The XCV600E-7BG432C0773 represents a powerful field-programmable gate array solution from the renowned Virtex-E family, delivering exceptional programmable logic capabilities for demanding embedded applications. This commercial-grade FPGA combines high density, superior performance, and advanced 0.18μm CMOS technology to meet the requirements of modern digital design projects.
What is XCV600E-7BG432C0773?
The XCV600E-7BG432C0773 is a high-density FPGA manufactured by Xilinx (now AMD) featuring 186,624 system gates and 15,552 logic cells in a compact 432-pin BGA package. This device operates at 1.8V and offers commercial temperature range performance with -7 speed grade, making it suitable for a wide variety of industrial and commercial applications.
Key Technical Specifications
Core Performance Features
| Specification |
Value |
| Part Number |
XCV600E-7BG432C0773 |
| Manufacturer |
Xilinx (AMD) |
| Product Family |
Virtex-E 1.8V FPGAs |
| System Gates |
985,882 gates |
| Logic Gates |
186,624 gates |
| Logic Cells |
15,552 cells |
| Operating Voltage |
1.8V |
| Speed Grade |
-7 (Commercial) |
| Package Type |
432-Pin BGA (Ball Grid Array) |
| I/O Pins |
316 user I/O |
| Process Technology |
0.18μm, 6-layer metal CMOS |
| Internal Performance |
400MHz |
Package and Environmental Specifications
| Parameter |
Specification |
| Package |
BG432 (432-pin Ball Grid Array) |
| Temperature Grade |
Commercial (0°C to +85°C) |
| RoHS Compliance |
Contact manufacturer for current status |
| Mounting Type |
Surface Mount |
Advanced Architecture and Design Features
Programmable Logic Resources
The XCV600E-7BG432C0773 incorporates Xilinx’s advanced Virtex-E architecture, optimized for both performance and efficiency. The device features sophisticated routing resources that enable complex digital designs while maintaining high-speed operation.
SelectI/O Technology
This Xilinx FPGA implements flexible SelectI/O+ technology, supporting multiple I/O standards including differential signaling capabilities. This versatility allows designers to interface with various voltage levels and signaling protocols within a single device.
Memory Architecture
The XCV600E-7BG432C0773 includes SelectRAM+ hierarchical memory blocks, providing flexible on-chip RAM resources for buffering, FIFO implementation, and data storage applications. This distributed memory architecture enhances system performance by reducing external memory requirements.
Technical Capabilities and Applications
Performance Characteristics
| Feature |
Capability |
| Maximum Internal Frequency |
400 MHz |
| LUT Levels |
4-input lookup tables |
| System Clock Speed |
130 MHz (typical) |
| Routing Resources |
Hierarchical routing matrix |
| Configuration Time |
Fast configuration support |
| Power Consumption |
Optimized for low-power operation |
Ideal Application Areas
The XCV600E-7BG432C0773 excels in demanding applications including:
- Digital Signal Processing (DSP): High-speed data processing and filtering applications
- Communication Systems: Protocol implementation and data routing
- Industrial Control: Complex control algorithms and sensor interfacing
- Test and Measurement: High-speed data acquisition systems
- Video Processing: Real-time image processing and display control
- Embedded Systems: Custom processor implementations and system-on-chip designs
- Telecommunications: Base station processing and network equipment
Design Tools and Development Support
Software Compatibility
The XCV600E-7BG432C0773 is supported by Xilinx’s comprehensive development tools:
- ISE Design Suite: Legacy tool support for Virtex-E devices
- HDL Support: VHDL and Verilog design entry
- Synthesis Tools: Third-party synthesis tool compatibility
- Simulation: Industry-standard simulation tool support
- Programming: Multiple configuration options including JTAG
Design Resources
| Resource Type |
Description |
| Datasheet |
Complete electrical and timing specifications |
| Application Notes |
Design guidelines and best practices |
| Reference Designs |
Example implementations and IP cores |
| Technical Support |
Comprehensive documentation and community forums |
Pin Configuration and Package Information
BG432 Package Details
The 432-pin BGA package provides optimal signal integrity and thermal performance for high-density applications. Key package features include:
- Compact footprint for space-constrained designs
- Enhanced thermal dissipation characteristics
- Improved signal integrity through controlled impedance
- 316 user-configurable I/O pins
- Power and ground distribution for low-noise operation
I/O Banking Architecture
| I/O Feature |
Specification |
| Total User I/O |
316 pins |
| I/O Standards |
Multiple voltage standards supported |
| Differential Pairs |
Available for high-speed signaling |
| I/O Banking |
Organized for flexible voltage assignment |
Advantages of XCV600E-7BG432C0773
Performance Benefits
- High Logic Density: 186,624 gates provide ample resources for complex designs
- Fast Operation: 400 MHz internal performance enables high-throughput applications
- Flexible Architecture: Adaptable to diverse application requirements
- Proven Technology: Mature Virtex-E platform with extensive design history
Design Flexibility
The XCV600E-7BG432C0773 offers exceptional design flexibility through its programmable logic fabric, enabling rapid prototyping and design iterations without hardware changes. This accelerates time-to-market while reducing development costs.
Cost-Effective Solution
Compared to custom ASIC development, the XCV600E-7BG432C0773 provides a cost-effective alternative for medium-volume production while eliminating non-recurring engineering costs associated with mask-programmed devices.
Electrical Characteristics
Power Supply Requirements
| Power Rail |
Voltage |
Tolerance |
Application |
| VCCINT |
1.8V |
±5% |
Core logic voltage |
| VCCO |
1.5V – 3.3V |
±5% |
I/O voltage (bank dependent) |
| VCCAUX |
2.5V |
±5% |
Auxiliary circuits |
Operating Conditions
The commercial temperature grade (-7 speed grade) ensures reliable operation across standard industrial temperature ranges, making the XCV600E-7BG432C0773 suitable for most commercial applications.
Ordering Information and Availability
Part Number Breakdown
XCV600E-7BG432C0773 decodes as follows:
- XCV: Virtex-E family identifier
- 600E: Device density (600k system gates equivalent)
- -7: Speed grade (commercial temperature, standard performance)
- BG432: Package type (432-pin Ball Grid Array)
- C: Commercial temperature grade (0°C to +85°C)
- 0773: Manufacturing code
Supply Chain Considerations
The XCV600E-7BG432C0773 is available through authorized distributors and specialty component suppliers. As a mature product, availability may vary, and designers should verify stock levels and lead times with suppliers including Rochester Electronics, LLC, which provides authorized lifecycle extension support for this device.
Design Considerations and Best Practices
Thermal Management
Proper thermal design is essential for reliable operation. Consider the following:
- Adequate PCB copper for heat dissipation
- Thermal vias beneath the BGA package
- Airflow requirements based on power consumption
- Junction temperature monitoring in critical applications
Power Distribution Network
| Design Element |
Recommendation |
| Decoupling Capacitors |
Multiple values (0.01μF, 0.1μF, 10μF) placed close to device |
| Power Planes |
Dedicated power and ground planes in PCB |
| Current Capacity |
Size traces and planes for peak current requirements |
| Voltage Regulation |
Low-noise regulators with adequate current capacity |
Signal Integrity Guidelines
For optimal signal integrity when implementing designs with the XCV600E-7BG432C0773:
- Use controlled impedance traces for high-speed signals
- Minimize stub lengths on BGA connections
- Implement proper termination for high-speed interfaces
- Follow manufacturer’s PCB layout guidelines
- Consider crosstalk between adjacent high-speed signals
Migration and Compatibility
Family Compatibility
The XCV600E-7BG432C0773 is part of the broader Virtex-E family, which includes devices ranging from XCV50E to XCV3200E. Pin-compatible options in the BG432 package allow for design scalability:
- XCV400E-7BG432C (lower density option)
- XCV600E-6BG432C (faster speed grade)
- XCV600E-7BG432I (industrial temperature range)
Upgrade Paths
For new designs requiring additional performance or features, migration paths include newer Xilinx families such as Spartan, Artix, or Kintex series, though these may require design modifications due to architectural differences.
Quality and Reliability
Manufacturing Standards
The XCV600E-7BG432C0773 is manufactured using advanced semiconductor processes with stringent quality controls. The device meets industry standards for reliability and performance in commercial applications.
Testing and Validation
Each device undergoes comprehensive testing including:
- Functional testing of logic resources
- Speed binning for performance grading
- I/O functionality verification
- Temperature cycling validation
- Package integrity inspection
Technical Support Resources
Documentation Access
Comprehensive technical documentation is available including:
- Complete datasheet with AC/DC specifications
- Programming and configuration guides
- PCB design guidelines for BG432 package
- Application notes for specific use cases
- Errata and design advisory documents
Development Community
Active communities and forums provide peer support for FPGA designers working with Virtex-E devices. These resources offer valuable insights for troubleshooting and optimization.
Conclusion
The XCV600E-7BG432C0773 delivers a compelling combination of logic density, performance, and flexibility for embedded systems and digital design applications. With 186,624 gates, 316 I/O pins, and proven Virtex-E architecture, this FPGA provides the resources needed for complex digital implementations while maintaining cost-effectiveness and design efficiency.
Whether you’re developing communication infrastructure, industrial control systems, or high-performance data processing solutions, the XCV600E-7BG432C0773 offers the programmable logic capabilities, I/O flexibility, and performance characteristics required for successful project implementation.
For designers seeking a mature, well-supported FPGA platform with extensive legacy design resources and proven reliability, the XCV600E-7BG432C0773 represents an excellent choice in the programmable logic landscape.
