The XCVU35P-3FSVH2892E is a flagship Xilinx FPGA from AMD’s Virtex UltraScale+ HBM family. This high-bandwidth memory FPGA delivers exceptional computational performance with integrated HBM Gen2 technology, making it ideal for AI inference, data center acceleration, and high-performance computing applications. Built on advanced 16nm FinFET process technology, this device offers the fastest speed grade (-3) available in the XCVU35P series.
XCVU35P-3FSVH2892E Key Features and Benefits
The XCVU35P-3FSVH2892E stands out as one of the most powerful programmable logic devices on the market. It combines massive logic resources with revolutionary in-package high-bandwidth memory, eliminating traditional DDR memory bottlenecks while reducing system complexity and power consumption.
Why Choose the XCVU35P-3FSVH2892E?
This Virtex UltraScale+ HBM FPGA provides several advantages over competing solutions. First, the integrated HBM delivers 460 GB/s of memory bandwidth—approximately 20X more bandwidth than a standard DDR4 DIMM. Additionally, extended AXI ports and an integrated port switch enable any-port-to-any-address access, simplifying design implementation while maximizing usable bandwidth.
XCVU35P-3FSVH2892E Technical Specifications
General Device Information
| Parameter |
Value |
| Manufacturer |
AMD (formerly Xilinx) |
| Part Number |
XCVU35P-3FSVH2892E |
| Product Family |
Virtex UltraScale+ HBM FPGA |
| Device Type |
Field Programmable Gate Array (FPGA) IC |
| Speed Grade |
-3 (Highest Performance) |
| Process Technology |
16nm FinFET |
| Package Type |
2892-Pin FCBGA (Flip-Chip Ball Grid Array) |
| Operating Temperature |
Extended Range (-40°C to +100°C) |
Logic Resources
| Resource |
Specification |
| Logic Cells |
1,906,800 |
| Logic Elements |
1,566,600 |
| Configurable Logic Blocks (CLBs) |
89,520 |
| LABs/CLBs |
108,960 |
| Look-Up Tables (LUTs) |
6-Input Advanced LUTs |
| User I/O Pins |
416 |
Memory Architecture
| Memory Type |
Capacity |
| Total On-Chip RAM Bits |
49,597,645 |
| High Bandwidth Memory (HBM) |
Up to 16 GB HBM Gen2 |
| HBM Memory Bandwidth |
460 GB/s |
| Block RAM |
36 Kb blocks with built-in FIFO and ECC |
| UltraRAM |
4Kx72 blocks for large data buffering |
| Distributed RAM |
Configurable within CLBs |
DSP and Signal Processing
| Feature |
Description |
| DSP Slices |
High-performance 27×18 multiplier blocks |
| DSP Functionality |
96-bit XOR, 27-bit pre-adder, 30-bit A input |
| Operations Supported |
Multiply-accumulate, multiply-add, pattern detect |
| Peak Performance |
Up to 28 TOPS (INT8) for AI workloads |
XCVU35P-3FSVH2892E Package Information
Physical Specifications
| Attribute |
Details |
| Package Style |
FCBGA (Flip-Chip Ball Grid Array) |
| Pin Count |
2892 |
| Package Designation |
FSVH2892 |
| Mounting Type |
Surface Mount |
| RoHS Compliance |
Yes |
High Bandwidth Memory (HBM) Technology Overview
Revolutionary In-Package Memory Integration
The XCVU35P-3FSVH2892E utilizes AMD’s chip-on-wafer-on-substrate (CoWoS) packaging technology to integrate HBM directly with the FPGA die. This approach enables thousands of signal connections between the FPGA logic and HBM stacks, delivering unprecedented memory bandwidth within a single package.
HBM Advantages Over Traditional DDR Memory
| Comparison |
HBM (XCVU35P) |
Traditional DDR4 |
| Memory Bandwidth |
460 GB/s |
~25 GB/s per DIMM |
| PCB Complexity |
Simplified |
Complex routing required |
| Power Consumption |
Optimized |
Higher |
| Form Factor |
Compact |
Requires multiple DIMMs |
| Design Risk |
Lower |
Higher |
XCVU35P-3FSVH2892E Target Applications
Data Center and Cloud Computing
This Virtex UltraScale+ HBM FPGA excels in data center environments where workloads require optimization for throughput, latency, and power efficiency. Common deployments include network processing, storage acceleration, database acceleration, and virtualized software applications.
Artificial Intelligence and Machine Learning
The XCVU35P-3FSVH2892E provides programmable functionality suited for continually evolving ML/AI architectures. The integrated HBM allows AI inference applications to process large datasets at maximum speed while storing entire models on-chip without external memory access.
Video Processing and Streaming
For video transcoding and streaming applications, this FPGA delivers stable, latency-critical services through compute-intensive video and image processing. Service providers benefit from simplified infrastructure while maintaining high-quality output.
Network Security Applications
Network and security applications benefit significantly from HBM integration. Implementations using the XCVU35P-3FSVH2892E provide up to 5X higher look-up rates compared to traditional solutions, enabling 80X more search entries than commercial TCAMs.
Application Summary Table
| Application |
Key Benefit |
| AI/ML Inference |
Process entire models on-chip |
| Data Analytics |
High-throughput query processing |
| Video Transcoding |
Low-latency, high-quality encoding |
| Network Acceleration |
5X higher look-up rates |
| Database Acceleration |
Fast lookup, query, and compression |
| 5G Infrastructure |
Flexible, scalable baseband processing |
| Aerospace & Defense |
High-performance radar signal processing |
Speed Grade and Performance Options
The XCVU35P family offers three speed grades to match different performance requirements:
| Speed Grade |
Performance Level |
Part Number Example |
| -3 |
Highest Performance |
XCVU35P-3FSVH2892E |
| -2 |
Mid-Range Performance |
XCVU35P-2FSVH2892E |
| -1 |
Standard Performance |
XCVU35P-1FSVH2892E |
The -3 speed grade (featured in XCVU35P-3FSVH2892E) provides the fastest timing characteristics, making it ideal for performance-critical applications.
Operating Conditions and Reliability
Temperature Range Options
| Grade |
Temperature Range |
Designation |
| Extended |
-40°C to +100°C |
E suffix |
| Industrial |
-40°C to +100°C |
I suffix |
| Military |
-55°C to +125°C |
M suffix |
Voltage Specifications
| Parameter |
Value |
| Core Voltage (VCCINT) |
0.85V typical |
| Low Power Option |
0.72V (for -2LE devices) |
Development Tools and Design Resources
Software Support
The XCVU35P-3FSVH2892E is fully supported by AMD’s comprehensive development ecosystem, including Vivado Design Suite for synthesis and implementation, Vitis unified software platform for accelerated application development, pre-verified IP cores, and extensive reference designs.
Documentation Available
| Document Type |
Content |
| Datasheet |
Complete electrical and mechanical specifications |
| User Guide |
Design and implementation guidance |
| Product Brief |
Feature overview and benefits |
| Selection Guide |
Comparison with other Virtex UltraScale+ devices |
| Pin Assignment Guide |
Detailed pinout configuration |
XCVU35P-3FSVH2892E Ordering Information
| Attribute |
Information |
| Full Part Number |
XCVU35P-3FSVH2892E |
| Manufacturer |
AMD |
| Product Status |
Active |
| Lead Time |
Contact distributor |
| Packaging |
Tray |
Frequently Asked Questions About XCVU35P-3FSVH2892E
What is the XCVU35P-3FSVH2892E used for?
The XCVU35P-3FSVH2892E is designed for high-performance applications requiring massive memory bandwidth and computational power. These include AI inference, video transcoding, network acceleration, database processing, and data center workloads.
What makes HBM FPGAs different from standard FPGAs?
HBM (High Bandwidth Memory) FPGAs integrate memory stacks directly into the package alongside the FPGA die. This provides 20X more bandwidth than traditional DDR4 memory while simplifying PCB design and reducing power consumption.
What development tools support the XCVU35P-3FSVH2892E?
AMD’s Vivado Design Suite serves as the primary development environment. The Vitis unified software platform provides additional acceleration development capabilities, while extensive IP cores and reference designs help accelerate time-to-market.
What is the difference between -3, -2, and -1 speed grades?
The -3 speed grade offers the highest performance with the fastest timing specifications. The -2 grade provides mid-range performance, while -1 delivers standard performance at potentially lower cost.
Summary
The XCVU35P-3FSVH2892E represents the pinnacle of AMD’s Virtex UltraScale+ HBM FPGA technology. With 1.9 million logic cells, 460 GB/s HBM bandwidth, and the fastest -3 speed grade, this device delivers unmatched performance for demanding data center, AI, and high-performance computing applications. The 2892-pin FCBGA package provides 416 user I/O pins while maintaining an extended operating temperature range suitable for industrial deployments.
