Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCV50E-FG256AGT: High-Performance Virtex-E FPGA for Advanced Embedded Systems

Product Details

Overview: AMD Xilinx XCV50E-FG256AGT FPGA

The XCV50E-FG256AGT is a high-performance Field Programmable Gate Array (FPGA) from AMD’s renowned Virtex-E family. This programmable logic device delivers exceptional flexibility and processing power for demanding embedded applications, making it an ideal choice for engineers seeking reliable, adaptable digital solutions. As part of the legacy Xilinx FPGA product line, this component continues to serve critical roles in telecommunications, industrial automation, and aerospace systems.

Key Technical Specifications

The XCV50E-FG256AGT stands out with its robust technical capabilities optimized for complex digital signal processing and high-speed data operations.

Specification Value
Manufacturer AMD (formerly Xilinx)
Product Family Virtex-E 1.8V FPGAs
Part Number XCV50E-FG256AGT
System Gates 71,693 gates
Logic Cells 1,728 cells
CLB Array 16 x 24 configuration
LABs/CLBs 384
Total RAM Bits 65,536 bits
Maximum Clock Frequency Up to 357 MHz
Core Voltage 1.8V (1.71V – 1.89V)
Process Technology 0.18 μm CMOS, 6-layer metal

Package and Pin Configuration

Package Details Specifications
Package Type 256-Ball Fine-Pitch Ball Grid Array (FBGA)
Package Dimensions 17mm x 17mm
Total Pin Count 256 pins
User I/O Pins 176 I/O
Mounting Type Surface Mount Technology (SMT)
Moisture Sensitivity Level MSL 3 (168 hours)

Operating Conditions

Environmental Parameter Range
Operating Temperature 0°C to +85°C (TJ) for commercial grade
Extended Temperature -40°C to +100°C (TJ) for industrial variants
RoHS Compliance Contains lead / RoHS non-compliant (legacy product)

Architecture and Performance Features

Advanced FPGA Architecture

The XCV50E-FG256AGT leverages Virtex-E’s optimized architecture designed for maximum place-and-route efficiency. The device features an aggressive 6-layer metal 0.18 μm CMOS process that delivers dramatic improvements in silicon efficiency compared to earlier FPGA generations.

Core Architectural Highlights:

  • High-density programmable logic blocks with enhanced routing resources
  • SelectRAM+ embedded memory blocks for flexible data storage
  • Advanced clock management with DLL (Delay-Locked Loop) technology
  • Highly flexible SelectI/O+ technology supporting multiple I/O standards

Digital Signal Processing Capabilities

This FPGA excels in DSP-intensive applications with dedicated resources for:

  • High-speed digital filtering operations
  • Real-time signal encoding and decoding
  • Complex mathematical computations
  • Multi-channel data processing

Memory Architecture

The integrated SelectRAM+ blocks provide distributed and block RAM options, offering 65,536 total RAM bits that can be configured flexibly to meet application-specific memory requirements.

Primary Applications and Use Cases

Telecommunications and Networking

The XCV50E-FG256AGT is widely deployed in communication infrastructure for:

  • Protocol conversion and packet processing
  • Channel encoding/decoding operations
  • Signal conditioning and filtering
  • Network traffic management
  • Base station signal processing

Industrial Automation and Control

In industrial environments, this FPGA powers:

  • Motion control systems
  • Real-time machine vision processing
  • Sensor data acquisition and processing
  • Industrial protocol implementations
  • Programmable logic controllers (PLCs)

Aerospace and Defense Systems

The reliability and performance characteristics make it suitable for:

  • Navigation system processing
  • Satellite communication terminals
  • Radar signal processing
  • Avionics control systems
  • Mission-critical embedded applications

Consumer Electronics and Medical Devices

Additional application areas include:

  • Medical imaging equipment
  • High-definition video processing
  • Test and measurement instruments
  • Automotive electronic control units
  • Scientific instrumentation

Programming and Development Tools

Supported Design Software

The XCV50E-FG256AGT is compatible with legacy Xilinx development tools:

  • Xilinx ISE Foundation Series™: Comprehensive design entry and synthesis
  • Xilinx Alliance Series™: Advanced development environment
  • HDL Support: VHDL and Verilog hardware description languages
  • Schematic Entry: Graphical design capture capabilities

Note: This device is not supported in the newer Vivado Design Suite, but legacy ISE tools remain available for download and continue to provide full development capabilities.

Configuration Methods

Multiple configuration options provide flexibility for different deployment scenarios:

Configuration Mode Description Best For
JTAG Serial configuration via boundary scan Development, debugging, field updates
SelectMAP Parallel configuration interface Fast production programming
Master Serial SPI flash-based configuration Autonomous system startup
Slave Serial Host-controlled serial loading Multi-FPGA systems

Design Development Workflow

  1. Design Entry: Create designs using HDL or schematic capture
  2. Simulation: Verify functionality with ModelSim or other simulators
  3. Synthesis: Generate gate-level netlist from RTL code
  4. Implementation: Place and route design onto FPGA fabric
  5. Timing Analysis: Ensure timing constraints are met
  6. Bitstream Generation: Create configuration file
  7. Programming: Load bitstream via selected configuration mode

Advantages Over Alternative Solutions

Why Choose XCV50E-FG256AGT?

Legacy System Compatibility: Ideal for maintaining and upgrading existing systems designed around Virtex-E FPGAs, avoiding costly redesigns.

Cost-Effective Performance: Delivers robust performance at lower cost points compared to latest-generation FPGAs for applications that don’t require cutting-edge features.

Proven Reliability: Decades of field deployment demonstrate exceptional reliability in mission-critical applications.

Lower Power Consumption: The 0.18 μm process and 1.8V core voltage provide efficient power characteristics suitable for embedded systems.

Extensive IP and Reference Designs: Mature ecosystem with abundant intellectual property cores and design examples.

Comparison with Modern FPGAs

While newer FPGA families offer advanced features like AI acceleration and higher speed grades, the XCV50E-FG256AGT remains competitive for:

  • Applications with established timing requirements
  • Systems requiring long-term availability
  • Budget-conscious projects
  • Legacy equipment maintenance

Technical Support and Documentation

Available Resources

Engineers working with the XCV50E-FG256AGT have access to comprehensive technical documentation:

  • Detailed product datasheets with electrical characteristics
  • Application notes for specific use cases
  • Reference designs and IP cores
  • PCB layout guidelines for FBGA package
  • Thermal management recommendations

Design Considerations

Thermal Management: The 256-FBGA package requires appropriate thermal design with adequate airflow or heatsinking for sustained high-performance operation.

Power Supply Design: Stable 1.8V core power with proper decoupling capacitors is essential for reliable operation. Multiple power domains may require careful sequencing.

Signal Integrity: High-speed I/O operation demands attention to PCB trace impedance, termination, and ground plane design.

Procurement and Availability

Supply Chain Information

The XCV50E-FG256AGT is available through:

  • Authorized AMD/Xilinx distributors
  • Electronic component brokers
  • Independent component suppliers
  • Surplus and obsolete component specialists

Important Note: This product is marked as “NOT RECOMMENDED for NEW DESIGN” by the manufacturer, indicating it is in the mature/declining phase of its lifecycle. Engineers should consider this when planning new projects with multi-year production horizons.

Quality Assurance

When sourcing XCV50E-FG256AGT components:

  • Verify authenticity through authorized channels
  • Check date codes and storage conditions
  • Request certificates of conformance
  • Consider pre-shipment inspection for critical applications
  • Validate part markings against datasheet specifications

Replacement and Migration Options

Alternative Part Numbers

Similar Virtex-E family members that may serve as alternatives:

  • XCV50E-6FG256C: Different speed grade variant
  • XCV50E-7FG256I: Industrial temperature range option
  • XCV50E-8FG256C: Higher speed grade version
  • XCV100E-FG256: Higher gate count in same package

Migration Path to Modern FPGAs

For new designs, consider migration to:

  • AMD Spartan-7 series for cost-optimized applications
  • AMD Artix-7 series for performance-oriented designs
  • AMD Zynq-7000 for SoC functionality
  • AMD UltraScale+ for advanced features

AMD provides migration guides and support for transitioning legacy Virtex-E designs to current FPGA architectures.

Frequently Asked Questions

What is the difference between XCV50E-FG256AGT and similar part numbers?

The suffix indicates speed grade and temperature range. The “A” typically denotes automotive-grade qualification, while different speed grades (-6, -7, -8) indicate maximum operating frequencies.

Can I use Vivado to program the XCV50E-FG256AGT?

No, the XCV50E-FG256AGT requires legacy Xilinx ISE tools. Vivado does not support Virtex-E family devices.

What I/O standards does this FPGA support?

The SelectI/O+ technology supports LVTTL, LVCMOS, PCI, GTL, HSTL, SSTL, and other common I/O standards with programmable drive strength and termination.

Is this FPGA suitable for new product development?

While technically capable, the manufacturer no longer recommends this device for new designs. Consider modern FPGA families for new projects requiring long-term production support.

How do I ensure authentic parts when purchasing?

Source from authorized distributors, verify part markings, request authenticity certificates, and consider using component authentication services for critical applications.

Conclusion: Reliable Performance for Established Applications

The XCV50E-FG256AGT Virtex-E FPGA continues to provide valuable programmable logic solutions for maintaining existing systems and specialized applications where its specific characteristics align with project requirements. With 71,693 system gates, 1,728 logic cells, and proven 0.18 μm CMOS technology, this device delivers dependable performance for telecommunications, industrial control, and embedded computing applications.

While positioned as a legacy product not recommended for new designs, the XCV50E-FG256AGT remains a critical component for sustaining infrastructure, aerospace, and industrial equipment with multi-decade service lives. Engineers appreciate its cost-effectiveness, proven reliability, and the extensive knowledge base surrounding the Virtex-E architecture.

For organizations maintaining Virtex-E-based systems, the XCV50E-FG256AGT offers a path to continued operation while planning strategic migrations to current FPGA technologies. The robust ecosystem of development tools, IP cores, and technical documentation ensures that teams can effectively support and enhance existing designs.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.