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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XCV300E-7FG456I: Xilinx Virtex-E FPGA – Full Specifications & Datasheet Guide

Product Details

The XCV300E-7FG456I is a high-performance, industrial-grade Field Programmable Gate Array (FPGA) from Xilinx (now AMD), part of the acclaimed Virtex-E family. Designed for demanding embedded, communications, and signal-processing applications, the XCV300E-7FG456I delivers 300K system gates, 6,912 logic cells, and operates at a blazing-fast 400 MHz — all in a compact 456-pin FBGA package. Whether you’re designing for telecommunications, industrial automation, or high-speed data processing, this component offers the programmable flexibility and performance that engineers rely on.

If you’re looking for a broader selection of programmable logic solutions, explore our full range of Xilinx FPGA devices.


What Is the XCV300E-7FG456I?

The XCV300E-7FG456I is a member of the Xilinx Virtex-E 1.8V FPGA series, manufactured using an advanced 0.18 µm, 6-layer metal CMOS process technology. The “E” in Virtex-E denotes an enhanced generation of the original Virtex architecture, delivering significant gains in logic density, speed, and on-chip memory capacity.

The part number decodes as follows:

Code Element Meaning
XCV300E Virtex-E family, 300K equivalent gate device
-7 Speed grade (faster = higher number; -7 is mid-tier)
FG456 456-ball Fine-pitch Ball Grid Array (FBGA) package
I Industrial temperature range (–40°C to +100°C)

This industrial temperature suffix makes the XCV300E-7FG456I especially suitable for ruggedized environments where consumer-grade components would fail.


XCV300E-7FG456I Key Specifications

General Electrical Specifications

Parameter Value
Manufacturer Xilinx Inc. (AMD)
Product Family Virtex-E
Part Status Obsolete / Legacy (Not Recommended for New Designs)
Technology Node 0.18 µm CMOS
Number of Metal Layers 6
Core Supply Voltage (VCCINT) 1.8V (nominal)
Supply Voltage Range 1.71V – 1.89V
I/O Supply Voltage (VCCO) 3.3V / 2.5V / 1.8V (multi-standard I/O)
Maximum Clock Frequency 400 MHz

Logic Resources

Resource Quantity
Equivalent System Gates 82,944 (usable); up to ~411,955 (maximum)
Configurable Logic Blocks (CLBs) 1,536
Logic Cells / Elements 6,912
Flip-Flops 13,824
4-Input LUTs 13,824

Memory Resources

Memory Type Capacity
Total RAM Bits (Block RAM) 131,072 bits (128 Kbits / 16 KB)
Block SelectRAM Resources 16 × 4Kbit dual-port RAM blocks

I/O and Package Information

Parameter Value
Number of User I/Os 312
Package Type 456-FBGA (Fine-pitch Ball Grid Array)
Package Designation FG456 (23 × 23 mm body)
Ball Pitch 1.0 mm
Mounting Type Surface Mount Technology (SMT)
Total Pin Count 456

Operating Conditions

Parameter Value
Temperature Range (TJ) –40°C to +100°C (Industrial grade)
Temperature Suffix “I” = Industrial
ESD Protection Industry-standard on all I/O pins

XCV300E-7FG456I Package Dimensions

The XCV300E-7FG456I uses a 456-ball Fine-pitch BGA (FBGA) package, sometimes also listed as 456-BBGA in distributor databases. Key physical attributes are:

Attribute Detail
Package Code FG456
Body Size 23 mm × 23 mm
Ball Pitch 1.0 mm
Ball Rows × Columns Approx. 22 × 22 array
PCB Land Pattern Requires controlled-impedance BGA footprint
Recommended Solder SAC305 lead-free or Sn63Pb37

Designers should refer to the Xilinx Virtex-E packaging specification document for precise mechanical drawings and PCB land pattern recommendations before layout.


Virtex-E Architecture Overview

Understanding the internal architecture of the Virtex-E family helps explain why the XCV300E-7FG456I performs so well across a wide range of applications.

Configurable Logic Blocks (CLBs)

Each CLB in the Virtex-E architecture contains two slices, and each slice contains:

  • Two 4-input Look-Up Tables (LUTs) — used as logic functions or distributed RAM
  • Two D-type Flip-Flops
  • Fast carry and arithmetic logic chains

This gives the XCV300E-7FG456I 1,536 CLBs × 2 slices × 2 LUTs = 6,144 LUT resources, providing enormous flexibility for combinatorial and sequential logic designs.

Block SelectRAM

The on-chip Block SelectRAM resources are true dual-port 4096-bit SRAM blocks configurable as:

  • 4096 × 1-bit
  • 2048 × 2-bit
  • 1024 × 4-bit
  • 512 × 8-bit
  • 256 × 16-bit

All 16 blocks can operate independently and simultaneously, making them ideal for FIFOs, LUT-based RAM, and data buffering.

Digital Clock Management (DCM)

The Virtex-E family includes Digital Clock Managers (DCMs) that provide:

  • Clock multiplication and division
  • Phase shifting (fine and coarse)
  • Clock deskewing
  • Duty-cycle correction

These are essential for high-speed synchronous designs and multi-clock domain applications.

Programmable I/O Standards

The XCV300E-7FG456I supports a rich set of programmable I/O voltage standards:

I/O Standard Description
LVTTL Low-Voltage TTL (3.3V)
LVCMOS25 / LVCMOS18 Low-Voltage CMOS (2.5V / 1.8V)
SSTL2 / SSTL3 Stub-Series Terminated Logic
GTL / GTL+ Gunning Transceiver Logic
HSTL High-Speed Transceiver Logic (1.5V)
PCI / PCI-X 3.3V and 5V tolerant PCI compliant
AGP Accelerated Graphics Port compatible
CTT Center Tap Terminated

This multi-standard I/O capability makes the XCV300E-7FG456I highly interoperable in mixed-voltage system designs.


XCV300E-7FG456I Applications

The XCV300E-7FG456I is used across a wide range of industries and design types:

Telecommunications & Networking

  • Line card processing in SONET/SDH systems
  • ATM cell processing and traffic management
  • Protocol bridging and conversion
  • High-speed serial data interfaces

Industrial Automation & Control

  • Motor drive control with PWM generation
  • Industrial Ethernet (EtherCAT, PROFINET)
  • Real-time sensor data acquisition
  • PLC (Programmable Logic Controller) coprocessing

Defense & Aerospace (Legacy Systems)

  • Radar signal processing (legacy platforms)
  • Image processing for targeting systems
  • Secure communication hardware interfaces

Medical Equipment

  • Ultrasound signal processing
  • Patient monitoring data aggregation
  • Imaging system control logic

Digital Signal Processing (DSP)

  • FIR/IIR filter implementations
  • FFT processing engines
  • Software Defined Radio (SDR) hardware back-ends
  • Baseband processing

Programming & Design Tools for XCV300E-7FG456I

Since the XCV300E-7FG456I is a legacy Virtex-E device, it is supported by Xilinx ISE Design Suite (not Vivado, which dropped support for older devices):

Tool Details
Design Tool Xilinx ISE Design Suite (v14.7 final version recommended)
HDL Languages Supported VHDL, Verilog, ABEL
Simulation ISim (ISE integrated), ModelSim, QuestaSim
Constraints File UCF (User Constraints File) format
Configuration File Bitstream (.bit) or PROM file (.mcs)
Configuration Interfaces JTAG (boundary scan), SelectMAP, Serial Slave/Master

Configuration Memory Options

Mode Description
JTAG Direct PC-to-chip via JTAG cable (Xilinx Platform Cable USB)
Master Serial EEPROM / XCFxxS PROM auto-loads on power-up
Slave Serial External microcontroller sends bitstream serially
SelectMAP (Parallel) 8-bit or 16-bit byte-wide configuration bus

XCV300E-7FG456I Ordering Information

Part Number Variants

Part Number Speed Grade Package Temperature
XCV300E-6FG456C -6 (slower) 456-FBGA Commercial (0°C to +85°C)
XCV300E-7FG456C -7 456-FBGA Commercial (0°C to +85°C)
XCV300E-7FG456I -7 456-FBGA Industrial (–40°C to +100°C)
XCV300E-8FG456C -8 (faster) 456-FBGA Commercial (0°C to +85°C)
XCV300E-7FGG456I -7 456-MBGA Industrial

Note: The “I” suffix designates the industrial temperature grade, making XCV300E-7FG456I the preferred choice for harsh-environment deployments. The “C” suffix denotes commercial temperature range only.

Alternative / Compatible Package Options

The XCV300E core is also available in smaller packages for lower I/O count requirements:

Device Package User I/Os Gates
XCV300E 256-FBGA (FG256) 176 82,944
XCV300E 352-MBGA (FG352) 260 82,944
XCV300E 456-FBGA (FG456) 312 82,944
XCV300E 432-MBGA (FG432) 316 82,944

The logic resources remain identical across all package options — only the accessible I/O count changes.


Compliance & Certifications

Standard Compliance
RoHS Non-RoHS (legacy part; RoHS-compliant variants may exist under revised part numbers)
JEDEC JEDEC standard FBGA package outline
JTAG IEEE 1149.1 Boundary Scan compliant
PCI Compliance 3.3V PCI 2.2 compliant (with appropriate bank configuration)

Always verify RoHS status with your distributor at time of purchase for regulatory compliance purposes.


Why Choose the XCV300E-7FG456I?

Strengths at a Glance

Feature Advantage
Industrial temperature grade Operates reliably in –40°C to 100°C environments
0.18 µm process Lower power consumption vs. older CMOS nodes
1.8V core voltage Reduced dynamic power compared to 2.5V Virtex
312 user I/Os Maximum connectivity in the FG456 package
6,912 logic cells Sufficient for mid-size to large control/DSP functions
400 MHz max frequency High-speed synchronous design support
Multi-standard I/O Plug into any voltage-level ecosystem
Dual-port block RAM Efficient data buffering and memory architecture

Limitations to Consider

Consideration Detail
Legacy / Obsolete Status Not recommended for new designs by AMD
ISE-only toolchain Not supported in Vivado; ISE 14.7 is the final version
No embedded hard processors Unlike Zynq devices; soft-core (MicroBlaze) required
Configuration volatility SRAM-based; loses configuration on power-off without external PROM

For new design starts, consider migrating to current Xilinx/AMD families such as Spartan-7, Artix-7, or Kintex-7, which offer better performance-per-watt and active tool support.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.