Overview of XCV600E-6BG560C FPGA
The XCV600E-6BG560C is a sophisticated Field Programmable Gate Array (FPGA) from AMD’s (formerly Xilinx) Virtex-E family, delivering exceptional programmable logic capabilities for complex digital systems. This high-density FPGA combines advanced 0.18μm CMOS process technology with a comprehensive 6-layer metal architecture, making it an ideal choice for demanding applications in telecommunications, industrial automation, and embedded systems.
As part of the renowned Virtex-E series, the XCV600E-6BG560C represents a significant evolution in programmable logic design, offering designers unprecedented flexibility and performance in a single integrated circuit.
Key Features and Specifications
Core Technical Specifications
| Specification |
Value |
| Part Number |
XCV600E-6BG560C |
| Manufacturer |
AMD (Xilinx) |
| Product Family |
Virtex-E 1.8V FPGAs |
| Logic Cells |
15,552 cells |
| System Gates |
294,912 gates (typical) |
| Maximum Gates |
Up to 661,111 gates |
| Operating Voltage |
1.8V |
| Package Type |
560-Pin Metal BGA (Ball Grid Array) |
| I/O Pins |
404 user I/O |
| Operating Speed |
357 MHz |
| Process Technology |
0.18μm CMOS |
| Metal Layers |
6-layer architecture |
Performance Characteristics
| Parameter |
Specification |
| Speed Grade |
-6 (high performance) |
| Configuration Memory |
Block RAM available |
| Interconnect Architecture |
Hierarchical, high-speed |
| Logic Architecture |
Optimized for place-and-route efficiency |
| Package Dimensions |
560-pin MBGA exposed pad, metal |
| RoHS Status |
RoHS non-compliant |
| Product Status |
Obsolete (legacy support available) |
XCV600E-6BG560C Architecture and Design
Advanced FPGA Architecture
The XCV600E-6BG560C leverages Virtex-E architecture innovations that dramatically enhance silicon efficiency. The device incorporates an aggressive 6-layer metal CMOS process at 0.18 microns, enabling higher routing density and improved signal integrity compared to previous generations.
Key architectural features include:
- Hierarchical Interconnect Resources: Fast, flexible routing for efficient signal distribution
- Optimized Logic Blocks: Enhanced Configurable Logic Blocks (CLBs) for superior performance
- Dedicated Memory Blocks: Integrated block RAM for data storage and buffering
- Advanced I/O Capabilities: 404 user-configurable I/O pins supporting various standards
- Clock Management: Sophisticated clock distribution networks for timing optimization
Programming and Configuration
The Xilinx FPGA platform supports multiple configuration modes, allowing designers to select the most appropriate method for their application. The XCV600E-6BG560C can be programmed using industry-standard tools including Xilinx ISE Design Suite and Vivado (with legacy support).
Applications and Use Cases
Industrial and Commercial Applications
| Application Domain |
Typical Uses |
| Telecommunications |
Protocol processing, signal routing, network interfaces |
| Industrial Control |
PLC logic, motor control, sensor interfacing |
| Data Processing |
High-speed data acquisition, parallel processing |
| Medical Equipment |
Imaging systems, diagnostic equipment, patient monitoring |
| Aerospace/Defense |
Signal processing, radar systems, secure communications |
| Test & Measurement |
Logic analyzers, oscilloscopes, pattern generators |
Design Advantages
The XCV600E-6BG560C delivers several key advantages for system designers:
- High Logic Density: 15,552 logic cells provide ample resources for complex designs
- Flexible I/O Configuration: 404 I/O pins support multiple voltage standards
- Fast Performance: 357 MHz operating frequency enables real-time processing
- Proven Reliability: Virtex-E family heritage ensures robust operation
- Design Security: Configuration security features protect intellectual property
Technical Comparison
Virtex-E Family Positioning
| Model |
Logic Cells |
System Gates |
I/O Count |
Package |
| XCV50E |
1,728 |
57,344 |
176 |
Various |
| XCV300E |
6,912 |
229,376 |
260-404 |
Various |
| XCV600E-6BG560C |
15,552 |
294,912 |
404 |
560-BGA |
| XCV1000E |
27,648 |
917,504 |
404-804 |
Various |
| XCV2000E |
43,200 |
1,433,600 |
660-804 |
Various |
Package and Physical Characteristics
BGA Package Details
The 560-pin Metal Ball Grid Array package offers several benefits:
- Compact Footprint: Efficient PCB space utilization
- Superior Thermal Performance: Metal construction aids heat dissipation
- High-Speed Signal Integrity: Short interconnect paths reduce parasitics
- Reliable Connections: Ball grid array ensures robust solder joints
- Exposed Pad Design: Enhanced thermal and electrical performance
Pin Configuration
| Pin Type |
Count |
Purpose |
| User I/O |
404 |
Configurable digital I/O |
| Power Supply |
Variable |
VCC, VCCINT, VCCAUX |
| Ground |
Variable |
GND connections |
| Configuration |
Dedicated |
Programming and mode pins |
Development and Design Support
Design Tools Compatibility
The XCV600E-6BG560C is fully supported by Xilinx development environments:
- ISE Design Suite: Primary development environment for Virtex-E
- Vivado Design Suite: Legacy support for migration projects
- IP Cores: Extensive library of pre-verified functional blocks
- Constraint Files: UCF/XDC templates for timing and placement
Design Resources
| Resource Type |
Availability |
| Datasheet |
PDF documentation available |
| User Guides |
Application notes and reference manuals |
| Development Boards |
Third-party evaluation platforms |
| Design Examples |
Reference designs and tutorials |
| Technical Support |
Community forums and FAQs |
Procurement and Availability
Sourcing Information
While the XCV600E-6BG560C is listed as obsolete by AMD, the component remains available through:
- Authorized electronic component distributors
- Surplus and excess inventory channels
- Original equipment manufacturer (OEM) suppliers
- Electronic component brokers specializing in legacy parts
Quality Assurance
When sourcing XCV600E-6BG560C devices, ensure:
- Authenticity Verification: Confirm genuine AMD/Xilinx origin
- Date Code Inspection: Check manufacturing date and storage conditions
- Testing Protocols: Request pre-shipment inspection reports
- Anti-Static Packaging: Verify proper ESD protection
- Documentation: Obtain certificates of conformance
Power and Thermal Management
Power Supply Requirements
| Supply Rail |
Voltage |
Purpose |
| VCCINT |
1.8V |
Core logic power |
| VCCAUX |
2.5V/3.3V |
Auxiliary circuits |
| VCCO |
Variable |
I/O bank power (1.5V-3.3V) |
Thermal Considerations
Proper thermal management is essential for reliable operation:
- Operating Temperature Range: Specified in datasheet
- Junction Temperature: Monitor to prevent thermal overstress
- Heat Sink Requirements: Based on power dissipation calculations
- Airflow Design: Ensure adequate cooling in system enclosure
Migration and Alternatives
Modern Equivalent Devices
For new designs, consider these current-generation alternatives:
| Modern Alternative |
Family |
Key Advantages |
| Artix-7 Series |
7-Series |
Lower power, modern tools |
| Spartan-7 Series |
7-Series |
Cost-effective option |
| Zynq-7000 |
SoC |
Integrated ARM processor |
Migration Considerations
When migrating from XCV600E-6BG560C:
- Logic Capacity: Ensure sufficient resources in target device
- I/O Standards: Verify compatibility with system requirements
- Timing Constraints: Re-verify all timing specifications
- IP Core Availability: Check for equivalent functional blocks
- Tool Migration: Update to current development software
Frequently Asked Questions
What is the XCV600E-6BG560C used for?
The XCV600E-6BG560C FPGA is used for implementing custom digital logic in applications requiring high performance, flexibility, and moderate logic density, including telecommunications equipment, industrial controllers, and embedded processing systems.
Is the XCV600E-6BG560C still in production?
No, the XCV600E-6BG560C is listed as obsolete by AMD. However, inventory remains available through distributors and surplus suppliers for existing design support and repair applications.
What development tools support XCV600E-6BG560C?
The primary development tool is Xilinx ISE Design Suite. For newer workflows, Vivado Design Suite provides legacy support for Virtex-E devices, though ISE remains the recommended environment.
What is the operating voltage for XCV600E-6BG560C?
The core logic (VCCINT) operates at 1.8V, with auxiliary voltage (VCCAUX) typically at 2.5V or 3.3V, and I/O voltages (VCCO) configurable from 1.5V to 3.3V depending on the I/O standard selected.
What package does the XCV600E-6BG560C use?
The device uses a 560-pin Metal Ball Grid Array (MBGA) package with an exposed pad for enhanced thermal and electrical performance.
Conclusion
The XCV600E-6BG560C represents a proven FPGA solution from AMD’s Virtex-E family, offering 15,552 logic cells, 404 I/O pins, and 357 MHz performance in a compact 560-pin BGA package. While designated as obsolete, this device continues to serve critical roles in legacy systems and applications where its specific capabilities match design requirements.
For engineers maintaining existing designs or supporting fielded equipment, the XCV600E-6BG560C remains available through authorized channels. For new projects, AMD’s current-generation FPGA families offer superior performance, lower power consumption, and enhanced features while maintaining the programmable logic advantages that made Virtex-E successful.
Whether you’re sourcing components for production support or exploring migration options, understanding the XCV600E-6BG560C’s architecture, capabilities, and ecosystem ensures optimal implementation and long-term system success.
