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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCVU35P-L2FSVH2892E: AMD Virtex UltraScale+ HBM FPGA with High Bandwidth Memory

Product Details

The XCVU35P-L2FSVH2892E is a high-performance Field Programmable Gate Array (FPGA) from AMD’s Virtex UltraScale+ HBM family. This advanced integrated circuit combines powerful programmable logic with revolutionary High Bandwidth Memory (HBM) technology, making it an ideal solution for AI inference, data center acceleration, and high-speed networking applications.

Product Overview: XCVU35P-L2FSVH2892E FPGA IC

The XCVU35P-L2FSVH2892E is an IC FPGA featuring 416 I/O pins in a 2892-FCBGA package. Microchip This device belongs to the Virtex UltraScale+ product family DigiKey and represents AMD’s commitment to delivering cutting-edge programmable solutions for demanding applications.

AMD Virtex UltraScale+ HBM FPGAs provide the highest on-chip memory density with up to 500 Mb of total on-chip integrated memory, plus up to 16 GB of high-bandwidth memory (HBM) Gen2 integrated in-package for 460 GB/s of memory bandwidth. AMD

Key Technical Specifications

General Information

Parameter Value
Manufacturer AMD (formerly Xilinx)
Part Number XCVU35P-L2FSVH2892E
Product Series Virtex UltraScale+ HBM
Product Category Embedded FPGA
RoHS Status ROHS3 Compliant
Product Status Active

Electrical Characteristics

Specification Details
Number of I/Os 416
Logic Elements/Cells 1,906,800
Supply Voltage 0.698V ~ 0.742V
Operating Temperature 0°C ~ 100°C (TJ)
Process Technology 16nm FinFET

Package Information

Package Attribute Specification
Package Type 2892-BBGA, FCBGA
Mounting Type Surface Mount
Packaging Tray
Pin Count 2892

Advanced HBM Technology Features

The integrated HBM allows AI inference applications to process large datasets at maximum speed while reducing power requirements. AMD The XCVU35P-L2FSVH2892E leverages AMD’s innovative chip-on-wafer-on-substrate (CoWoS) technology to achieve unprecedented memory bandwidth.

Memory Performance Advantages

460 GB/s of HBM bandwidth delivers 20X more bandwidth than a DDR4 DIMM. AMD This massive bandwidth improvement enables engineers to tackle previously impossible computational challenges.

An integrated HBM controller and switch reduce logic size by 250 K LUTs and minimize R&D time. AMD

Target Applications for XCVU35P-L2FSVH2892E

Artificial Intelligence and Machine Learning

Virtex UltraScale+ HBM FPGAs provide programmable functionality that is most suitable for the continually evolving machine learning (ML) / artificial intelligence (AI) architectures. AMD The device can store and access entire AI models without requiring external memory access.

Data Center Acceleration

Virtex UltraScale+ FPGAs serve as a scalable, reconfigurable acceleration platform that can be optimized for complex workloads. AMD The massive compute capability makes these devices ideal for virtualized software applications requiring dynamic throughput adjustments.

Video Processing and Transcoding

FPGA-based video acceleration simplifies infrastructure and helps users to deliver stable, latency critical services on a budget. AMD The XCVU35P-L2FSVH2892E supports high-performance video and image processing applications with various serial interfaces.

Network Security and Acceleration

An implementation using a Virtex UltraScale+ HBM FPGA with HBM stacks provides up to a 5X higher look-up rate because of HBM bandwidth, and 80X more search entries than commercially available TCAMs. AMD

5G Wireless Infrastructure

Flexible hardware acceleration, low latency operation, high-speed switching capability are critical in 5G baseband. Virtex UltraScale FPGAs offers dynamic and scalable solutions for evolving 5G infrastructure. AMD

Test and Measurement Equipment

With massive DSP bandwidth and high transceiver count, Virtex UltraScale+ FPGAs offer high-performance data handling and analysis for network/protocol analyzers, signal generators, and wired communication testers. AMD

Speed Grade and Power Optimization

The -2LE devices can operate at a VCCINT voltage at 0.85V or 0.72V and provide lower maximum static power. FPGAkey The “L2” designation in XCVU35P-L2FSVH2892E indicates specific speed and power characteristics optimized for particular use cases.

DC and AC characteristics are specified in extended (E), industrial (I), and military (M) temperature ranges. FPGAkey

Design Benefits and Integration

By eliminating I/O to external packaged memories and providing massive on-chip memory, these FPGAs enable small footprint system design without compromising performance. AMD

PCB Design Simplification

The integrated HBM architecture offers significant advantages for board-level design. An HBM implementation enjoys a simpler and lower risk design flow by simplifying the PCB and decreasing the memory subsystem complexity. AMD

Development Tools and Software Support

In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation. FPGAkey Engineers can leverage comprehensive IP cores, reference designs, and board support packages to accelerate development.

Available Resources

  • Vivado Design Suite development environment
  • Pre-verified IP cores
  • Reference designs for common applications
  • Comprehensive datasheets and user guides
  • Technical support documentation

Product Longevity and Reliability

With typical lifespans extending well past 15 years, you can depend on AMD devices for the life of your design—extending AMD UltraScale+ FPGAs and adaptive SoCs through 2045. AMD

Related Products and Family Members

The XCVU35P belongs to a broader family of Virtex UltraScale+ HBM devices. Other variants include different speed grades (-1, -2, -3) and package options to meet diverse application requirements.

Why Choose the XCVU35P-L2FSVH2892E?

This Xilinx FPGA delivers exceptional value for applications demanding high memory bandwidth, massive parallel processing capability, and flexible programmability. The combination of 16nm FinFET process technology, integrated HBM, and extensive I/O options makes the XCVU35P-L2FSVH2892E a premier choice for next-generation system designs.

Order Information Summary

Order Detail Information
Part Number XCVU35P-L2FSVH2892E
Manufacturer AMD
Package 2892-FCBGA
Lead Time Contact distributor
Minimum Order Contact distributor

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Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.