Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCV600E-7FG680I: High-Performance Virtex-E FPGA for Advanced Applications

Product Details

The XCV600E-7FG680I is a high-performance Field Programmable Gate Array from Xilinx’s Virtex-E series, engineered to deliver exceptional computational capabilities for complex electronic systems. This industrial-grade FPGA combines 15,552 logic elements with 512 I/O pins, making it an ideal solution for telecommunications, signal processing, and industrial control applications. With its robust architecture and extended temperature range, the XCV600E-7FG680I stands as a reliable choice for demanding embedded systems.

Understanding the XCV600E-7FG680I FPGA Architecture

The XCV600E-7FG680I represents Xilinx’s commitment to delivering flexible programmable logic solutions. This advanced Xilinx FPGA features a sophisticated architecture built on 0.18µm CMOS technology, providing designers with the flexibility needed for modern digital design challenges.

Core Performance Specifications

At its core, the XCV600E-7FG680I delivers impressive computational power through its well-balanced architecture. The device incorporates 985,882 system gates, enabling complex algorithm implementation and sophisticated data processing workflows.

Technical Specifications Table

Specification Value
Part Number XCV600E-7FG680I
Manufacturer Xilinx (Now AMD)
Product Family Virtex-E Series
Logic Elements/Cells 15,552
Configurable Logic Blocks (CLBs) 3,456
System Gates 985,882
Total RAM Bits 294,912
RAM Size 36 kB
I/O Pins 512
Package Type 680-FTEBGA (Fine-Pitch Ball Grid Array)
Package Size 40mm x 40mm
Operating Temperature -40°C to 100°C (Industrial)
Supply Voltage 1.71V to 1.89V (Nominal 1.8V)
Speed Grade -7
Mounting Type Surface Mount

Key Features of XCV600E-7FG680I

Advanced Logic Capacity

The XCV600E-7FG680I provides exceptional logic density with 15,552 logic elements distributed across 3,456 configurable logic blocks. This architecture enables designers to implement complex digital circuits efficiently, from state machines to DSP algorithms.

Extensive I/O Capabilities

With 512 user I/O pins, the XCV600E-7FG680I offers remarkable connectivity options. This extensive I/O count supports multiple interface standards, making it suitable for applications requiring high-bandwidth data transfer and multi-protocol support.

Memory Resources

The FPGA incorporates 294,912 bits of distributed RAM, equivalent to 36 kB of embedded memory. This on-chip memory resource supports data buffering, lookup tables, and temporary storage without requiring external memory components.

Industrial Temperature Range

Operating reliably from -40°C to 100°C, the XCV600E-7FG680I is designed for harsh industrial environments. This extended temperature range ensures consistent performance in automotive, aerospace, and outdoor installation scenarios.

Performance Characteristics

Performance Metric Specification
Maximum Internal Clock Speed Up to 130 MHz (4 LUT levels)
System Performance Up to 200 MHz
PCI Compliance 66-MHz PCI Compatible
Technology Node 0.18µm CMOS
Metal Layers 5-layer metal process
Configuration Type SRAM-based
Reprogrammability Unlimited in-system reconfiguration

Applications and Use Cases

Telecommunications Equipment

The XCV600E-7FG680I excels in telecommunications infrastructure, supporting protocol conversion, signal routing, and data packet processing. Its high I/O count and logic capacity make it ideal for base stations and networking equipment.

Digital Signal Processing

With dedicated multiplier support and abundant logic resources, this FPGA handles complex DSP algorithms efficiently. Applications include audio processing, video filtering, and software-defined radio implementations.

Industrial Automation

The industrial temperature rating and robust design make the XCV600E-7FG680I perfect for factory automation, motor control systems, and process monitoring applications requiring reliable operation in challenging environments.

Medical Instrumentation

Medical device manufacturers leverage the XCV600E-7FG680I for imaging equipment, patient monitoring systems, and diagnostic instruments where reprogrammability and high computational power are essential.

Package Information

Package Detail Specification
Package Code FG680
Package Type FTEBGA (Fine-Pitch Thin Enhanced Ball Grid Array)
Total Pins/Balls 680
Pitch 1.0mm
Package Dimensions 40mm x 40mm
Package Height 1.9mm (typical)
Mounting Surface Mount Technology (SMT)
Moisture Sensitivity Level MSL 3
RoHS Compliance Non-compliant (Legacy product)

Design Features and Capabilities

Clock Management System

The XCV600E-7FG680I includes sophisticated clock management circuitry with four dedicated Delay-Locked Loops (DLLs). These DLLs provide advanced clock control, including clock multiplication, division, and phase shifting capabilities. The device features four primary low-skew global clock distribution networks plus 24 secondary local clock nets for optimal timing performance.

SelectIO™ Technology

Supporting 16 different I/O standards, the XCV600E-7FG680I’s SelectIO™ interface allows direct connection to various memory types, including ZBTRAM, and supports multiple voltage levels for flexible system integration.

Memory Architecture

The hierarchical memory system offers versatility:

  • LUTs configurable as 16-bit RAM, 32-bit RAM, 16-bit dual-ported RAM, or 16-bit shift registers
  • Configurable synchronous dual-ported 4k-bit block RAMs
  • Fast interfaces to external high-performance memory devices

XCV600E-7FG680I vs Alternative Models

Model Logic Elements System Gates I/O Pins RAM Bits Package
XCV600E-7FG680I 15,552 985,882 512 294,912 680-FTEBGA
XCV300E 8,448 532,480 404 163,840 Various
XCV400E 11,712 746,496 512 229,376 Various
XCV800E 19,200 1,212,416 512 360,448 Various

Programming and Development

Design Tools

The XCV600E-7FG680I is programmed using Xilinx ISE (Integrated Software Environment), supporting HDL-based development with VHDL or Verilog. The toolchain includes synthesis, place-and-route, and bitstream generation capabilities.

Configuration Methods

As an SRAM-based FPGA, the XCV600E-7FG680I requires configuration upon power-up. Supported configuration modes include:

  • Master Serial mode
  • Slave Serial mode
  • SelectMAP parallel configuration
  • JTAG boundary scan

Ordering and Availability

The XCV600E-7FG680I is available through authorized distributors and electronic component suppliers worldwide. When ordering, note that this is a legacy product, and availability may vary depending on existing inventory levels.

Part Number Breakdown

XCV600E-7FG680I decodes as:

  • XCV = Virtex-E FPGA family
  • 600E = 600K system gate density, Virtex-E series
  • -7 = Speed grade (commercial timing)
  • FG680 = Fine-pitch BGA package with 680 pins
  • I = Industrial temperature range (-40°C to 100°C)

Quality and Reliability

Manufacturing Standards

Manufactured to strict quality standards, the XCV600E-7FG680I undergoes comprehensive testing including:

  • Functional testing at speed
  • Temperature cycling
  • Voltage stress testing
  • I/O characterization

Handling Precautions

Due to MSL 3 classification, proper handling is essential:

  • Store in moisture-barrier bags with desiccant
  • Floor life: 168 hours after bag opening at ≤30°C/60% RH
  • Baking may be required if exposure time exceeded
  • Use ESD protection during handling and assembly

Thermal Management Considerations

Thermal Characteristic Specification
Junction Temperature (TJ) -40°C to 100°C
Storage Temperature -65°C to 150°C
Thermal Resistance (θJA) Contact manufacturer for specific values
Power Dissipation Application dependent

Why Choose XCV600E-7FG680I?

Proven Reliability

With years of field deployment, the XCV600E-7FG680I has demonstrated exceptional reliability in mission-critical applications across telecommunications, industrial, and defense sectors.

Cost-Effective Solution

For existing designs or systems requiring specific functionality, the XCV600E-7FG680I offers excellent value with its balanced feature set and proven performance characteristics.

Design Flexibility

Unlimited reprogrammability enables firmware updates, feature additions, and bug fixes without hardware changes, reducing long-term maintenance costs and extending product lifecycles.

Strong Ecosystem Support

Despite being a legacy product, comprehensive documentation, reference designs, and application notes remain available, facilitating smooth design integration and troubleshooting.

Technical Support and Resources

Engineers working with the XCV600E-7FG680I can access extensive technical resources including:

  • Detailed 233-page datasheet with electrical specifications
  • Application notes for common design challenges
  • Reference designs and IP cores
  • Community forums and knowledge bases
  • Legacy tool support documentation

Comparison: XCV600E-7FG680I vs XCV600E-6FG680I

The primary difference between these variants lies in the speed grade:

Feature XCV600E-7FG680I XCV600E-6FG680I
Speed Grade -7 (Standard) -6 (Faster)
Performance Standard timing Enhanced timing
Power Consumption Lower Slightly higher
Cost More economical Premium pricing
Temperature Range Industrial (-40°C to 100°C) Industrial (-40°C to 100°C)

Conclusion

The XCV600E-7FG680I Field Programmable Gate Array delivers a compelling combination of logic capacity, I/O flexibility, and reliability for industrial applications. With 15,552 logic elements, 512 I/O pins, and operation across the full industrial temperature range, this Virtex-E FPGA continues to serve demanding applications in telecommunications, industrial control, and embedded systems.

Whether you’re maintaining existing systems or considering this FPGA for cost-sensitive new designs, the XCV600E-7FG680I offers proven performance backed by comprehensive documentation and a robust design ecosystem. Its unlimited reprogrammability ensures your investment remains adaptable to changing requirements throughout your product’s lifecycle.

For engineers seeking reliable, high-performance programmable logic solutions with extensive I/O capabilities and industrial-grade environmental tolerance, the XCV600E-7FG680I remains a solid choice in the Field Programmable Gate Array landscape.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.