The XCVU33P-2FSVH2104E is a premium Xilinx FPGA from the Virtex UltraScale+ HBM family, manufactured by AMD (formerly Xilinx). This field programmable gate array features 961,800 logic cells, 208 I/O pins, and comes in a 2104-pin FCBGA package. Octopart Built on advanced 16nm FinFET process technology, this FPGA delivers exceptional computational performance with integrated High Bandwidth Memory (HBM) for data-intensive applications.
XCVU33P-2FSVH2104E Key Features and Benefits
Advanced HBM Integration Technology
AMD Virtex UltraScale+ HBM FPGAs integrate up to 16 GB of high-bandwidth memory (HBM Gen2) at 460 GB/s bandwidth and extremely low power, approximately 7 pJ/bit. AMD The XCVU33P variant specifically includes 2 HBM memory controllers with 2×4GB HBM memory stacks GitHub for a total of 8GB integrated memory.
Superior Logic Density and Processing Power
The XCVU33P-2FSVH2104E contains 54,960 CLBs (Configurable Logic Blocks) and 961,800 logic elements/cells. DRex Electronics This massive logic capacity enables complex designs for AI inference, networking, and high-performance computing applications.
Flexible Speed Grade Options
The Virtex UltraScale+ FPGAs are available in -3, -2, -1 speed grades, with -3E devices having the highest performance. FPGAkey The XCVU33P-2FSVH2104E uses the -2 speed grade, offering an optimal balance between performance and power consumption for most demanding applications.
XCVU33P-2FSVH2104E Technical Specifications
Basic Product Information
| Parameter |
Specification |
| Part Number |
XCVU33P-2FSVH2104E |
| Manufacturer |
AMD (Xilinx) |
| Product Family |
Virtex UltraScale+ HBM |
| Product Status |
Active |
| RoHS Status |
ROHS3 Compliant |
| Package Type |
2104-FCBGA |
| Package Dimensions |
47.5mm × 47.5mm |
Logic Resources
| Resource |
Quantity |
| Configurable Logic Blocks (CLBs) |
54,960 |
| Logic Cells |
961,800 |
| 6-Input LUTs |
439,680 |
| Flip-Flops |
879,360 |
| DSP Slices |
2,880 |
| Block RAM (36Kb) |
320 |
| UltraRAM Blocks |
320 |
| Total RAM Bits |
24,746,394 |
Memory Specifications
| Memory Type |
Capacity |
| Distributed RAM |
~13.0 Mb |
| Block RAM |
~38.0 Mb |
| UltraRAM |
~90.0 Mb |
| HBM Gen2 |
8 GB (2×4GB stacks) |
| HBM Bandwidth |
460 GB/s |
| HBM Controllers |
2 |
I/O and Transceiver Specifications
| Interface |
Quantity/Specification |
| Maximum User I/O |
208 HP |
| GTY Transceivers |
32 |
| PCIe Gen4 Blocks |
4 (PCIE4C) |
| I/O Banks |
4 HP |
| HBM AXI Interfaces |
32 (8×4) |
Electrical Characteristics
| Parameter |
Value |
| Core Voltage (VCCINT) |
0.825V ~ 0.876V (nominal 0.85V) |
| Operating Temperature |
0°C to 100°C (TJ) |
| Temperature Grade |
Extended (E) |
| Process Technology |
16nm FinFET |
| Mounting Type |
Surface Mount |
XCVU33P-2FSVH2104E Applications
Artificial Intelligence and Machine Learning
Virtex UltraScale+ HBM FPGAs provide programmable functionality most suitable for the continually evolving machine learning and artificial intelligence architectures. AMD The integrated HBM allows AI inference applications to process large datasets at maximum speed while reducing power requirements.
Data Center Acceleration
Data centers need to be workload optimized to dynamically change the throughput, latency, and power requirements from a wide range of virtualized software applications. AMD The XCVU33P serves as an excellent acceleration platform for complex compute workloads.
Network and Security Solutions
Instead of accommodating multiple DIMMs on the board, the Virtex UltraScale+ HBM FPGA-based network accelerator card can implement the same solution in one device with the same memory, less power, and higher performance. AMD
Video Transcoding and Processing
Video streaming accounts for the majority of internet traffic today. Virtex UltraScale+ HBM FPGAs offer a variety of serial interfaces and form factors to deliver high performance for compute-intensive video and image processing applications. AMD
5G Wireless Infrastructure
Flexible hardware acceleration, low latency operation, and high-speed switching capability are critical in 5G baseband. AMD Virtex UltraScale FPGAs deliver dynamic and scalable solutions for evolving 5G infrastructure.
Radar and Defense Systems
The combination of beamforming and other radar functions results in enormous signal processing requirements. Virtex UltraScale+ FPGAs allow RADAR designers to achieve higher performance through enhanced DSP resources, on-chip memories, and high degrees of interconnectivity. AMD
XCVU33P-2FSVH2104E Part Number Decoder
Understanding the part number structure helps identify the exact device configuration:
| Segment |
Value |
Meaning |
| XC |
XC |
Commercial grade |
| VU |
VU |
Virtex UltraScale+ |
| 33P |
33P |
Device size with HBM (P = HBM variant) |
| -2 |
-2 |
Speed grade (intermediate) |
| F |
F |
Lidless flip-chip package |
| SV |
SV |
Package material (SV series) |
| H2104 |
H2104 |
2104-ball FCBGA package |
| E |
E |
Extended temperature range (0°C to 100°C) |
Design Resources and Development Tools
Vivado Design Suite Support
Xilinx’s Vivado Design Suite is easy to use and user-friendly in synthesis and implementation. FPGAkey The XCVU33P-2FSVH2104E is fully supported by Vivado for RTL design, synthesis, implementation, and debugging.
Evaluation and Development Platforms
Virtex UltraScale+ HBM FPGAs are supported by comprehensive development tools, reference designs, an IP catalog, and evaluation platforms. Xilinx
Why Choose the XCVU33P-2FSVH2104E?
Unmatched Memory Bandwidth
460 GB/s of HBM bandwidth delivers 20X more bandwidth than a DDR4 DIMM. AMD This eliminates memory bottlenecks in bandwidth-intensive applications.
Simplified System Design
Extended AXI ports and an integrated port switch provide any-port-to-any-address access, minimizing design size, complexity, and time to market for the most usable HBM bandwidth. AMD
Long Product Lifecycle
With typical lifespans extending well past 15 years, you can depend on AMD devices for the life of your design—AMD has committed to extending UltraScale+ FPGAs and adaptive SoCs through 2045. AMD
Optimized Power Efficiency
DC and AC characteristics are specified in extended (E), industrial (I), and military (M) temperature ranges. FPGAkey The device provides multiple power optimization options for various operating conditions.
XCVU33P-2FSVH2104E Ordering Information
| Parameter |
Details |
| Manufacturer Part Number |
XCVU33P-2FSVH2104E |
| Packaging |
Tray |
| Minimum Order Quantity |
Contact distributor |
| Lead Time |
Typically 25+ weeks |
| ECCN |
3A001.a.7.b |
| TARIC |
8542399000 |
Frequently Asked Questions About XCVU33P-2FSVH2104E
What is the difference between XCVU33P and XCVU35P?
The XCVU35P is a multi-die FPGA made of XCVU33P plus one XCVU11P die. GitHub This provides the XCVU35P with additional logic resources while sharing the same HBM architecture.
What temperature range does the XCVU33P-2FSVH2104E support?
The operating temperature range is 0°C to 100°C (TJ) DRex Electronics, making it suitable for extended temperature industrial applications.
What development tools are required?
AMD’s Vivado Design Suite is the primary development environment for this FPGA, providing comprehensive support for design entry, synthesis, implementation, and debugging.
Summary
The XCVU33P-2FSVH2104E represents the cutting edge of FPGA technology, combining massive logic resources with integrated High Bandwidth Memory for applications demanding the highest performance. With 961,800 logic cells, 8GB HBM Gen2 memory delivering 460 GB/s bandwidth, and 32 GTY transceivers, this device is ideal for AI/ML acceleration, data center workloads, 5G infrastructure, and advanced networking solutions.
