Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCVU33P-1FSVH2104E: AMD Xilinx Virtex UltraScale+ HBM FPGA Complete Guide

Product Details

The XCVU33P-1FSVH2104E is a high-performance Field Programmable Gate Array (FPGA) from the AMD Virtex UltraScale+ HBM family. This advanced Xilinx FPGA delivers exceptional processing power, integrated High Bandwidth Memory, and industry-leading logic density for demanding applications in data centers, artificial intelligence, and high-speed networking.

XCVU33P-1FSVH2104E Product Overview

The XCVU33P-1FSVH2104E is a Virtex UltraScale+ Field Programmable Gate Array IC featuring 208 I/O pins and comes in a 2104-BBGA FCBGA package. Digi-Key This device is a high-performance, low-power FPGA offering exceptional logic density and I/O capacity, designed for various applications such as data center acceleration, cloud computing, and artificial intelligence processing. Xecor

Why Choose the XCVU33P-1FSVH2104E?

AMD Virtex UltraScale+ devices provide the highest performance and integration capabilities in a 16nm FPGA. AMD 3rd generation 3D ICs use stacked silicon interconnect (SSI) technology to break through the limitations of Moore’s law and deliver the highest signal processing and serial I/O bandwidth to satisfy the most demanding design requirements. AMD

XCVU33P-1FSVH2104E Technical Specifications

Parameter Specification
Part Number XCVU33P-1FSVH2104E
Manufacturer AMD (formerly Xilinx)
Product Family Virtex UltraScale+ HBM
Speed Grade -1 (Industrial)
Logic Cells 961,800
Total RAM Bits 24,746,394
Number of I/Os 208 HP I/O
Package Type 2104-FCBGA
Process Technology 16nm FinFET
Operating Voltage 0.85V (VCCINT)

XCVU33P-1FSVH2104E Logic Resources

Resource Type Quantity
System Logic Cells 961,800
CLBs 54,960
DSP Slices 2,880
Block RAM (36Kb) 672 blocks
UltraRAM (288Kb) 320 blocks
GTY Transceivers 32
PCIe Blocks 4 PCIE4C

Key Features of the Virtex UltraScale+ XCVU33P

High Bandwidth Memory (HBM) Integration

AMD Virtex UltraScale+ HBM FPGAs provide the highest on-chip memory density with up to 500 Mb of total on-chip integrated memory, plus up to 16 GB of high-bandwidth memory (HBM) Gen2 integrated in-package for 460 GB/s of memory bandwidth. AMD The XCVU33P includes 2 HBM memory controllers with 2×4GB HBM memory stacks. GitHub

Advanced DSP Processing Capabilities

The DSP slice, with its 96-bit-wide XOR functionality, 27-bit pre-adder, and 30-bit A input, performs numerous independent functions including multiply accumulate, multiply add, and pattern detect. Mouser These capabilities make the XCVU33P-1FSVH2104E ideal for signal processing and machine learning inference workloads.

High-Speed Serial Connectivity

Virtex UltraScale+ devices deliver up to 3.1Tb/s SerDes bandwidth for high throughput systems. They support 32.75G NRZ transceivers enabling compatibility with the latest optical equipment and existing infrastructure. FPGAkey

XCVU33P-1FSVH2104E Memory Architecture

Memory Type Capacity Bandwidth
HBM Gen2 8 GB (2×4GB stacks) 460 GB/s
Block RAM 24+ Mb High-speed internal
UltraRAM 90 Mb Low-power retention
Distributed RAM Available CLB-integrated

Innovative embedded HBM controller and breakthrough integration enable maximum bandwidth, efficient routing and logic utilization, and optimized power efficiency for workloads that process large datasets from AI inference, video transcoding, next-generation firewalls, search applications, and data warehouses. AMD

Target Applications for XCVU33P-1FSVH2104E

Data Center and Cloud Computing

Data centers need to be workload optimized to dynamically change the throughput, latency, and power requirements from a wide range of virtualized software applications. Virtex UltraScale+ FPGAs serve as a scalable, reconfigurable acceleration platform that can be optimized for complex workloads. AMD

Artificial Intelligence and Machine Learning

Virtex UltraScale+ HBM FPGAs provide programmable functionality that is most suitable for the continually evolving machine learning and artificial intelligence architectures. The integrated HBM allows AI inference applications to process large datasets at maximum speed while reducing power requirements. AMD

Video Processing and Transcoding

FPGA-based video acceleration simplifies infrastructure and helps users to deliver stable, latency critical services on a budget. Virtex UltraScale+ HBM FPGAs offer a variety of serial interfaces, including 58G PAM4, and form factors to deliver high performance designed for compute intensive video and image processing applications. AMD

Network Security and Acceleration

An HBM implementation enjoys a simpler and lower risk design flow by simplifying the PCB and decreasing the memory subsystem complexity. An implementation using a Virtex UltraScale+ HBM FPGA with HBM stacks provides up to a 5X higher look-up rate because of HBM bandwidth. AMD

5G Infrastructure

Flexible hardware acceleration, low latency operation, and high-speed switching capability are critical in 5G baseband. Virtex UltraScale FPGAs offer dynamic and scalable solutions for evolving 5G infrastructure. AMD

XCVU33P-1FSVH2104E Package Information

Package Parameter Value
Package Type FCBGA (Flip-Chip Ball Grid Array)
Pin Count 2104
Ball Pitch 1.0mm
Package Code FSVH2104
Moisture Sensitivity Level MSL 4

Speed Grade Options Comparison

Speed Grade Performance Level Part Number Suffix
-1 Standard Performance XCVU33P-1FSVH2104E
-2 Enhanced Performance XCVU33P-2FSVH2104E
-3 Highest Performance XCVU33P-3FSVH2104E
-2LE Low Power Option XCVU33P-L2FSVH2104E

The Xilinx Virtex UltraScale+ FPGAs are available in -3, -2, -1 speed grades, with -3E devices having the highest performance. The -2LE devices can operate at a VCCINT voltage at 0.85V or 0.72V and provide lower maximum static power. FPGAkey

Development Tools and Software Support

In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation. FPGAkey The XCVU33P-1FSVH2104E is fully supported by AMD’s comprehensive development ecosystem.

Recommended Development Resources

  • Vivado Design Suite for synthesis and implementation
  • Vitis unified software platform for acceleration
  • Reference designs and IP cores from AMD
  • VCU128 evaluation kit for prototyping

Ordering Information

Attribute Detail
Part Number XCVU33P-1FSVH2104E
ECCN 3A001.a.7.b
RoHS Status RoHS3 Compliant
Lead-Free Yes
Product Status Active

XCVU33P-1FSVH2104E vs. Related Devices

Device Logic Cells HBM Capacity GTY Transceivers
XCVU31P 961,800 4 GB 32
XCVU33P 961,800 8 GB 32
XCVU35P 1,724,000+ 8 GB 64
XCVU37P 2,500,000+ 8 GB 96

Long-Term Availability and Support

With typical lifespans extending well past 15 years, you can depend on AMD devices for the life of your design—extending AMD UltraScale+ FPGAs and adaptive SoCs through 2045. AMD

Frequently Asked Questions About XCVU33P-1FSVH2104E

What makes the XCVU33P-1FSVH2104E different from standard FPGAs?

The XCVU33P-1FSVH2104E integrates High Bandwidth Memory directly in the package, eliminating the need for external memory DIMMs and providing significantly higher memory bandwidth at lower power consumption.

What is the operating temperature range?

DC and AC characteristics are specified in extended (E), industrial (I), and military (M) temperature ranges. The timing characteristics of a -1 speed grade extended device are the same as for a -1 speed grade industrial device. FPGAkey

How does HBM benefit my design?

460 GB/s of HBM bandwidth delivers 20X more bandwidth than a DDR4 DIMM. Extended AXI ports and an integrated port switch provide any port to any address access, and minimize design size, complexity, and time to market. AMD

Conclusion

The XCVU33P-1FSVH2104E represents the pinnacle of FPGA technology, combining massive logic resources, integrated high bandwidth memory, and advanced connectivity options in a single package. Whether you’re developing AI inference engines, high-speed network appliances, or video processing systems, this Virtex UltraScale+ HBM FPGA delivers the performance and flexibility needed for next-generation applications.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.