Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCVU35P-2FSVH2892E: AMD Xilinx Virtex UltraScale+ HBM FPGA | Complete Specifications & Features

Product Details

The XCVU35P-2FSVH2892E is a high-performance Field Programmable Gate Array (FPGA) from AMD’s Virtex UltraScale+ HBM family. This advanced Xilinx FPGA delivers exceptional compute capabilities with integrated High Bandwidth Memory (HBM), making it ideal for data-intensive applications including artificial intelligence, machine learning, 5G infrastructure, and high-speed networking.

XCVU35P-2FSVH2892E Product Overview

The XCVU35P-2FSVH2892E belongs to AMD’s flagship 16nm FinFET FPGA series, combining massive logic resources with revolutionary in-package HBM technology. This device eliminates external memory bottlenecks while delivering 460 GB/s of memory bandwidth—20X more than traditional DDR4 DIMMs.

Key Features of the XCVU35P-2FSVH2892E FPGA

The XCVU35P-2FSVH2892E integrates cutting-edge technologies that enable breakthrough performance for compute-intensive workloads. The device features 8GB of integrated HBM Gen2 memory, providing unprecedented memory bandwidth without requiring external memory components on your PCB design.

XCVU35P-2FSVH2892E Technical Specifications

Logic Resources

Parameter Specification
System Logic Cells 1,906,800
CLB Flip-Flops 1,743,000
CLB Look-Up Tables (LUTs) 872,000
Configurable Logic Blocks (CLBs) 89,520

Memory Resources

Memory Type Capacity
HBM DRAM (Integrated) 8 GB
HBM Bandwidth 460 GB/s
Block RAM 47.3 Mb
UltraRAM 180.0 Mb
Distributed RAM (Max) 24.6 Mb
Total On-Chip Memory ~250 Mb

DSP and Computing Performance

Parameter Value
DSP Slices 5,952
Peak INT8 Performance 18.6 TOP/s
Peak DSP Compute ~21 TeraMACs
HBM AXI Interfaces 32

Package and Electrical Specifications

Specification Details
Part Number XCVU35P-2FSVH2892E
Package Type 2892-Ball FCBGA
Ball Pitch 1.0 mm
Speed Grade -2 (Standard Performance)
Temperature Range Extended (0°C to 100°C Tj)
Supply Voltage (VCCINT) 0.85V
Process Technology 16nm FinFET
Mounting Type Surface Mount
RoHS Status Compliant

I/O and Connectivity

Feature Specification
Maximum User I/O 416
Clock Management Tiles (CMTs) 8
PCIe Gen3 x16 Support Yes
CCIX Support Yes
100G Ethernet MAC Yes
DDR4 Support Up to 2,666 Mb/s

XCVU35P-2FSVH2892E Part Number Decoder

Understanding the part number helps identify the exact device configuration:

Code Meaning
XC Xilinx Commercial
VU35P Virtex UltraScale+ 35P (HBM variant)
-2 Speed Grade 2
F Flip-chip package
SV Package variant
H2892 2892-ball package
E Extended temperature range

XCVU35P-2FSVH2892E Applications

Artificial Intelligence and Machine Learning

The XCVU35P-2FSVH2892E excels in AI inference applications where large neural network models require high memory bandwidth. The integrated 8GB HBM allows entire models to be stored on-chip, eliminating memory access bottlenecks and reducing inference latency.

Data Center Acceleration

With 18.6 TOP/s of INT8 compute performance, this FPGA accelerates workloads including video transcoding, database acceleration, and search applications. The massive HBM bandwidth enables efficient processing of large datasets.

5G and Telecommunications Infrastructure

The combination of high DSP count and memory bandwidth makes the XCVU35P-2FSVH2892E suitable for 5G baseband processing, massive MIMO implementations, and high-capacity networking equipment requiring 100G+ throughput.

Network Security and Firewall Applications

Next-generation firewalls benefit from the FPGA’s ability to perform deep packet inspection at wire speed. The HBM provides sufficient bandwidth for large rule tables and session tracking databases.

High-Performance Computing

Scientific computing, financial modeling, and genomics applications leverage the device’s parallel processing capabilities and high memory bandwidth for accelerated computation.

XCVU35P-2FSVH2892E Development Tools and Support

Vivado Design Suite

AMD’s Vivado Design Suite provides comprehensive development support for the XCVU35P-2FSVH2892E, including synthesis, implementation, and debugging capabilities optimized for UltraScale+ architecture.

IP Core Library

A comprehensive library of pre-verified IP cores accelerates development, including HBM controllers, PCIe interfaces, Ethernet MACs, and DSP building blocks.

Evaluation Platforms

The VCU128 evaluation board provides a ready-to-use platform for prototyping and development with the Virtex UltraScale+ HBM FPGA family.

XCVU35P-2FSVH2892E vs. Alternative Devices

Within the VU35P Family

Part Number Speed Grade Temperature Package
XCVU35P-1FSVH2892E -1 (Lower) Extended 2892-FCBGA
XCVU35P-2FSVH2892E -2 (Standard) Extended 2892-FCBGA
XCVU35P-3FSVH2892E -3 (Highest) Extended 2892-FCBGA
XCVU35P-L2FSVH2892E -2LE (Low Power) Extended 2892-FCBGA

Virtex UltraScale+ HBM Family Comparison

Device Logic Cells HBM Capacity DSP Slices
VU31P 962,000 4 GB 2,880
VU33P 962,000 8 GB 2,880
VU35P 1,906,800 8 GB 5,952
VU37P 2,852,000 8 GB 9,024
VU45P 1,906,800 16 GB 5,952

Why Choose the XCVU35P-2FSVH2892E

The XCVU35P-2FSVH2892E offers an optimal balance of performance, memory capacity, and power efficiency for applications requiring substantial compute resources with high memory bandwidth. The -2 speed grade provides excellent performance for most applications while maintaining reasonable power consumption.

Key Advantages

The integrated HBM eliminates PCB complexity associated with external memory interfaces, reducing board space, power consumption, and design risk. The 460 GB/s memory bandwidth enables processing of massive datasets without external memory bottlenecks.

Design Considerations

When implementing the XCVU35P-2FSVH2892E, engineers should consider power supply requirements, thermal management for the 2892-ball package, and signal integrity for high-speed I/O interfaces. AMD provides comprehensive PCB design guidelines in UG583.

XCVU35P-2FSVH2892E Availability and Ordering

The XCVU35P-2FSVH2892E is available through authorized AMD distributors worldwide. Due to the advanced technology and manufacturing complexity, lead times may vary. Contact your distributor for current stock availability and pricing information.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.