Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCV300E-8PQ240C: High-Performance Xilinx Virtex-E FPGA for Advanced Embedded Applications

Product Details

The XCV300E-8PQ240C is a cutting-edge field-programmable gate array (FPGA) from Xilinx’s renowned Virtex-E family, designed to deliver exceptional performance and flexibility for complex digital designs. This powerful programmable logic device combines high-speed processing capabilities with advanced 0.18µm CMOS technology, making it an ideal solution for telecommunications, industrial automation, aerospace, and high-speed digital signal processing applications.

Product Overview: XCV300E-8PQ240C FPGA Specifications

The XCV300E-8PQ240C represents Xilinx’s commitment to providing high-density, high-performance Xilinx FPGA solutions. Built on the proven Virtex-E architecture, this FPGA delivers robust programmable logic resources in a compact 240-pin PQFP package, making it suitable for space-constrained applications without compromising on functionality.

Key Technical Specifications

Specification Details
Part Number XCV300E-8PQ240C
Manufacturer Xilinx (AMD)
Product Family Virtex-E 1.8V FPGAs
Logic Gates 82,944 gates
Logic Cells 6,912 cells
Maximum Frequency 416 MHz
Package Type 240-Pin PQFP (Plastic Quad Flat Pack)
I/O Pins 158 programmable I/O
Supply Voltage 1.8V
Process Technology 0.18µm CMOS
Speed Grade -8 (high performance)
Operating Temperature Commercial (0°C to +85°C)

Core Features and Capabilities

Advanced Virtex-E Architecture

The XCV300E-8PQ240C leverages Xilinx’s optimized Virtex-E architecture, featuring:

  • High Logic Density: With 82,944 system gates and 6,912 logic cells, this FPGA provides ample resources for complex digital designs
  • Flexible Interconnect: Six-layer metal interconnect structure ensures optimal signal routing and minimal propagation delays
  • Enhanced Performance: Speed grade -8 designation indicates superior timing characteristics for demanding applications
  • Low Power Operation: 1.8V core voltage reduces power consumption while maintaining high performance

Programmable I/O Resources

I/O Feature Specification
Total User I/O 158 pins
I/O Standards Support LVTTL, LVCMOS, PCI, GTL, GTL+, HSTL, SSTL
Differential I/O Pairs Multiple pairs available
Slew Rate Control Programmable per pin
Input Delay Individually programmable
Output Drive Strength Configurable (2mA to 24mA)

Application Areas and Use Cases

Telecommunications and Networking

The XCV300E-8PQ240C excels in high-speed communication applications:

  • Protocol bridging and conversion
  • Network packet processing
  • Digital signal processing for wireless base stations
  • Software-defined radio (SDR) implementations
  • High-speed serial interfaces

Industrial Automation and Control

Perfect for industrial environments requiring:

  • Real-time control systems
  • Motor control and drive systems
  • Machine vision processing
  • Industrial networking protocols (EtherCAT, PROFINET)
  • Safety-critical applications

Aerospace and Defense

Trusted in mission-critical applications:

  • Radar signal processing
  • Avionics systems
  • Secure communications
  • Navigation systems
  • Electronic warfare equipment

Memory and Storage Architecture

On-Chip Memory Resources

Memory Type Capacity Configuration
Block RAM Multiple 4K-bit blocks Dual-port configuration
Distributed RAM Via LUTs Flexible sizing
FIFO Buffers Configurable depth Synchronous/Asynchronous

The embedded memory blocks can be configured as:

  • Single-port RAM
  • Dual-port RAM
  • FIFO buffers
  • ROM for lookup tables

Performance Characteristics

Speed and Timing

The -8 speed grade designation indicates:

  • System Clock Frequency: Up to 416 MHz for internal logic
  • I/O Performance: High-speed interfaces supporting various standards
  • Propagation Delay: Optimized routing for minimal signal delays
  • Setup and Hold Times: Tightly controlled for reliable operation

Power Consumption Profile

Operating Mode Typical Power Notes
Active (Full Load) Varies by design Depends on utilization
Standby Low μW range Clock gating enabled
Configuration Minimal During FPGA programming

Design Tools and Development Support

Compatible Software

  • Xilinx ISE Design Suite: Full design entry, synthesis, and implementation
  • Vivado Design Suite: Modern tool flow (for migration paths)
  • Third-Party Tools: Support for Synplify, Precision RTL, and others

Programming and Configuration

Configuration Method Interface Speed
JTAG 4-wire interface Standard IEEE 1149.1
Master Serial Xilinx PROM Fast configuration
Slave Serial External controller Flexible timing
SelectMAP Parallel interface High-speed configuration

Package Information: 240-Pin PQFP

Physical Dimensions

The XCV300E-8PQ240C comes in a robust PQFP package:

  • Package Style: Plastic Quad Flat Pack
  • Total Pins: 240
  • Pin Pitch: 0.5mm
  • Body Size: 32mm × 32mm (typical)
  • Height: Low-profile design
  • Mounting: Surface mount technology (SMT)

Thermal Management

Thermal Parameter Value Unit
θJA (Junction to Ambient) ~35 °C/W
θJC (Junction to Case) ~10 °C/W
Maximum Junction Temp 125 °C

Design Considerations and Best Practices

PCB Layout Guidelines

When designing with the XCV300E-8PQ240C:

  1. Power Distribution: Implement proper power plane design with adequate decoupling
  2. Signal Integrity: Maintain controlled impedance for high-speed signals
  3. Thermal Management: Ensure adequate airflow and heat dissipation
  4. Configuration Pins: Follow Xilinx guidelines for mode pin connections

Recommended Decoupling

Capacitor Type Quantity Placement
0.1µF Ceramic 15-20 per bank Close to FPGA pins
10µF Tantalum 2-3 per supply Near FPGA
100µF Electrolytic 1-2 Power entry point

Competitive Advantages

Why Choose XCV300E-8PQ240C?

  1. Proven Architecture: Based on mature Virtex-E technology with extensive field deployment
  2. Cost-Effective: Optimal balance of features and pricing for mid-range applications
  3. Long-Term Availability: Supported by AMD (Xilinx) with reliable supply chain
  4. Extensive IP Library: Access to thousands of pre-verified IP cores
  5. Design Security: Built-in bitstream encryption capabilities

Comparison with Alternatives

Feature XCV300E-8PQ240C Competing FPGAs
Logic Density 82,944 gates Comparable
Speed Grade -8 (fastest) Similar options
I/O Count 158 pins Industry standard
Voltage 1.8V (low power) Often 2.5V or 3.3V
Package Size Compact PQFP Various options

Quality and Reliability

Manufacturing Standards

  • RoHS Compliant: Lead-free manufacturing process
  • Quality Grade: Industrial commercial grade
  • Reliability Testing: HTOL, temperature cycling, moisture sensitivity
  • ESD Protection: Built-in protection on all I/O pins

Expected Lifespan

Under normal operating conditions:

  • MTBF: Exceeds 100,000 hours
  • Configuration Cycles: Unlimited reprogramming
  • Data Retention: 20+ years for configuration memory

Getting Started with XCV300E-8PQ240C

Essential Resources

  1. Official Datasheet: Complete electrical and timing specifications
  2. User Guides: Comprehensive design documentation
  3. Application Notes: Real-world implementation examples
  4. Reference Designs: Pre-built projects for common applications
  5. Technical Support: Access to Xilinx forums and FAE support

Development Kit Recommendations

For prototyping and evaluation:

  • Xilinx evaluation boards featuring Virtex-E devices
  • Third-party development platforms with XCV300E support
  • Custom PCB design services for production implementations

Ordering Information and Availability

Part Number Breakdown

XCV300E-8PQ240C decoding:

  • XC: Xilinx commercial FPGA
  • V300E: Virtex-E 300K gates
  • -8: Speed grade (fastest)
  • PQ240: Package type (240-pin PQFP)
  • C: Commercial temperature range

Procurement Considerations

When sourcing the XCV300E-8PQ240C:

  • Verify authentic Xilinx/AMD distribution channels
  • Check date codes for recent manufacturing
  • Confirm RoHS compliance requirements
  • Consider minimum order quantities
  • Review lead times for production volumes

Technical Support and Resources

Documentation Library

Access comprehensive technical resources:

  • Product Data Sheet: DS022 Virtex-E Family
  • Packaging Specifications: Package dimensions and footprints
  • PCB Design Guidelines: Layout best practices
  • Configuration Guide: Programming and debug procedures

Community and Support

  • Xilinx Community Forums: Peer-to-peer technical discussions
  • AMD/Xilinx FAE: Field application engineer support
  • Training Resources: Webinars, tutorials, and certification programs
  • Third-Party IP Vendors: Extensive ecosystem of design IP

Conclusion: Powering Next-Generation Embedded Systems

The XCV300E-8PQ240C field-programmable gate array delivers an optimal combination of performance, flexibility, and value for demanding embedded applications. With its robust Virtex-E architecture, comprehensive I/O capabilities, and proven reliability, this FPGA enables engineers to implement sophisticated digital designs with confidence.

Whether you’re developing advanced telecommunications equipment, industrial control systems, or aerospace applications, the XCV300E-8PQ240C provides the programmable logic resources, speed, and flexibility needed to bring your innovative designs to market successfully.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.