Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCV50E-6PQ240C: High-Performance Virtex-E FPGA for Advanced Digital Logic Applications

Product Details

Overview of XCV50E-6PQ240C FPGA

The XCV50E-6PQ240C is a premium Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Virtex-E family, designed to deliver exceptional performance in demanding digital logic applications. This powerful programmable logic device combines high-speed processing capabilities with flexible configuration options, making it an ideal solution for telecommunications, industrial automation, aerospace, and embedded system designs.

As part of the Virtex-E series, the XCV50E-6PQ240C represents a significant advancement in FPGA technology, offering designers the perfect balance of performance, capacity, and power efficiency for complex digital signal processing and real-time control applications.

Key Technical Specifications

Core Architecture and Performance

Specification Value
System Gates 71,693 gates
Logic Cells 1,728 cells
CLB Array 16 x 24 configuration
RAM Size 8 kB
Maximum Clock Frequency Up to 357 MHz
Core Voltage 1.8V
Process Technology 0.18 µm CMOS
Package Type 240-pin PQFP (Plastic Quad Flat Pack)
I/O Pins 158 user I/O
Speed Grade -6 (standard performance)

Package and Pin Configuration

Parameter Details
Package Code PQ240C
Total Pins 240
Pin Pitch Standard PQFP spacing
Mounting Type Surface Mount Technology (SMT)
Operating Temperature Range Commercial (0°C to +85°C)

Advanced Features and Capabilities

Digital Signal Processing Excellence

The XCV50E-6PQ240C excels in digital signal processing applications, offering robust capabilities for:

  • High-Speed Filtering: Process complex filter algorithms with exceptional speed
  • Signal Encoding/Decoding: Support for various communication protocols
  • Real-Time Data Processing: Handle streaming data at high throughput rates
  • Adaptive Signal Processing: Dynamic reconfiguration for changing requirements

Programmable Logic Architecture

The device features a sophisticated programmable logic architecture optimized for:

  1. Configurable Logic Blocks (CLBs): 384 LABs/CLBs providing maximum flexibility
  2. Embedded RAM: 8 kB of integrated memory for data buffering and storage
  3. Dedicated Routing Resources: Fast interconnect for minimal propagation delay
  4. I/O Standards Support: Compatible with multiple voltage levels and signaling standards

Dynamic Reconfiguration

One of the standout features of the XCV50E-6PQ240C is its support for dynamic partial reconfiguration, enabling:

  • On-the-fly protocol switching in Software Defined Radio (SDR) applications
  • Adaptive system behavior based on operational requirements
  • Reduced power consumption through selective module activation
  • Extended system lifetime through firmware updates

Primary Applications and Use Cases

Telecommunications and Networking

The XCV50E-6PQ240C is extensively used in telecommunications infrastructure for:

  • Base Station Processing: Signal conditioning and protocol handling
  • Network Packet Processing: High-speed data routing and switching
  • Software Defined Radio: Flexible radio frequency processing
  • Channel Coding: Error correction and encoding for reliable transmission

Industrial Automation and Control

Manufacturing and process control systems benefit from:

  • Motion Control: Precise servo and stepper motor control algorithms
  • Sensor Data Acquisition: Multi-channel, high-speed data collection
  • PLC Enhancement: Extended functionality for programmable logic controllers
  • Real-Time Monitoring: Critical system parameter tracking

Aerospace and Defense Systems

Mission-critical applications include:

  • Navigation Systems: GPS and inertial navigation processing
  • Satellite Communication: Onboard signal processing and routing
  • Radar Signal Processing: Target detection and tracking algorithms
  • Avionics Control: Flight control system implementation

Medical Imaging Equipment

Healthcare technology applications encompass:

  • MRI Image Processing: Real-time reconstruction algorithms
  • CT Scan Data Processing: High-speed tomographic image generation
  • Ultrasound Signal Processing: Beamforming and image enhancement
  • Diagnostic Equipment Control: Precision timing and synchronization

Hardware Emulation and Prototyping

Development and testing platforms utilize the FPGA for:

  • ASIC Prototyping: Pre-silicon validation of custom chip designs
  • System Architecture Validation: Performance testing before production
  • Custom Logic Circuit Development: Rapid iteration and optimization
  • Hardware-in-the-Loop Testing: Real-time system simulation

Programming and Development

Design Tools and Software

The XCV50E-6PQ240C is supported by industry-standard Xilinx FPGA development tools:

  • Xilinx ISE Design Suite: Comprehensive development environment
  • Foundation Series: Entry-level design tools for schematic capture
  • Alliance Series: Advanced development with HDL support
  • Vivado Design Suite: Modern tool suite for enhanced productivity

Development Workflow

Stage Process Tools
1. Design Entry Schematic or HDL coding (VHDL/Verilog) ISE Project Navigator
2. Simulation Functional and timing verification ModelSim, ISE Simulator
3. Synthesis Converting HDL to netlist XST Synthesizer
4. Implementation Place and route optimization PAR Tools
5. Programming Bitstream generation and device configuration iMPACT, Platform Cable

HDL Programming Languages

The device supports standard hardware description languages:

  • VHDL: Industry-standard for structured design
  • Verilog: Popular for digital circuit description
  • SystemVerilog: Advanced verification capabilities
  • Schematic Entry: Visual design capture for simpler projects

Performance Advantages

Speed and Timing

Performance Metric Specification
Maximum Toggle Rate 357 MHz
Logic Delay Optimized for speed grade -6
Clock-to-Output Fast I/O buffers
Setup Time Meets JEDEC standards
Routing Delay Minimized through architecture

Power Efficiency

The 0.18 µm CMOS process technology delivers:

  • Low Static Power: Reduced leakage current
  • Dynamic Power Management: Clock gating support
  • Core Voltage: Efficient 1.8V operation
  • I/O Voltage Flexibility: Support for 3.3V, 2.5V, and 1.8V standards

Reliability and Quality Assurance

Manufacturing Standards

AMD Xilinx maintains rigorous quality standards:

  • ISO 9001 Certified: Quality management systems
  • Automotive Grade Available: AEC-Q100 qualified variants
  • RoHS Compliant: Lead-free manufacturing process
  • Conflict-Free Sourcing: Responsible supply chain management

Product Longevity

The XCV50E-6PQ240C offers:

  • Extended Product Lifecycle: Continued availability for legacy systems
  • Long-Term Support: Technical documentation and design resources
  • Upward Migration Path: Compatible with newer Xilinx families
  • Reference Designs: Proven application examples

Comparison with Related Products

XCV50E Family Variants

Part Number Package Speed Grade I/O Count Application Focus
XCV50E-6PQ240C 240-PQFP -6 158 General purpose, commercial
XCV50E-7PQ240C 240-PQFP -7 158 Higher performance
XCV50E-8PQ240C 240-PQFP -8 158 Maximum speed
XCV50E-6FG256C 256-FBGA -6 176 Higher I/O count
XCV50E-6CS144C 144-CSBGA -6 92 Compact applications

Competitive Positioning

The XCV50E-6PQ240C competes with:

  • Altera Flex 10K Series: Alternative CPLD/FPGA solutions
  • Lattice iSP MACH Series: Lower cost alternatives
  • Actel ProASIC3: Flash-based FPGA options
  • QuickLogic Eclipse II: Low-power alternatives

Design Considerations and Best Practices

Thermal Management

Consideration Recommendation
Junction Temperature Monitor TJ during operation
Heat Sink Requirements Required for high-utilization designs
Airflow Ensure adequate ventilation
Thermal Impedance Refer to package thermal characteristics
Power Dissipation Calculate based on design utilization

PCB Layout Guidelines

Essential layout considerations include:

  1. Power Plane Design: Dedicated VCC and GND planes
  2. Decoupling Capacitors: Place close to power pins
  3. Signal Integrity: Controlled impedance for high-speed signals
  4. Clock Distribution: Star or H-tree topology recommended
  5. Configuration Interface: Proper routing for JTAG/configuration

Configuration Options

Configuration Mode Description Use Case
Master Serial FPGA controls configuration PROM Stand-alone systems
Slave Serial External processor controls config Embedded systems
JTAG Boundary scan and programming Development/testing
SelectMAP Parallel configuration interface Fast configuration required

Ordering and Availability

Part Number Nomenclature

XCV50E-6PQ240C breakdown:

  • XCV: Xilinx Virtex family identifier
  • 50E: Device size and enhanced version
  • -6: Speed grade (standard performance)
  • PQ: Package type (Plastic Quad Flat Pack)
  • 240: Pin count
  • C: Commercial temperature range

Package Markings

Authentic devices feature:

  • AMD/Xilinx logo
  • Part number: XCV50E-6PQ240C
  • Date code
  • Country of origin
  • Lot/batch traceability code

Technical Support and Resources

Documentation

Available technical resources:

  • Datasheet: Complete electrical and timing specifications
  • User Guide: Architecture and design methodology
  • Application Notes: Design tips and reference circuits
  • Selection Guide: Family comparison and product selection
  • Migration Guides: Upgrading from previous generations

Design Support

AMD Xilinx provides comprehensive support:

  • Technical Forum: Community-driven problem solving
  • FAE Support: Field Application Engineer assistance
  • Training Materials: Online courses and tutorials
  • Reference Designs: Proven application examples
  • IP Cores: Pre-verified functional blocks

Environmental and Compliance

Regulatory Compliance

Standard Status
RoHS Compliant
REACH Registered
WEEE Compliant
Conflict Minerals Certified conflict-free
CE Marking Applicable for system integration

Environmental Operating Range

The XCV50E-6PQ240C operates reliably across:

  • Temperature: 0°C to +85°C (commercial grade)
  • Humidity: 5% to 95% non-condensing
  • Altitude: Up to 5,000 meters
  • Storage Temperature: -65°C to +150°C

Conclusion

The XCV50E-6PQ240C represents a mature, proven FPGA solution that continues to serve designers requiring reliable, high-performance programmable logic. With its balanced combination of logic capacity, processing speed, and I/O flexibility, this device remains relevant for both new designs and legacy system maintenance.

Whether you’re developing telecommunications equipment, industrial control systems, medical devices, or aerospace applications, the XCV50E-6PQ240C delivers the performance and reliability demanded by mission-critical applications. Its extensive tool support, comprehensive documentation, and proven track record make it an excellent choice for engineers seeking a dependable FPGA platform.

For designers working with Xilinx FPGA technology, the XCV50E-6PQ240C offers an excellent balance of features, making it suitable for a wide range of embedded and digital signal processing applications where field-programmable logic provides distinct advantages over fixed-function ASICs or microcontrollers.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.