Overview of XCV300E-8FG256C Field Programmable Gate Array
The XCV300E-8FG256C is a professional-grade field-programmable gate array (FPGA) from AMD’s renowned Virtex-E family. This powerful programmable logic device delivers exceptional performance for demanding embedded applications, offering designers the flexibility and processing power needed for modern digital systems. With 411,955 gates and advanced 0.18μm CMOS technology, the XCV300E-8FG256C represents a proven solution for industrial, communications, and aerospace applications.
Key Features and Benefits
High-Performance Architecture
The XCV300E-8FG256C FPGA combines cutting-edge architecture with proven reliability. Built on advanced 0.18-micron CMOS process technology with six metal layers, this Xilinx FPGA delivers superior signal integrity and routing efficiency. The speed grade -8 designation ensures fast timing performance, making it ideal for time-critical applications requiring rapid data processing.
Robust Logic Capacity
With 6,912 logic cells organized into 1,536 configurable logic blocks (CLBs), designers can implement complex digital functions with ease. The device provides substantial logic resources for implementing custom algorithms, state machines, and data processing pipelines without external logic support.
Technical Specifications
Core Performance Parameters
| Specification |
Value |
| Part Number |
XCV300E-8FG256C |
| Manufacturer |
AMD (Xilinx) |
| FPGA Family |
Virtex-E |
| Total System Gates |
411,955 |
| Logic Cells/Elements |
6,912 |
| Configurable Logic Blocks (CLBs) |
1,536 |
| Speed Grade |
-8 |
| Process Technology |
0.18μm CMOS |
| Metal Layers |
6 |
Memory and I/O Configuration
| Feature |
Specification |
| Total RAM Bits |
131,072 (131 KB) |
| User I/O Pins |
176 |
| Package Type |
256-FBGA |
| Package Dimensions |
17mm x 17mm |
| Pin Count |
256 |
| Mounting Type |
Surface Mount |
Electrical Characteristics
| Parameter |
Min |
Typ |
Max |
Unit |
| Supply Voltage (Vcc) |
1.71 |
1.8 |
1.89 |
V |
| Operating Temperature (Tj) |
0 |
– |
85 |
°C |
| Moisture Sensitivity Level |
– |
– |
MSL 3 |
– |
Application Areas
Industrial Automation and Control
The XCV300E-8FG256C excels in industrial control systems, providing reliable logic processing for manufacturing automation, robotics control, and process monitoring. Its robust operating temperature range and proven reliability make it suitable for harsh industrial environments.
Communications Infrastructure
With 176 I/O pins and high-speed logic capability, this FPGA is ideal for communications applications including protocol conversion, signal processing, and data routing. The device can handle multiple communication standards simultaneously.
Aerospace and Defense Systems
The Virtex-E family’s proven heritage makes the XCV300E-8FG256C a trusted choice for aerospace applications requiring high reliability, radiation tolerance considerations, and long-term availability.
Automotive Electronics
Modern automotive systems benefit from the XCV300E-8FG256C’s flexibility in implementing custom logic for advanced driver assistance systems (ADAS), infotainment controllers, and vehicle networking.
Package Information and Pin Configuration
256-FBGA Package Details
| Package Feature |
Description |
| Package Style |
Fine-pitch Ball Grid Array (FBGA) |
| Dimensions |
17mm x 17mm |
| Ball Pitch |
Fine-pitch |
| Total Balls |
256 |
| RoHS Status |
Contains Lead (Legacy Product) |
| Lead-Free Status |
Non-Compliant |
I/O Capabilities
The 176 user I/O pins support various voltage standards and can be configured for different signaling requirements. The flexible I/O architecture allows designers to interface with numerous peripheral devices and communication protocols.
Design and Development Tools
Compatible Software
- Xilinx ISE Design Suite: Primary development environment for Virtex-E devices
- HDL Support: VHDL and Verilog hardware description languages
- Simulation Tools: ModelSim, Active-HDL compatibility
- Programming Tools: iMPACT configuration software
Design Resources
Engineers working with the XCV300E-8FG256C have access to comprehensive documentation including detailed datasheets, application notes, and reference designs. The robust ecosystem of third-party IP cores extends functionality for common applications.
Memory Architecture
Embedded RAM Resources
The XCV300E-8FG256C features 131,072 bits of distributed RAM resources organized as block RAM and distributed RAM. This on-chip memory eliminates the need for external RAM in many applications, reducing PCB complexity and system costs.
| Memory Type |
Capacity |
Application |
| Total RAM |
131,072 bits |
Data buffering, FIFO, lookup tables |
| Block RAM |
High-density |
Large data storage |
| Distributed RAM |
Flexible |
Small memory, shift registers |
Performance Characteristics
Timing and Speed
The -8 speed grade indicates optimized timing performance with fast propagation delays through the logic fabric. Clock frequencies achievable with this device support demanding real-time processing requirements in embedded systems.
Power Efficiency
Operating on 1.8V core voltage (1.71V-1.89V range), the XCV300E-8FG256C provides power-efficient operation compared to older 3.3V or 5V logic families while maintaining robust noise margins.
Quality and Reliability
Temperature Grade
The commercial temperature grade (0°C to 85°C junction temperature) makes this FPGA suitable for most commercial and industrial applications. The device is designed for reliable operation across its full temperature range.
Moisture Sensitivity
With MSL 3 rating (168 hours), the XCV300E-8FG256C requires standard moisture-sensitive component handling procedures. Proper storage in sealed moisture barrier bags with desiccant ensures product integrity.
Ordering and Availability
Part Number Breakdown
XCV300E-8FG256C decodes as follows:
- XCV: Virtex-E family designation
- 300E: 300,000 system gate equivalent
- -8: Speed grade (faster timing)
- FG256: Fine-pitch BGA, 256 pins
- C: Commercial temperature grade
Package Marking
Standard package marking includes manufacturer logo, part number, date code, and lot traceability information for quality tracking and counterfeit prevention.
System Integration Considerations
PCB Design Guidelines
Successful implementation requires careful PCB design attention to:
- Power delivery: Proper decoupling capacitor placement near FPGA power pins
- Signal integrity: Controlled impedance traces for high-speed signals
- Thermal management: Adequate airflow or heatsinking for thermal dissipation
- Configuration: JTAG programming interface and configuration memory
Configuration Options
The XCV300E-8FG256C supports multiple configuration modes including:
- JTAG boundary scan for programming and debug
- Master serial configuration mode
- Slave serial configuration mode
- SelectMAP parallel configuration
Comparison with Other Virtex-E Devices
Family Position
| Device |
System Gates |
CLBs |
I/O Pins |
Package |
| XCV50E |
50,000 |
384 |
176 |
Various |
| XCV300E |
300,000 |
1,536 |
176-404 |
Multiple |
| XCV600E |
600,000 |
3,072 |
344-512 |
Various |
| XCV1000E |
1,000,000 |
6,144 |
404-804 |
Large packages |
The XCV300E-8FG256C occupies the mid-range capacity position, offering an excellent balance between logic resources, cost, and pin count for medium-complexity designs.
Conclusion
The XCV300E-8FG256C FPGA delivers proven Virtex-E architecture in a compact 256-pin FBGA package, making it an excellent choice for embedded system designers requiring substantial logic capacity with moderate I/O requirements. Its combination of 411,955 gates, 176 I/O pins, and 131KB of embedded RAM provides the resources needed for sophisticated digital designs across industrial, communications, and aerospace applications.
Whether you’re developing custom embedded controllers, communication protocol processors, or signal processing systems, the XCV300E-8FG256C offers the performance, flexibility, and reliability required for professional FPGA applications. Its mature ecosystem of development tools and extensive documentation ensure smooth design cycles from concept to production.
