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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
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Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XCV600E-6HQ240I: High-Performance Virtex-E FPGA for Advanced Digital Applications

Product Details

Overview of the XCV600E-6HQ240I FPGA

The XCV600E-6HQ240I is a cutting-edge Field Programmable Gate Array (FPGA) from AMD’s renowned Virtex-E family, designed to deliver exceptional performance for complex digital designs. This industrial-grade programmable logic device combines high logic density with advanced features, making it an ideal solution for telecommunications, aerospace, embedded systems, and high-performance computing applications.

As part of the Virtex-E series, the XCV600E-6HQ240I represents AMD’s commitment to providing flexible, reconfigurable hardware solutions that meet the demanding requirements of modern electronic systems. This FPGA offers engineers the power to implement sophisticated digital circuits with remarkable efficiency and reliability.

Key Features and Specifications

Core Technical Specifications

Specification Value
Logic Elements/Cells 15,552
System Gates 985,882 gates (approximately 186.624K equivalent gates)
Total RAM Bits 294,912 bits
Number of LABs/CLBs 3,456
Maximum I/O Pins 158
Operating Frequency Up to 357 MHz
Process Technology 0.18 µm

Package and Environmental Specifications

Parameter Details
Package Type 240-pin HQFP (Heat-sink Quad Flat Pack)
Package Dimensions 240-PQFP (32mm x 32mm)
Mounting Type Surface Mount Technology (SMT)
Operating Temperature -40°C to +100°C (TJ – Industrial Grade)
Supply Voltage 1.71V to 1.89V (1.8V nominal)
Lead-Free Status Contains lead / RoHS non-compliant

Advanced Features Overview

Feature Category Description
Clock Management Eight fully digital Delay-Locked Loops (DLLs) for advanced timing control
Arithmetic Support Dedicated carry logic chains for high-speed arithmetic operations
Memory Architecture Distributed and block RAM for flexible memory implementation
Configuration SRAM-based, unlimited reprogrammability
Design Support IEEE 1149.1 boundary-scan (JTAG) compatible
Cascade Support Cascade chains for implementing wide-input functions

Understanding the XCV600E-6HQ240I Part Number

The part number XCV600E-6HQ240I provides critical information about this FPGA’s specifications:

  • XCV = Virtex-E family designation
  • 600E = 600,000 system gates capacity with enhanced features
  • 6 = Speed grade (-6, indicating performance level)
  • HQ = Heat-sink Quad Flat Pack package
  • 240 = 240-pin configuration
  • I = Industrial temperature range (-40°C to +100°C)

Technical Architecture and Performance

Logic Cell Architecture

The XCV600E-6HQ240I features 15,552 logic cells organized into 3,456 Configurable Logic Blocks (CLBs). Each CLB contains multiple lookup tables (LUTs), flip-flops, and multiplexers, providing exceptional flexibility for implementing complex combinational and sequential logic circuits. This architecture enables designers to optimize their implementations for either maximum performance or minimum area consumption.

Memory Resources

With 294,912 bits of total RAM distributed throughout the device, the XCV600E-6HQ240I provides ample memory resources for data buffering, FIFO implementations, and embedded memory requirements. The memory architecture includes both distributed RAM (implemented using LUTs) and dedicated block RAM modules, offering designers flexibility in memory implementation strategies.

Clock Management System

The integrated clock management system features eight Delay-Locked Loops (DLLs) that provide:

  • Zero-delay clock distribution across the device
  • Clock multiplication and division capabilities
  • Digitally synthesized 50% duty cycle outputs for DDR applications
  • Low-jitter clock generation for timing-critical applications
  • Conversion of LVPECL/LVDS clocks to various I/O standards

Application Areas for XCV600E-6HQ240I

Telecommunications and Networking

The XCV600E-6HQ240I excels in telecommunications infrastructure where high-speed data processing and protocol handling are essential. Applications include:

  • Digital signal processing for wireless base stations
  • Packet processing and routing in network switches
  • Protocol conversion and interface bridging
  • Software-defined radio (SDR) implementations
  • Channel coding and error correction

Aerospace and Defense

The industrial temperature range and robust architecture make this Xilinx FPGA suitable for demanding aerospace applications such as:

  • Avionics control systems
  • Radar signal processing
  • Satellite communication systems
  • Navigation and guidance systems
  • Mission-critical data processing

Industrial Automation

In industrial environments, the XCV600E-6HQ240I provides reliable performance for:

  • Motor control and motion systems
  • Machine vision processing
  • Industrial protocol implementations
  • Real-time control systems
  • Sensor data acquisition and processing

Medical Equipment

The FPGA’s processing capabilities support advanced medical applications including:

  • Medical imaging systems (ultrasound, CT, MRI)
  • Patient monitoring equipment
  • Laboratory instrumentation
  • Diagnostic equipment interfaces
  • Real-time signal analysis

Design and Development Tools

Supported Development Environments

The XCV600E-6HQ240I is supported by AMD Xilinx’s comprehensive development tool suite:

  • Xilinx ISE Design Suite: Classic development environment for Virtex-E devices
  • Xilinx Foundation Series: Entry-level design software
  • Alliance Series Development System: Professional-grade design tools
  • Internet Team Design (ITD): Collaborative design for large-scale projects

Programming and Configuration

The SRAM-based configuration architecture enables:

  • Unlimited reprogrammability for design iterations
  • In-system configuration via JTAG boundary-scan
  • Multiple configuration modes (Master Serial, Slave Serial, SelectMAP)
  • Configuration memory interface for standalone operation
  • Partial reconfiguration capabilities for advanced applications

Performance Characteristics

Speed Grade Analysis

The “-6” speed grade indicates the middle performance tier within the Virtex-E family, offering:

  • Maximum operating frequency: 357 MHz
  • Balanced performance-to-power ratio
  • Predictable timing characteristics
  • Suitable for most commercial and industrial applications
  • Optimal cost-performance trade-off

Timing and Propagation Delays

Timing Parameter Typical Value
CLB Logic Delay 0.7 ns (typical)
Routing Delay 1.2 ns (typical)
Setup Time 0.5 ns (typical)
Clock-to-Out 1.0 ns (typical)
Global Clock Period 2.8 ns (minimum)

Package Information and Pin Configuration

240-HQFP Package Details

The Heat-sink Quad Flat Pack (HQFP) provides excellent thermal performance with:

  • Enhanced heat dissipation through exposed thermal pad
  • Compact 32mm x 32mm footprint
  • 0.5mm pin pitch for high-density PCB layouts
  • Corner pins for mechanical stability
  • Industry-standard SMT-compatible design

I/O Banking Structure

The 158 user I/O pins are organized into banks supporting:

  • Multiple voltage standards (LVTTL, LVCMOS, SSTL, HSTL, GTL)
  • Programmable drive strength and slew rate
  • Input threshold voltage programming
  • Differential signaling support (LVDS, LVPECL)
  • Mixed-voltage interface capabilities

Power Consumption and Thermal Management

Power Supply Requirements

Power Rail Voltage Range Typical Current Purpose
VCCINT 1.71V – 1.89V Device dependent Core logic supply
VCCO 1.2V – 3.3V Bank dependent I/O supply voltage
VCCAUX 2.375V – 2.625V 100-200 mA Auxiliary circuits

Thermal Considerations

Operating across the industrial temperature range (-40°C to +100°C junction temperature), the XCV600E-6HQ240I requires:

  • Adequate PCB thermal design with thermal vias
  • Heat-sink attachment to exposed thermal pad (recommended for high-utilization designs)
  • Proper airflow in enclosed systems
  • Temperature monitoring for mission-critical applications

Comparison with Related Virtex-E Devices

XCV600E Family Variants

Part Number Package I/O Count Temperature Range Speed Grade
XCV600E-6HQ240C 240-HQFP 158 Commercial (0°C to +85°C) -6
XCV600E-6HQ240I 240-HQFP 158 Industrial (-40°C to +100°C) -6
XCV600E-7HQ240I 240-HQFP 158 Industrial -7 (faster)
XCV600E-6FG680I 680-FBGA 512 Industrial -6
XCV600E-6BG432I 432-MBGA 316 Industrial -6

Quality and Reliability

Manufacturing Standards

As a legacy product from AMD (formerly Xilinx), the XCV600E-6HQ240I meets stringent quality standards:

  • Manufactured using proven 0.18µm CMOS process
  • Full production testing and characterization
  • Industry-standard reliability specifications
  • Long product lifecycle support (now obsolete but widely available through distributors)

Product Status and Availability

Current Status: Obsolete (no longer in active production) Market Availability: Available through authorized distributors and surplus markets Recommended for: Legacy system maintenance and repair New Design Recommendation: Consider current-generation AMD Xilinx FPGAs for new projects

Design Considerations and Best Practices

PCB Design Guidelines

When designing boards for the XCV600E-6HQ240I:

  1. Power Distribution: Implement multi-layer PCB with dedicated power planes
  2. Decoupling: Place 0.1µF and 10µF capacitors near each power pin group
  3. Signal Integrity: Use controlled impedance routing for high-speed signals
  4. Thermal Management: Include thermal vias under the exposed pad
  5. Configuration: Provide accessible JTAG connection for programming

Configuration Strategy

Recommended configuration approaches:

  • Development: JTAG boundary-scan for rapid prototyping
  • Production: Serial or parallel flash memory for standalone operation
  • Field Updates: Maintain JTAG access for firmware updates
  • Security: Implement bitstream encryption for IP protection

Software and IP Core Support

Available IP Cores

The Virtex-E architecture supports numerous pre-verified IP cores:

  • Memory controllers (SDRAM, DDR, SRAM)
  • Communication interfaces (UART, SPI, I2C, Ethernet)
  • Digital signal processing blocks (FIR filters, FFT)
  • Bus interfaces (PCI, USB, CAN)
  • Video processing pipelines
  • Cryptographic accelerators

HDL Design Compatibility

The XCV600E-6HQ240I supports industry-standard hardware description languages:

  • VHDL: Full IEEE 1076 compliance
  • Verilog: IEEE 1364 standard support
  • SystemVerilog: Partial support through synthesis tools
  • Schematic Capture: Legacy schematic entry available

Frequently Asked Questions

Is the XCV600E-6HQ240I suitable for new designs?

While this FPGA is obsolete, it remains suitable for replacement purposes and legacy system support. For new designs, AMD Xilinx recommends current-generation devices with enhanced features and performance.

What is the difference between commercial and industrial temperature grades?

The “I” suffix indicates industrial temperature range (-40°C to +100°C), while “C” devices operate from 0°C to +85°C. Industrial-grade devices undergo additional testing and qualification.

Can I migrate designs from XCV600E-6HQ240I to newer FPGAs?

Design migration is possible but requires careful review of timing, resource utilization, and I/O compatibility. AMD Xilinx provides migration guides for transitioning to newer device families.

What programming cables are compatible?

The XCV600E-6HQ240I is compatible with Xilinx Platform Cable USB, Platform Cable II, and various third-party JTAG programmers supporting IEEE 1149.1 boundary-scan.

Are there pin-compatible alternatives?

The XCV600E family offers different package options, but exact pin-compatible replacements may be limited. Consult AMD Xilinx documentation or distributor technical support for recommended alternatives.

Conclusion

The XCV600E-6HQ240I represents a proven, reliable FPGA solution from AMD’s Virtex-E family, offering 15,552 logic cells, 158 I/O pins, and industrial temperature operation in a compact 240-pin HQFP package. While now obsolete, this device continues to serve in existing designs across telecommunications, aerospace, industrial automation, and medical equipment applications.

For engineers maintaining legacy systems or sourcing replacement components, the XCV600E-6HQ240I remains available through authorized distributors and surplus channels. Its robust architecture, comprehensive development tool support, and well-documented characteristics make it a dependable choice for system upgrades and repairs.

When considering FPGAs for new projects, explore current AMD Xilinx offerings that provide enhanced performance, lower power consumption, and modern features while maintaining the architectural excellence pioneered by the Virtex-E family.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.