Overview of XCV3200E-6CG1156C FPGA

The XCV3200E-6CG1156C is a powerful field-programmable gate array (FPGA) from AMD’s renowned Virtex-E family, designed to deliver exceptional performance for complex digital logic applications. This high-density FPGA combines 876,096 system gates with advanced 0.18µm CMOS technology, making it an ideal solution for telecommunications, industrial automation, digital signal processing, and high-performance computing systems.

As part of the Virtex-E series, the XCV3200E-6CG1156C represents a mature, proven technology that engineers worldwide trust for mission-critical applications requiring reliable, high-speed programmable logic solutions.

Key Technical Specifications

Core Features and Benefits

Advanced Logic Architecture

The XCV3200E-6CG1156C leverages Xilinx’s proven Virtex-E architecture, featuring:

• 73,008 configurable logic cells for implementing complex digital designs
• 357.2 MHz maximum operating frequency enabling high-speed processing
• Advanced routing resources with general routing matrix (GRM) for optimal signal interconnection
• VersaBlock™ architecture providing enhanced logic utilization and performance

Memory and Storage Capabilities

This Xilinx FPGA incorporates substantial on-chip memory resources:

• Distributed RAM throughout the logic fabric
• Block RAM for efficient data storage and buffering
• Configurable memory modes supporting various data widths and depths
• Dual-port RAM capabilities for simultaneous read/write operations

High-Density I/O Configuration

Application Areas

Telecommunications and Networking

The XCV3200E-6CG1156C excels in telecommunications infrastructure:

• Protocol processing for high-speed data communications
• Network packet switching and routing applications
• Wireless base station digital signal processing
• Optical networking interface implementations

Industrial Automation and Control

Industrial applications benefit from this FPGA’s reliability:

• Programmable logic controllers (PLC) implementation
• Motor control systems with precise timing requirements
• Machine vision processing for quality control
• Industrial communication protocols (PROFIBUS, EtherCAT, etc.)

Digital Signal Processing (DSP)

The high-performance architecture supports intensive DSP workloads:

• Video and image processing pipelines
• Audio processing and filtering applications
• Software-defined radio (SDR) implementations
• Radar and sonar signal processing

Aerospace and Defense

Mission-critical applications leverage the Virtex-E reliability:

• Avionics control systems
• Satellite communication payload processing
• Military radar and electronic warfare systems
• Guidance and navigation systems

Technical Architecture Details

Configurable Logic Blocks (CLBs)

The XCV3200E-6CG1156C contains an array of CLBs, each featuring:

• Four logic slices per CLB
• Two 4-input lookup tables (LUTs) per slice
• Dedicated carry logic for arithmetic operations
• Flip-flops and latches for sequential logic
• Multiplexers for data routing within the CLB

Clock Management System

Advanced clock distribution ensures timing integrity:

• Digital Clock Manager (DCM) for clock synthesis and de-skew
• Phase-locked loops (PLLs) for frequency multiplication
• Low-skew global clock networks spanning the entire device
• Clock enable resources for power management

Configuration Options

Package Information and Pin Configuration

CBGA Package Characteristics

The 1156-pin Ceramic Ball Grid Array provides:

• Robust thermal performance with ceramic substrate
• Excellent signal integrity for high-speed applications
• Low inductance ball connections
• Reliable mechanical strength for demanding environments
• Standard footprint compatible with industry PCB designs

Thermal Considerations

Design Tools and Software Support

Development Environment

AMD provides comprehensive development tools:

• Vivado Design Suite (for newer designs, legacy support)
• ISE Design Suite (primary tool for Virtex-E devices)
• IP cores library for common functions
• Simulation tools for verification and validation

Programming and Debugging

Engineers benefit from robust development features:

• ChipScope Pro for real-time signal analysis
• JTAG programming and boundary scan testing
• BitGen configuration file generation
• Timing analyzer for performance optimization

Competitive Advantages

Why Choose XCV3200E-6CG1156C?

1. Proven Technology: Mature Virtex-E architecture with extensive deployment history
2. High Logic Density: 73,008 cells provide substantial design capacity
3. Fast Performance: 357.2 MHz operation supports demanding applications
4. Extensive I/O: 804 configurable pins enable complex interfacing
5. Industry Support: Broad ecosystem of IP cores, tools, and documentation

Comparison with Alternatives

Ordering Information and Availability

Part Number Breakdown

XCV3200E-6CG1156C decodes as:

• XC = Xilinx (now AMD) FPGA
• V = Virtex family
• 3200E = Virtex-E 3200 density variant
• -6 = Speed grade (higher numbers = faster)
• CG = Ceramic Grid Array package
• 1156 = Pin count
• C = Commercial temperature range

Package Marking and Identification

Devices are clearly marked with:

• Full part number
• Manufacturing date code
• Country of origin
• Lot traceability information

Quality and Reliability

Manufacturing Standards

AMD maintains rigorous quality control:

• ISO 9001 certified manufacturing
• Military-grade quality options available
• Extensive testing including burn-in and functional verification
• Environmental compliance (RoHS, REACH)

Lifecycle and Support

Integration and System Design

PCB Layout Considerations

Successful implementation requires attention to:

• Power supply decoupling with multiple capacitor values
• Controlled impedance routing for high-speed signals
• Thermal management with adequate copper planes
• Clock signal integrity with proper termination
• Ground plane continuity for noise reduction

Power Requirements

Recommended Operating Conditions

• Supply voltage tolerance: ±5% (1.71V to 1.89V for VCCINT)
• Ambient temperature: 0°C to +85°C (commercial grade)
• Relative humidity: 5% to 95% non-condensing
• Recommended airflow: Natural convection to forced air cooling

Migration and Upgrade Path

Device Family Compatibility

The Virtex-E family offers scalable options:

• Downward migration: XCV2600E, XCV1600E (smaller devices)
• Alternative packages: FG, BG package options available
• Pin compatibility: Certain devices share common pinouts
• Forward migration: Consider Virtex-4, Virtex-5, or 7-Series for new designs

Frequently Asked Questions

What is the difference between speed grades?

Speed grades (like -6) indicate maximum achievable performance. Higher numbers (e.g., -7, -8) offer faster timing but may have higher power consumption and cost.

Can I use XCV3200E-6CG1156C in new designs?

While this is a mature product, it remains suitable for applications where proven technology is preferred. For cutting-edge performance, consider AMD’s latest FPGA families.

What development tools support this FPGA?

ISE Design Suite is the primary toolchain. Vivado may offer limited legacy support. Always verify tool compatibility for your specific version.

How many logic elements can this FPGA implement?

With 73,008 logic cells and 876K system gates, you can implement very large digital designs, including 32-bit processors, complex DSP algorithms, and multi-protocol communication systems.

Conclusion

The XCV3200E-6CG1156C represents a powerful, proven FPGA solution from AMD’s Virtex-E family. With its combination of high logic density, robust I/O capabilities, and mature ecosystem support, this device continues to serve critical applications across telecommunications, industrial automation, aerospace, and digital signal processing domains.

Engineers selecting this FPGA benefit from decades of field-proven reliability, comprehensive development tool support, and the flexibility to implement complex digital systems with confidence. Whether you’re upgrading legacy systems or implementing new designs that value proven technology, the XCV3200E-6CG1156C delivers the performance and reliability your application demands.

For more information about Xilinx FPGA products and technical resources, explore comprehensive documentation and application notes available through authorized distributors and AMD’s technical support channels.