Overview of XCV600E-6BG560I FPGA

The XCV600E-6BG560I is a professional-grade Field Programmable Gate Array (FPGA) from AMD’s (formerly Xilinx) acclaimed Virtex-E family. This industrial-temperature FPGA delivers exceptional programmable logic performance with 404 user I/Os, making it ideal for complex digital designs requiring high-speed signal processing and reliable operation in demanding environments.

Manufactured using advanced 0.18μm CMOS technology with a 6-layer metal process, the XCV600E-6BG560I provides designers with a powerful, flexible alternative to mask-programmed gate arrays. Its 560-pin Metal BGA package offers excellent thermal performance and signal integrity for mission-critical applications.

Key Features and Specifications

Core FPGA Capabilities

The XCV600E-6BG560I stands out in the Xilinx FPGA portfolio with these impressive specifications:

• Logic Capacity: 294,912 system gates (186,624K gates equivalent)
• Configurable Logic Blocks: 15,552 logic cells
• User I/O Pins: 404 programmable I/O
• Operating Frequency: Up to 357 MHz maximum performance
• Core Voltage: 1.8V low-power operation
• Package Type: 560-LBGA (Land Ball Grid Array) with exposed pad for superior thermal dissipation

Technical Specifications Table

Performance Characteristics

Speed Grade and Timing

The -6 speed grade designation indicates this FPGA variant delivers maximum performance within the Virtex-E family:

• System Clock Frequency: Up to 357 MHz
• Routing Delay: Optimized interconnect hierarchy
• I/O Standards Support: Multiple voltage standards including LVTTL, LVCMOS, GTL+, HSTL, and more
• Setup/Hold Times: Industry-leading timing performance

Architecture Advantages

Package Details: 560-LBGA

Physical Dimensions and Layout

The XCV600E-6BG560I utilizes a 560-pin Land Ball Grid Array (LBGA) package optimized for high-density applications:

Thermal Performance

The exposed pad design provides:

• Superior heat transfer from die to PCB
• Lower junction temperatures during operation
• Extended reliability in industrial environments
• Reduced need for external heatsinks in many applications

Application Areas

Primary Use Cases

The XCV600E-6BG560I excels in applications requiring:

1. High-Speed Data Processing
   • Digital signal processing (DSP)
   • Real-time data acquisition
   • Video/image processing pipelines
   • Software-defined radio (SDR)
2. Industrial Control Systems
   • Motor control and automation
   • Process control interfaces
   • Industrial networking protocols
   • PLC (Programmable Logic Controller) functions
3. Communications Infrastructure
   • Protocol converters
   • Network packet processing
   • Telecommunication equipment
   • Baseband processing
4. Test and Measurement
   • Logic analyzers
   • Oscilloscope trigger systems
   • Automated test equipment (ATE)
   • High-speed data capture

Industry Sectors Table

Design and Development

Supported Tools

Engineers can develop with the XCV600E-6BG560I using:

• Xilinx ISE Design Suite: Legacy toolchain for Virtex-E devices
• HDL Support: VHDL and Verilog synthesis
• IP Cores: Xilinx CoreGen system integration
• Simulation: ModelSim, ISim compatibility
• Programming: JTAG boundary scan interface

Programming and Configuration

Temperature Range and Reliability

Industrial Temperature Specification

The “I” suffix designates industrial temperature range operation:

• Ambient Operating Range: -40°C to +100°C
• Junction Temperature (TJ): -40°C to +100°C
• Storage Temperature: -65°C to +150°C
• Thermal Resistance (θJA): Package-dependent

Reliability Features Table

Power Consumption

Voltage Requirements

Power Optimization

• Dynamic power scales with switching frequency
• Static power optimized through 0.18μm process
• Multiple I/O voltage banks for power efficiency
• DLL power-down modes available

Comparison with Related Products

Virtex-E Family Comparison

Upgrade Path Considerations

For new designs, consider modern alternatives:

• Spartan-6 Family: Cost-optimized with lower power
• Artix-7 Family: Superior performance per watt
• Kintex-7 Family: High-performance replacement
• Zynq-7000: System-on-chip with ARM processors

Availability and Sourcing

Product Status

Important Notice: The XCV600E-6BG560I is classified as obsolete by AMD (Xilinx). However, it remains available through:

• Authorized distributors with remaining stock
• Electronic component brokers and surplus suppliers
• Aftermarket and obsolescence management specialists
• Authorized refurbishment sources

Sourcing Recommendations Table

Quality and Authentication

Ensuring Genuine Parts

When sourcing XCV600E-6BG560I devices:

1. Verify Supplier Credentials: Check for authorized distributor status
2. Inspect Packaging: Look for original Xilinx packaging and labels
3. Check Date Codes: Verify manufacturing dates align with product lifecycle
4. Test Upon Receipt: Perform functional verification
5. Request Certificates: Obtain certificate of conformance (C of C)
6. Counterfeit Protection: Be aware of common counterfeit indicators

Quality Assurance Checklist

Design Considerations

PCB Layout Guidelines

For optimal XCV600E-6BG560I performance:

Power Distribution

• Use dedicated power planes for VCCINT and VCCO
• Place decoupling capacitors close to BGA balls
• Implement proper power plane partitioning for I/O banks

Signal Integrity

• Match impedance for high-speed signals (50Ω or 100Ω differential)
• Minimize stub lengths on clock and critical signals
• Use controlled impedance traces for I/O standards

Thermal Management

• Connect exposed pad to thermal ground plane
• Consider thermal vias under the package
• Evaluate heatsink requirements for high-utilization designs

Design Resources Table

Support and Documentation

Available Resources

• Product Datasheet: Full electrical and mechanical specifications
• Package Information: Dimensions, ball assignments, thermal data
• Programming Files: BSDL, IBIS models for simulation
• User Guides: Virtex-E family configuration and operation
• Answer Records: Troubleshooting and known issues

Technical Support

Environmental and Compliance

Regulatory Information

Note: For RoHS-compliant alternatives, consult current AMD (Xilinx) product lines.

Pricing and Lead Time

Market Conditions

Pricing for XCV600E-6BG560I varies significantly based on:

• Available inventory levels
• Order quantity (volume discounts available)
• Part condition (new, refurbished, tested pulls)
• Supplier type (authorized vs. independent)
• Market demand for legacy Virtex-E devices

Typical Lead Times

Conclusion: XCV600E-6BG560I in Modern Designs

The XCV600E-6BG560I represents proven FPGA technology that continues to serve in legacy systems and specialized applications. While classified as obsolete, this Virtex-E device remains a reliable choice for:

• Maintenance and repair of existing systems
• Drop-in replacements for failed components
• Extended lifecycle production runs
• Cost-sensitive legacy applications

For new designs, engineers should evaluate current-generation AMD (Xilinx) FPGAs offering superior performance, lower power consumption, and active product support.