Overview of the XCVU35P-1FSVH2104E FPGA
The XCVU35P-1FSVH2104E is a premium-grade Field Programmable Gate Array (FPGA) from AMD’s Virtex UltraScale+ family. This advanced integrated circuit delivers exceptional performance for data center acceleration, high-performance computing, networking infrastructure, and signal processing applications. With nearly 2 million logic cells and extensive memory resources, the XCVU35P-1FSVH2104E stands as one of the most powerful programmable devices available for engineers requiring maximum computational throughput.
As a leading Xilinx FPGA solution now under AMD’s portfolio, this device combines cutting-edge 16nm FinFET+ process technology with advanced architecture to deliver unmatched performance-per-watt efficiency.
Key Features of XCVU35P-1FSVH2104E
Massive Logic Resources
The XCVU35P-1FSVH2104E provides engineers with an impressive array of programmable logic resources designed for complex system implementations. The device includes over 108,000 Configurable Logic Blocks (CLBs) containing approximately 1.9 million logic cells. This substantial logic density enables implementation of sophisticated algorithms, multiple processing pipelines, and complex state machines within a single device.
High-Bandwidth Memory Integration
One of the standout features of the XCVU35P-1FSVH2104E is its support for High Bandwidth Memory (HBM2) technology. This capability allows the FPGA to achieve memory bandwidth exceeding 400 GB/s, making it ideal for memory-intensive applications such as machine learning inference, video transcoding, and financial computing.
Advanced I/O Capabilities
With 416 user-configurable I/O pins, the XCVU35P-1FSVH2104E offers extensive connectivity options for interfacing with external systems, memories, and peripherals. The device supports multiple I/O standards and high-speed serial transceivers for maximum design flexibility.
Technical Specifications
General Specifications
| Parameter |
Value |
| Manufacturer |
AMD (formerly Xilinx) |
| Part Number |
XCVU35P-1FSVH2104E |
| Series |
Virtex UltraScale+ |
| Device Family |
VU35P |
| Process Technology |
16nm FinFET+ |
| Speed Grade |
-1 (Standard) |
Logic Resources
| Resource |
Quantity |
| System Logic Cells |
1,906,800 |
| CLBs (Configurable Logic Blocks) |
108,960 |
| Total RAM Bits |
49,597,645 |
| DSP Slices |
2,880 |
Electrical Characteristics
| Parameter |
Specification |
| Core Voltage (VCCINT) |
0.825V ~ 0.876V |
| Operating Temperature |
0°C to 100°C (TJ) |
| Temperature Grade |
Industrial |
Package Information
| Attribute |
Details |
| Package Type |
2104-FCBGA |
| Package Dimensions |
47.5mm × 47.5mm |
| Ball Count |
2104 |
| User I/O Pins |
416 |
| Mounting Type |
Surface Mount |
Applications for XCVU35P-1FSVH2104E
Data Center Acceleration
The XCVU35P-1FSVH2104E excels in data center environments where computational acceleration is critical. Its combination of high logic density and HBM2 support makes it perfect for accelerating database queries, search algorithms, and data analytics workloads.
Network Infrastructure
Telecommunications and networking equipment manufacturers utilize the XCVU35P-1FSVH2104E for implementing high-speed packet processing, encryption/decryption engines, and network protocol handling. The device’s substantial I/O count and high-speed transceiver support enable line-rate processing at 100G and beyond.
Machine Learning and AI Inference
The massive parallel processing capability of the XCVU35P-1FSVH2104E makes it an excellent choice for deploying neural network inference engines. The combination of DSP slices, distributed memory, and external HBM2 bandwidth supports efficient implementation of CNN, RNN, and transformer-based models.
Aerospace and Defense Systems
With its industrial temperature rating and robust design, the XCVU35P-1FSVH2104E serves critical roles in radar signal processing, electronic warfare systems, and secure communications equipment.
Part Number Breakdown
Understanding the XCVU35P-1FSVH2104E part number helps identify device specifications:
| Segment |
Meaning |
| XC |
Xilinx Commercial Grade |
| VU |
Virtex UltraScale |
| 35P |
Device Size with HBM Support |
| -1 |
Speed Grade (Standard Performance) |
| F |
Flip-Chip Package |
| SV |
Silicon Version |
| H2104 |
2104-Ball Package |
| E |
Lead-Free/RoHS Compliant |
Design Considerations
Power Supply Requirements
Proper power supply design is essential for reliable XCVU35P-1FSVH2104E operation. Engineers must provide stable voltage rails within the specified 0.825V to 0.876V range for the core supply. Multi-rail power sequencing must follow AMD’s recommended guidelines to prevent device damage.
Thermal Management
Given the device’s power consumption in demanding applications, adequate thermal management solutions are necessary. Heat sinks, thermal interface materials, and potentially active cooling should be incorporated into the system design.
PCB Design Guidelines
The 2104-ball FCBGA package requires careful PCB stackup design with appropriate layer count for signal routing, power distribution, and impedance control. High-speed signal integrity analysis is recommended for critical interfaces.
Ordering Information
| Description |
Part Number |
| Standard Device |
XCVU35P-1FSVH2104E |
| Extended Temperature |
XCVU35P-1FSVH2104I |
| Higher Speed Grade |
XCVU35P-2FSVH2104E |
Related Products and Alternatives
Engineers evaluating the XCVU35P-1FSVH2104E may also consider these related devices from the Virtex UltraScale+ family:
| Part Number |
Logic Cells |
Key Difference |
| XCVU33P |
1,245,000 |
Lower density, cost-optimized |
| XCVU37P |
2,852,000 |
Higher density version |
| XCVU47P |
2,852,000 |
Maximum HBM capacity |
Summary
The XCVU35P-1FSVH2104E represents a powerful solution for engineers requiring maximum FPGA performance. With its 1.9 million logic cells, extensive memory resources, HBM2 support, and 416 I/O pins, this AMD Virtex UltraScale+ device delivers the computational capability needed for today’s most demanding applications. From data center acceleration to aerospace systems, the XCVU35P-1FSVH2104E provides the flexibility and performance that modern designs require.
