The XCVU31P-2FSVH1924E is a high-performance Field Programmable Gate Array (FPGA) from AMD’s Virtex UltraScale+ family. Designed for compute-intensive applications including artificial intelligence, machine learning, data center acceleration, and high-speed networking, this Xilinx FPGA delivers exceptional processing power with advanced 16nm FinFET technology.
Key Features of the XCVU31P-2FSVH1924E FPGA
The XCVU31P-2FSVH1924E offers a powerful combination of logic capacity, memory bandwidth, and I/O flexibility. Built on AMD’s third-generation 3D IC architecture using stacked silicon interconnect (SSI) technology, this FPGA breaks through traditional performance barriers to deliver industry-leading compute capabilities.
Advanced Architecture and Technology
This Virtex UltraScale+ device features registered inter-die routing lines enabling operation at frequencies exceeding 600 MHz. The architecture provides abundant and flexible clocking options, delivering a virtual monolithic design experience despite utilizing 3D IC technology.
XCVU31P-2FSVH1924E Technical Specifications
Core Specifications Table
| Parameter |
Value |
| Manufacturer |
AMD (Xilinx) |
| Part Number |
XCVU31P-2FSVH1924E |
| Series |
Virtex UltraScale+ |
| Logic Elements/Cells |
961,800 |
| Number of LABs/CLBs |
54,960 |
| Total RAM Bits |
24,746,394 |
| Number of User I/Os |
208 |
| Product Status |
Active |
Electrical and Physical Specifications Table
| Parameter |
Value |
| Supply Voltage |
0.825V ~ 0.876V |
| Operating Temperature |
0°C ~ 100°C (TJ) |
| Speed Grade |
-2 (Industrial) |
| Package Type |
1924-BBGA, FCBGA |
| Package Dimensions |
45mm x 45mm |
| Mounting Type |
Surface Mount |
| RoHS Status |
RoHS3 Compliant |
| Packaging |
Tray |
Target Applications for XCVU31P-2FSVH1924E
Data Center and Cloud Computing
The XCVU31P-2FSVH1924E serves as a scalable, reconfigurable acceleration platform optimized for complex data center workloads. Its massive raw compute capability and I/O flexibility make it suitable for virtualized software applications requiring dynamic throughput, latency, and power optimization.
Artificial Intelligence and Machine Learning
Virtex UltraScale+ FPGAs provide programmable functionality ideal for evolving AI/ML architectures. The device supports up to 38 TOPs of DSP compute performance, optimized for both fixed and floating-point operations including INT8 inference workloads.
High-Speed Networking
With power-optimized high-speed transceivers and flexible interface options, the XCVU31P-2FSVH1924E enables implementation of 1+ Tb/s networking solutions. The FPGA’s high-speed switching capability and low-latency operation are critical for 5G baseband and network acceleration applications.
Video and Image Processing
This device delivers high performance for compute-intensive video and image processing applications. Service providers can leverage FPGA-based video acceleration to simplify infrastructure while delivering stable, latency-critical streaming services.
Radar and Defense Systems
The combination of enhanced DSP resources, on-chip memories, and high interconnectivity makes the XCVU31P-2FSVH1924E suitable for beamforming, signal processing, and radar functions in spectrum-contested environments.
Part Number Breakdown: XCVU31P-2FSVH1924E
| Segment |
Meaning |
| XC |
Xilinx Commercial |
| VU |
Virtex UltraScale |
| 31P |
Device Size (31 with HBM capability) |
| -2 |
Speed Grade (Industrial) |
| F |
Flip-chip package |
| SV |
Silicon Voltage |
| H1924 |
1924-pin BGA |
| E |
Extended Temperature Range |
Development Tools and Software Support
The XCVU31P-2FSVH1924E is fully supported by AMD’s comprehensive development ecosystem, including Vivado Design Suite and Vitis unified software platform. Engineers can leverage pre-optimized IP cores, reference designs, and partner solutions to accelerate time-to-market.
Why Choose the XCVU31P-2FSVH1924E?
- Industry-leading performance-per-watt for compute-intensive applications
- Advanced 16nm FinFET technology with 3D IC integration
- Massive logic capacity with 961,800 logic cells
- Flexible I/O options supporting multiple interface standards
- Comprehensive tool support from Vivado and Vitis platforms
- Active product status with reliable long-term availability
Ordering Information
| Attribute |
Details |
| Manufacturer Part Number |
XCVU31P-2FSVH1924E |
| Package |
1924-FCBGA (45×45) |
| Base Product Number |
XCVU31 |
| Temperature Grade |
Extended (0°C to 100°C TJ) |
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