanced 16nm FinFET+ process technology, the XCVU37P-1FSVH2892E provides engineers and system designers with a powerful platform for implementing complex digital circuits and accelerating compute-intensive workloads.
Key Features and Specifications
Core FPGA Specifications
| Specification |
Details |
| Part Number |
XCVU37P-1FSVH2892E |
| Manufacturer |
AMD (formerly Xilinx) |
| Product Family |
Virtex UltraScale+ |
| Logic Cells |
2,851,800 System Logic Cells |
| CLB Flip-Flops |
2,607,360 |
| Block RAM |
70.9 Mb |
| Process Technology |
16nm FinFET+ |
| Speed Grade |
-1 (Standard Performance) |
| Operating Voltage |
0.85V VCCINT |
| Package Type |
2892-Pin FCBGA (Flip Chip Ball Grid Array) |
| I/O Count |
624 User I/O Pins |
Advanced Performance Characteristics
The XCVU37P-1FSVH2892E FPGA delivers exceptional computational capabilities with its massive logic capacity and high-speed interfaces. The -1 speed grade provides balanced performance for a wide range of applications while maintaining optimal power efficiency.
Technical Specifications Table
Electrical and Operating Parameters
| Parameter |
Specification |
| Core Voltage (VCCINT) |
0.85V ±3% |
| Operating Temperature |
0°C to 100°C (Extended Temperature Range) |
| Package |
FSVH2892 (Flip-Chip Fine-Pitch BGA) |
| Total Package Pins |
2892 |
| Logic Elements |
2,851,800 |
| Maximum Frequency |
645 MHz (typical applications) |
| DSP Slices |
Integrated DSP48E2 blocks for signal processing |
| Transceivers |
High-speed GTY transceivers up to 30.5 Gbps |
| PCIe Support |
PCIe Gen3 x16 and Gen4 capable |
Applications and Use Cases
Primary Application Areas
The XCVU37P-1FSVH2892E excels in numerous high-performance computing scenarios:
Data Center Acceleration: The massive logic capacity makes this FPGA ideal for accelerating data center workloads, including database processing, network function virtualization, and computational storage.
Artificial Intelligence and Machine Learning: With extensive DSP resources and high memory bandwidth, the XCVU37P-1FSVH2892E efficiently implements neural network inference and training acceleration.
5G Network Infrastructure: High-speed transceivers and flexible architecture enable advanced beamforming, massive MIMO processing, and fronthaul/backhaul networking applications.
Video Processing and Broadcasting: Supports real-time 8K video encoding/decoding, format conversion, and broadcast-quality signal processing.
Aerospace and Defense Systems: Extended temperature range and high reliability make it suitable for mission-critical applications including radar processing, electronic warfare, and satellite communications.
Memory and Connectivity Features
Memory Architecture
| Memory Type |
Capacity |
| Block RAM |
70.9 Mb total |
| UltraRAM |
Additional embedded memory blocks |
| DDR4 Support |
Up to 2666 MT/s with multiple memory controllers |
| HBM2 Ready |
High Bandwidth Memory interface capability |
High-Speed Interfaces
The XCVU37P-1FSVH2892E provides comprehensive connectivity options:
- GTY Transceivers: Up to 30.5 Gbps per channel for high-bandwidth communications
- PCIe Gen3/Gen4: Direct host interface for acceleration cards
- Ethernet: 100G/400G Ethernet MAC support
- Interlaken: High-performance packet processing interfaces
Design and Development Resources
Software and Tools
Designing with the XCVU37P-1FSVH2892E requires AMD’s Vivado Design Suite, which provides:
- Synthesis and implementation tools optimized for Virtex UltraScale+ devices
- IP integrator for rapid system design
- High-level synthesis (HLS) for C/C++ based development
- Comprehensive debugging and analysis capabilities
Power Considerations
| Power Parameter |
Typical Value |
| Static Power |
Varies with configuration (0.85V operation) |
| Dynamic Power |
Dependent on utilization and clock frequency |
| Recommended Cooling |
Active heatsink with forced airflow |
| Thermal Solution |
Professional thermal management required |
Package and Mounting Information
Physical Characteristics
The FSVH2892 package features:
- Package Size: Ultra-fine pitch ball grid array
- Ball Pitch: 0.8mm for high-density PCB routing
- Mounting: Surface mount technology (SMT)
- PCB Requirements: Minimum 10-layer HDI stackup recommended
- Handling: ESD-sensitive device requiring proper precautions
Comparison with Related Models
XCVU37P Family Variants
| Part Number |
Speed Grade |
Voltage |
Key Difference |
| XCVU37P-1FSVH2892E |
-1 |
0.85V |
Standard performance |
| XCVU37P-2FSVH2892E |
-2 |
0.85V |
Higher speed grade |
| XCVU37P-3FSVH2892E |
-3 |
0.85V |
Maximum performance |
| XCVU37P-L2FSVH2892E |
-2LE |
0.72V/0.85V |
Low-power variant |
Advantages of the XCVU37P-1FSVH2892E
Superior Performance Benefits
Massive Parallel Processing: Nearly 3 million logic cells enable implementation of highly complex algorithms and multiple concurrent processing engines.
Flexible Architecture: Programmable logic allows rapid prototyping, field upgrades, and customization for specific application requirements.
High Bandwidth Connectivity: Extensive high-speed transceiver options support demanding communications and networking applications.
Integrated IP Blocks: Hardened PCIe, Ethernet MAC, and other IP reduce logic utilization and improve performance.
Advanced Security Features: Built-in encryption and authentication protect intellectual property and sensitive data.
Design Considerations and Best Practices
Thermal Management Requirements
The XCVU37P-1FSVH2892E generates significant heat under full utilization. Proper thermal design includes:
- Dedicated heatsink with appropriate thermal interface material
- Forced-air cooling for sustained high-performance operation
- Thermal monitoring and management in firmware
- Adequate PCB thermal vias for heat dissipation
Power Supply Design
Multiple power rails require careful attention:
- VCCINT: Core voltage at 0.85V with tight regulation
- VCCAUX: Auxiliary voltage for I/O and configuration
- VCCO: I/O bank voltages (1.2V to 1.8V depending on standards)
- GTY AVCC/AVTT: Dedicated transceiver power supplies
High-quality voltage regulators with appropriate current capacity and sequencing are essential.
PCB Layout Guidelines
Professional PCB design for the FSVH2892 package requires:
- Controlled impedance routing for high-speed signals
- Differential pair matching for transceivers
- Adequate ground planes and power distribution
- Via-in-pad technology for dense ball grid connections
- Length matching for memory interfaces
Procurement and Availability
Ordering Information
- Manufacturer: AMD (formerly Xilinx)
- Product Status: Active production
- Lead Time: Contact distributors for current availability
- Packaging: Tray packaging standard
- Minimum Order: Typically single unit available from authorized distributors
- RoHS Compliance: RoHS3 compliant
Quality and Reliability
The XCVU37P-1FSVH2892E meets stringent quality standards:
- Extended temperature range testing
- Comprehensive device characterization
- Long-term reliability qualifications
- Full traceability for production lots
Support and Documentation
Available Resources
AMD provides extensive documentation and support:
- Detailed datasheet with electrical specifications
- User guide for Virtex UltraScale+ architecture
- PCB design guidelines
- Power estimation tools
- Reference designs and application notes
- Technical support through AMD forums and FAE network
Conclusion: Industry-Leading FPGA Solution
The XCVU37P-1FSVH2892E represents cutting-edge FPGA technology from AMD’s Virtex UltraScale+ portfolio. With nearly 3 million logic cells, extensive high-speed connectivity, and advanced features for AI/ML acceleration, this device addresses the most demanding applications in data centers, communications infrastructure, aerospace, and advanced computing.
Whether implementing complex signal processing algorithms, accelerating machine learning inference, or building next-generation network equipment, the XCVU37P-1FSVH2892E provides the performance, flexibility, and scalability required for tomorrow’s innovations.
For applications requiring the highest levels of programmable logic performance combined with comprehensive connectivity options, the XCVU37P-1FSVH2892E stands as an excellent choice for professional engineers and system architects developing advanced electronic systems.
Keywords: XCVU37P-1FSVH2892E, Virtex UltraScale+ FPGA, AMD Xilinx FPGA, high-performance FPGA, 2892-pin FCBGA, data center acceleration, AI FPGA, machine learning FPGA, 16nm FPGA, programmable logic device
