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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCV600E-7BG432I: Advanced Virtex-E FPGA for High-Performance Embedded Applications

Product Details

Overview of XCV600E-7BG432I Field Programmable Gate Array

The XCV600E-7BG432I represents a versatile IC FPGA featuring 316 input/output pins housed in a 432MBGA package Allicdata, designed for demanding embedded applications requiring flexible, programmable logic solutions. This low-cost FPGA device suits processor-based applications, networking applications, and various embedded systems Allicdata.

As part of AMD’s (formerly Xilinx) renowned Xilinx FPGA family, this component delivers exceptional performance for modern electronic designs requiring reconfigurable logic capabilities.

Key Technical Specifications

Core Architecture and Performance

Specification Value
Logic Gates 186,624 gates
CLBs (Configurable Logic Blocks) 3,456 CLBs
Logic Cells 15,552 cells
I/O Pins 316 user I/O
Package Type 432-pin MBGA (Ball Grid Array)
Operating Voltage 1.8V core voltage
Speed Grade -7 (standard performance)
Temperature Grade Industrial (-40°C to +100°C)

Package and Physical Characteristics

Parameter Details
Package Style BG432 (Ball Grid Array)
Total Pins 432 balls
Mounting Type Surface Mount
Package Case MBGA (Micro Ball Grid Array)

Product Features and Capabilities

Advanced FPGA Architecture

The device’s core includes a field programmable gate array with standard DDR3 memory controller integration Allicdata, enabling seamless memory interfacing for data-intensive applications. The Virtex-E architecture provides industry-leading performance-per-watt efficiency for 1.8V FPGA solutions.

Integrated Peripheral Functions

The XCV600E-7BG432I incorporates analog and digital peripheral functions including timers, UARTs, and PWM generators Allicdata, making it exceptionally well-suited for complex embedded system designs. These built-in peripherals reduce external component count and simplify PCB design.

Design Flexibility and Scalability

Optimized for flexibility, this FPGA supports a wide range of application fields Allicdata from telecommunications to industrial control systems. The substantial logic capacity allows designers to implement multiple functions within a single chip, reducing bill-of-materials costs.

Technical Specifications Table

Category Specification Value
Logic Density System Gates 186,624
Logic Density Configurable Logic Blocks 3,456 CLBs
Logic Density Maximum Logic Cells 15,552
I/O Specifications User I/O Pins 316
Memory Distributed RAM Available
Memory Block RAM Support Yes
Power Supply Core Voltage 1.8V
Power Supply I/O Voltage 2.5V/3.3V compatible
Technology Process Node 0.18μm
Performance Speed Grade -7
Temperature Operating Range Industrial grade
Compliance RoHS Status Compliant

Application Areas

Telecommunications and Networking

The XCV600E-7BG432I excels in telecommunications infrastructure, supporting protocol processing, packet switching, and network interface applications. The generous I/O count enables multiple high-speed serial interfaces.

Industrial Control Systems

With robust industrial temperature rating and ample logic resources, this FPGA handles motor control, sensor interfacing, PLC functionality, and real-time monitoring tasks efficiently.

Signal Processing Applications

The device’s architecture supports DSP implementations including filtering, FFT operations, and custom signal processing algorithms commonly required in test equipment and measurement systems.

Embedded Computing Platforms

As a processor companion or standalone processing engine, the XCV600E-7BG432I provides hardware acceleration, custom peripheral implementation, and flexible I/O expansion capabilities.

Design and Integration Advantages

High I/O Density

The 432-ball MBGA package delivers 316 user I/O pins, providing exceptional connectivity options while maintaining a compact footprint suitable for space-constrained designs.

Power Efficiency

Operating at 1.8V core voltage, this Virtex-E device offers reduced power consumption compared to earlier 2.5V FPGA families, making it ideal for battery-powered and thermally-sensitive applications.

Development Tool Support

Compatible with industry-standard Xilinx ISE Design Suite and third-party synthesis tools, the XCV600E-7BG432I benefits from mature, well-documented development environments enabling rapid design cycles.

Legacy Design Migration

For existing Virtex-E based designs, the XCV600E-7BG432I provides pin-compatible options within the same family, simplifying product upgrades and second-sourcing strategies.

Comparison with Related Devices

Model Gates CLBs I/O Package Use Case
XCV600E-7BG432I 186,624 3,456 316 432-MBGA General purpose, industrial
XCV600E-7BG560I 186,624 3,456 404 560-MBGA Higher I/O requirements
XCV600E-7FG676I 186,624 3,456 444 676-FBGA Maximum I/O density
XCV600E-6BG432C 186,624 3,456 316 432-MBGA Commercial temperature

Quality and Reliability

Manufacturing Standards

AMD (Xilinx) manufactures the XCV600E-7BG432I using proven 0.18-micron CMOS technology, ensuring reliable operation across the full industrial temperature range with industry-leading MTBF figures.

Testing and Qualification

Each device undergoes comprehensive testing including parametric verification, functionality testing, and burn-in procedures to guarantee specification compliance and long-term reliability.

Frequently Asked Questions

Q: What is the difference between -7 and -6 speed grades? The -7 speed grade offers standard performance suitable for most applications, while -6 provides higher maximum frequencies for timing-critical designs. Both operate identically regarding features and I/O count.

Q: Is the XCV600E-7BG432I suitable for new designs? While this Virtex-E device remains available, designers should consider newer FPGA families for new projects. However, it remains excellent for legacy support and cost-sensitive applications.

Q: What development tools are required? Xilinx ISE Design Suite (version 14.7 or compatible) provides complete design entry, synthesis, implementation, and programming support for this device.

Q: What is the typical power consumption? Power consumption varies by design utilization and switching activity, typically ranging from 500mW to 2W for typical applications. Xilinx Power Estimator tools provide accurate predictions.

Conclusion

The XCV600E-7BG432I Field Programmable Gate Array delivers proven performance and reliability for industrial embedded applications requiring substantial logic resources and extensive I/O capabilities. With its balance of capacity, features, and cost-effectiveness, this device continues serving engineers developing telecommunications equipment, industrial controllers, and custom processing solutions. The extensive support ecosystem and mature development tools ensure successful implementation from prototype through production.

For comprehensive technical documentation, design resources, and purchasing information about the XCV600E-7BG432I and other Xilinx FPGA solutions, consult authorized distributors and AMD’s official documentation.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.