Overview of XCV300E-8BGG432C FPGA
The XCV300E-8BGG432C is a professional-grade Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Virtex-E family. This 1.8V FPGA delivers exceptional programmable logic performance with 300,000 system gates, making it an ideal solution for complex digital design applications across telecommunications, industrial automation, and embedded systems.
Key Features and Specifications
Core Technical Specifications
| Specification |
Value |
| Part Number |
XCV300E-8BGG432C |
| Manufacturer |
AMD Xilinx (formerly Xilinx Inc.) |
| Product Family |
Virtex-E 1.8V FPGAs |
| System Gates |
300,000 gates |
| Logic Cells |
6,912 cells |
| Operating Voltage |
1.8V |
| Speed Grade |
-8 (Commercial) |
| Package Type |
BG432 (Ball Grid Array) |
| Total I/O Pins |
316 I/O |
| Package Pins |
432-pin MBGA |
| Process Technology |
0.18μm CMOS (6-layer metal) |
| Operating Temperature |
0°C to +85°C (Commercial) |
Advanced Architecture Features
| Feature Category |
Description |
| CLB Configuration |
Configurable Logic Blocks with 4-input LUTs |
| Block RAM |
Dual-port block SelectRAM™ memory |
| Clock Management |
Digital Clock Manager (DCM) for frequency synthesis |
| I/O Standards |
SelectI/O+ technology supporting multiple standards |
| Routing Resources |
Hierarchical interconnect architecture |
| Design Security |
Bitstream encryption capability |
Performance Characteristics
Operating Specifications
The XCV300E-8BGG432C delivers robust performance metrics designed for demanding industrial applications:
| Performance Metric |
Specification |
| Maximum Frequency |
Up to 416 MHz |
| Power Consumption |
Low-power 1.8V core operation |
| Temperature Range |
Commercial: 0°C to +85°C |
| Speed Grade |
-8 (optimized for high-speed applications) |
| Package Thermal Resistance |
Enhanced thermal management in BG432 package |
Applications and Use Cases
Primary Application Domains
The XCV300E-8BGG432C FPGA excels in diverse industrial and commercial applications:
- Telecommunications Infrastructure: Protocol processing, network packet handling, and signal routing
- Industrial Automation: High-speed control systems, machine vision, and sensor interface
- Digital Signal Processing: Real-time filtering, audio/video processing, and data conversion
- Embedded Systems: Custom computing engines, accelerators, and co-processors
- Medical Equipment: Imaging systems, diagnostic equipment, and patient monitoring
- Aerospace & Defense: Ruggedized computing, radar processing, and secure communications
Package Information: BG432 Ball Grid Array
Physical Characteristics
| Package Parameter |
Specification |
| Package Type |
MBGA (Micro Ball Grid Array) |
| Pin Count |
432 pins |
| Ball Pitch |
Fine-pitch BGA configuration |
| Package Dimensions |
Compact footprint for space-constrained designs |
| Mounting Technology |
Surface mount (SMT) |
| Thermal Performance |
Enhanced thermal dissipation |
I/O Configuration
The BG432 package provides 316 user I/O pins, offering extensive connectivity options for complex system integration. The SelectI/O+ technology supports multiple voltage standards including LVTTL, LVCMOS, PCI, GTL+, and differential signaling standards.
Development and Programming
Design Tools and Software
Working with the XCV300E-8BGG432C requires appropriate development tools:
- Legacy Support: ISE Design Suite 10.1 (last supported version)
- Programming Format: Bitstream configuration file
- Configuration Modes: Master/Slave Serial, SelectMAP, JTAG
- Debugging: ChipScope Pro integration for in-system verification
For modern Xilinx FPGA development, designers working with newer device families benefit from advanced tools, though this Virtex-E device requires legacy software support.
Comparison with Similar Devices
Virtex-E Family Variants
| Part Number |
Speed Grade |
Package |
I/O Count |
Key Difference |
| XCV300E-6BGG432C |
-6 |
BG432 |
316 |
Lower speed grade |
| XCV300E-7BGG432C |
-7 |
BG432 |
316 |
Mid-range speed |
| XCV300E-8BGG432C |
-8 |
BG432 |
316 |
Highest speed |
| XCV300E-8FG456C |
-8 |
FG456 |
More I/Os |
Larger package |
| XCV300E-8PQ240C |
-8 |
PQ240 |
Fewer I/Os |
Smaller package |
Important Product Status Notice
Lifecycle and Availability
Important Notice: The XCV300E-8BGG432C is part of the Virtex-E family, which has been identified for product discontinuation. According to AMD Xilinx product change notifications:
- This device is not recommended for new designs
- Last-time-buy opportunities may be limited
- No direct replacement available in newer families
- Existing inventory available through authorized distributors
- Consider migration to current-generation Xilinx/AMD FPGAs for new projects
Legacy System Support
For maintenance of existing systems utilizing the XCV300E-8BGG432C, authorized distributors continue to support:
- Replacement part procurement
- Technical documentation access
- Application engineering support
- Programming file compatibility verification
Quality and Reliability
Manufacturing Standards
| Quality Metric |
Standard |
| Manufacturing Process |
ISO 9001 certified facilities |
| Moisture Sensitivity |
MSL (Moisture Sensitivity Level) rated |
| ESD Protection |
Human Body Model (HBM) compliant |
| Quality Grade |
Commercial temperature range |
| Testing |
100% functional testing at factory |
Reliability Metrics
The Virtex-E family demonstrates proven reliability in deployed systems:
- Extended operational lifetime in industrial environments
- Robust design for 24/7 continuous operation
- Enhanced ESD protection circuitry
- Comprehensive qualification testing per JESD standards
Design Considerations
PCB Layout Guidelines
When designing with the XCV300E-8BGG432C:
- Power Distribution: Implement robust power plane design with adequate decoupling
- Signal Integrity: Follow high-speed design practices for critical I/O
- Thermal Management: Ensure adequate airflow and heatsinking for high-utilization designs
- BGA Routing: Plan for fine-pitch BGA breakout and via-in-pad technology
- Configuration: Design appropriate configuration circuit (PROM or microcontroller-based)
Power Supply Requirements
| Power Rail |
Voltage |
Tolerance |
Notes |
| VCCINT |
1.8V |
±5% |
Core logic supply |
| VCCO |
1.8V – 3.3V |
±5% |
I/O bank supply (bank-dependent) |
| VCCAUX |
2.5V |
±5% |
Auxiliary supply |
Procurement and Support
Authorized Distribution
The XCV300E-8BGG432C is available through authorized electronic component distributors including:
- Digi-Key Electronics
- Mouser Electronics
- Arrow Electronics
- Avnet
- Regional distributors worldwide
Technical Support Resources
Access comprehensive technical documentation:
- Product data sheets and specifications
- Application notes for Virtex-E family
- Reference designs and IP cores
- Community forums and knowledge base
- Legacy ISE software downloads
Environmental Compliance
RoHS and Environmental Standards
| Compliance Standard |
Status |
| RoHS |
Compliant (lead-free versions available) |
| REACH |
Registered substances compliant |
| Halogen-Free |
Check specific ordering codes |
| Conflict Minerals |
AMD Xilinx conflict-free sourcing |
Frequently Asked Questions
What makes the -8 speed grade significant?
The -8 speed grade represents the highest performance variant of the XCV300E in the BG432 package, offering maximum operating frequency up to 416 MHz for time-critical applications.
Can I use modern Vivado tools with this FPGA?
No, the Virtex-E family requires ISE Design Suite 10.1 or earlier. Vivado does not support Virtex-E devices. Legacy ISE software remains available for download.
What is the difference between XCV300E-8BGG432C and XCV300E-7BG432C?
The primary difference is the speed grade: the -8 variant offers higher maximum operating frequencies and tighter timing specifications compared to the -7 variant, while maintaining identical package and I/O configuration.
Is this FPGA suitable for new product development?
Due to product discontinuation status, AMD Xilinx does not recommend the XCV300E-8BGG432C for new designs. Consider current-generation devices such as Artix-7, Spartan-7, or Zynq families for new projects.
What programming/configuration options are available?
The XCV300E-8BGG432C supports multiple configuration modes including Master Serial, Slave Serial, SelectMAP, and JTAG, allowing flexible integration into various system architectures.
Conclusion
The XCV300E-8BGG432C represents proven FPGA technology from AMD Xilinx’s established Virtex-E family. With 300,000 system gates, 316 I/O pins, and -8 speed grade performance, this device continues to serve critical roles in existing deployed systems across telecommunications, industrial, and embedded applications.
While not recommended for new designs due to product lifecycle status, the XCV300E-8BGG432C remains available for legacy system support and maintenance. Engineers working with this device benefit from extensive documentation, proven reliability, and continued distributor support.
For current design projects requiring similar capabilities, explore modern Xilinx FPGA families offering enhanced performance, lower power consumption, and advanced features with long-term availability assurance.
