The XCVU33P-3FSVH2104E is a premium field-programmable gate array (FPGA) from AMD’s Virtex UltraScale+ family, engineered to deliver exceptional processing power for demanding applications in data centers, telecommunications, aerospace, and high-performance computing. This advanced FPGA combines cutting-edge FinFET technology with massive logic capacity to accelerate complex computational workloads.
Overview: Enterprise-Grade FPGA Performance
The XCVU33P-3FSVH2104E represents the pinnacle of Xilinx FPGA technology, offering designers and engineers a powerful platform for implementing sophisticated digital logic, signal processing, and data acceleration solutions. Built on advanced 20nm process technology, this device delivers three times the system-level performance per watt compared to previous-generation FPGAs.
Key Technical Specifications
| Specification |
Value |
| Part Number |
XCVU33P-3FSVH2104E |
| Manufacturer |
AMD (formerly Xilinx) |
| Product Family |
Virtex UltraScale+ |
| Logic Cells/Elements |
961,800 |
| LABs/CLBs |
54,960 |
| I/O Count |
208 |
| Package Type |
2104-FCBGA (Flip-Chip Ball Grid Array) |
| Speed Grade |
-3 (Highest Performance) |
| Operating Voltage |
0.825V to 0.876V (VCCINT) |
| Operating Frequency |
Up to 600MHz |
| Temperature Range |
0°C to 100°C (Commercial/Extended) |
| RoHS Compliance |
RoHS3 Compliant |
| Product Status |
Active Production |
Advanced Architecture Features
UltraScale+ Architecture Benefits
The Virtex UltraScale+ architecture delivers breakthrough performance through several key innovations:
- FinFET Process Technology: Advanced 20nm FinFET manufacturing provides superior power efficiency and performance density
- High-Speed Transceivers: Industry-leading transceiver bandwidth for multi-gigabit data transmission
- Enhanced DSP Capabilities: Highest digital signal processing count in the UltraScale architecture family
- Flexible Memory Options: On-chip and in-package memory configurations for maximum bandwidth
Processing Power and Capacity
| Feature |
Specification |
| Total Logic Elements |
961,800 cells |
| Configurable Logic Blocks |
54,960 CLBs |
| DSP Slices |
Extensive DSP48E2 blocks |
| Block RAM |
High-density embedded memory |
| UltraRAM |
Additional deep memory storage |
| Maximum I/O Pins |
208 user I/O |
Performance Characteristics
Speed Grade -3 Excellence
The XCVU33P-3FSVH2104E features the -3 speed grade designation, indicating the highest performance tier available in the Virtex UltraScale+ lineup. This speed grade enables:
- Maximum operating frequencies up to 600MHz
- Optimized timing characteristics for critical path performance
- Reduced propagation delays across logic elements
- Enhanced routing resources for complex designs
Power Efficiency Options
Power management capabilities include:
- Standard voltage operation at 0.85V VCCINT
- Balanced performance-to-power ratio
- Dynamic power scaling capabilities
- Advanced clock gating and power islands
Target Applications
High-Performance Computing
The XCVU33P-3FSVH2104E excels in demanding HPC environments:
- Machine Learning and AI: Accelerate neural network inference and training workloads
- Scientific Computing: Complex mathematical modeling and simulation
- Financial Analytics: High-frequency trading algorithms and risk analysis
- Computational Genomics: DNA sequencing and bioinformatics processing
Networking and Telecommunications
| Application Area |
Benefits |
| Data Center Infrastructure |
1+ Tb/s networking capabilities |
| Smart Network Interface Cards |
Hardware acceleration for packet processing |
| 5G/6G Wireless Systems |
Baseband processing and beamforming |
| Software-Defined Networking |
Flexible protocol implementation |
Aerospace and Defense
Advanced capabilities for mission-critical systems:
- Radar signal processing and phased array control
- Electronic warfare systems
- Software-defined radio platforms
- Satellite communications equipment
Test and Measurement
Professional instrumentation applications:
- High-speed data acquisition systems
- Protocol analyzers and logic analyzers
- Arbitrary waveform generators
- Real-time signal analysis equipment
Package and Integration Details
FCBGA Package Specifications
| Package Feature |
Description |
| Package Style |
2104-pin Flip-Chip Ball Grid Array |
| Package Code |
FSVH2104 |
| Thermal Performance |
Optimized for high-power dissipation |
| PCB Requirements |
Advanced multi-layer design with controlled impedance |
| Ball Pitch |
High-density interconnect spacing |
Thermal Management Requirements
The XCVU33P-3FSVH2104E requires robust thermal solutions:
- Heat sink attachment provisions included
- Junction temperature range: 0°C to 100°C
- Recommended thermal interface materials for optimal heat transfer
- Airflow considerations for forced convection cooling
Development Tools and Software Support
Vivado Design Suite Compatibility
The XCVU33P-3FSVH2104E is fully supported by AMD’s comprehensive development ecosystem:
- Vivado Design Suite: Industry-leading synthesis and implementation tools
- Vitis Unified Software Platform: High-level application development environment
- IP Integrator: Graphical block diagram design interface
- ChipScope Pro: Real-time in-system debugging capabilities
Programming and Configuration
| Configuration Method |
Description |
| JTAG Interface |
Standard boundary-scan programming |
| SelectMAP |
High-speed parallel configuration |
| Serial Flash |
Boot from external SPI/BPI memory |
| Processor-Based |
Microcontroller-driven configuration |
Comparison with Related Variants
Speed Grade Comparison
The Virtex UltraScale+ family offers multiple speed grades:
- -1 Speed Grade: Balanced performance and power consumption
- -2 Speed Grade: Enhanced performance with moderate power increase
- -3 Speed Grade (XCVU33P-3FSVH2104E): Maximum performance tier
- -2LE Grade: Low-power option with reduced VCCINT voltage
Logic Density Options
| Part Variant |
Logic Cells |
Typical Use Case |
| XCVU13P |
~320K cells |
Mid-range applications |
| XCVU23P |
~640K cells |
High-performance computing |
| XCVU33P |
~962K cells |
Premium enterprise solutions |
| XCVU37P |
~1,143K cells |
Maximum capacity requirements |
Quality and Reliability Standards
Manufacturing Excellence
The XCVU33P-3FSVH2104E meets stringent quality requirements:
- Manufactured in ISO-certified facilities
- Comprehensive electrical and functional testing
- RoHS3 compliant for environmental responsibility
- Extended temperature range qualification available
Reliability Metrics
| Reliability Factor |
Specification |
| MTBF |
Exceeds industry standards for commercial FPGAs |
| Operating Lifetime |
10+ years under specified conditions |
| ESD Protection |
Human Body Model (HBM) rated |
| Latch-Up Immunity |
JEDEC compliant |
Ordering and Availability Information
Part Number Breakdown
Understanding the XCVU33P-3FSVH2104E designation:
- XC: Xilinx/AMD commercial family
- VU33P: Virtex UltraScale+ with 33P density
- -3: Speed grade (highest performance)
- F: Flip-chip package technology
- SVH2104: Specific package variant with 2104 balls
- E: Extended temperature range option
Supply Chain Considerations
Current market status:
- Production Status: Active and in production
- Lead Time: Varies by distributor and quantity
- Availability: Standard stock at major distributors including Digi-Key
- MOQ Requirements: Typically sold individually or in small quantities
- Package Options: Tray packaging for bulk orders
Technical Support Resources
Documentation and Datasheets
Comprehensive technical documentation available:
- Virtex UltraScale+ family datasheet with complete electrical specifications
- Package mechanical drawings and land pattern recommendations
- Application notes for power supply design and thermal management
- Reference designs for common applications
Design Assistance
AMD provides extensive support resources:
- Online technical forums and community support
- Application engineering assistance for complex designs
- Training webinars and certification programs
- University partnership programs for academic development
Frequently Asked Questions
Q: What is the difference between -2 and -3 speed grades?
The -3 speed grade offers approximately 15-20% better performance with tighter timing specifications compared to the -2 grade, enabling higher operating frequencies for critical paths.
Q: Can I use existing Virtex-7 designs with the XCVU33P?
While not pin-compatible, designs can be migrated using Vivado’s migration tools. The UltraScale+ architecture offers significant performance improvements but may require design optimization.
Q: What PCB layer count is recommended?
High-density FPGAs like the XCVU33P-3FSVH2104E typically require 12-20 layer PCBs with multiple power planes for optimal signal integrity and power delivery.
Q: Is development board available for prototyping?
AMD and third-party vendors offer evaluation boards featuring the XCVU33P family. Contact distributors for current availability and pricing.
Conclusion: Premium FPGA Solution for Demanding Applications
The XCVU33P-3FSVH2104E stands as a premier choice for engineers developing next-generation systems requiring exceptional computational power, flexibility, and performance. With nearly one million logic cells, advanced UltraScale+ architecture, and comprehensive development tool support, this FPGA enables breakthrough innovations across multiple industries.
Whether you’re designing cutting-edge data center infrastructure, implementing sophisticated signal processing algorithms, or developing mission-critical aerospace systems, the XCVU33P-3FSVH2104E provides the processing capability, I/O bandwidth, and reliability needed to succeed in today’s competitive technology landscape.
For technical specifications, pricing, and availability, contact authorized AMD distributors or visit the manufacturer’s website for the latest product information and design resources.
