Overview of XCV300E-6PQG240I Field Programmable Gate Array
The XCV300E-6PQG240I is a professional-grade Field Programmable Gate Array (FPGA) from AMD’s (formerly Xilinx) renowned Virtex-E family. This industrial-grade programmable logic device delivers exceptional performance with 82,944 gates and 158 user I/O pins, making it an ideal solution for complex digital design implementations, embedded systems, and high-speed signal processing applications.
Manufactured using advanced 0.18μm CMOS technology, this Xilinx FPGA operates at 1.8V core voltage and features a 240-pin HSPQFP (Heat Sink Plastic Quad Flat Package) configuration, providing robust thermal management for demanding industrial environments.
Key Features and Technical Specifications
Core Architecture and Performance
| Specification |
Value |
| Part Number |
XCV300E-6PQG240I |
| Manufacturer |
AMD (Xilinx) |
| Product Family |
Virtex-E |
| Logic Elements |
82,944 Gates / 6,912 Logic Cells |
| Maximum Speed Grade |
-6 (357 MHz) |
| Operating Temperature |
-40°C to +100°C (Industrial Grade) |
| Package Type |
240-Pin HSPQFP EP (Exposed Pad) |
| Core Voltage |
1.8V |
| I/O Standards Support |
Multiple (LVTTL, LVCMOS, SSTL, HSTL) |
Advanced FPGA Capabilities
The XCV300E-6PQG240I incorporates several advanced features that distinguish it in the programmable logic market:
- 6,912 Configurable Logic Blocks (CLBs) for flexible digital design implementation
- 158 User I/O Pins supporting various industry-standard I/O interfaces
- 357 MHz Maximum Operating Frequency for high-speed applications
- Industrial Temperature Range (-40°C to +100°C) for harsh environment deployment
- Optimized 5-Layer Metal Process for superior signal routing and performance
Pin Configuration and Package Details
Package Specifications
| Package Parameter |
Details |
| Package Style |
HSPQFP (Heat Sink Plastic Quad Flat Package) |
| Total Pin Count |
240 Pins |
| User I/O Pins |
158 |
| Package Dimensions |
32mm x 32mm (nominal) |
| Pin Pitch |
0.5mm |
| Mounting Type |
Surface Mount Technology (SMT) |
| RoHS Compliance |
RoHS Compliant |
I/O Banking and Voltage Support
The XCV300E-6PQG240I features multiple I/O banks that support various voltage standards:
- LVTTL/LVCMOS: 3.3V, 2.5V compatibility
- SSTL: High-speed memory interfaces
- HSTL: Advanced signaling for DDR applications
- GTL/GTL+: Backplane and system-level interfaces
Technical Performance Characteristics
Speed Grade and Timing
| Timing Parameter |
Specification |
| Speed Grade |
-6 (Fastest in family) |
| Maximum System Frequency |
357 MHz |
| Pin-to-Pin Delay |
6 nanoseconds (typical) |
| Clock-to-Output |
<5ns (optimized routing) |
| Setup/Hold Times |
Industry-leading performance |
Power Consumption Profile
The XCV300E-6PQG240I is engineered for power efficiency:
- Core Voltage (VCCINT): 1.8V ±5%
- I/O Voltage (VCCIO): 1.5V to 3.3V (bank-dependent)
- Static Power: Low quiescent current
- Dynamic Power: Optimized for high-performance applications
- Thermal Design Power (TDP): Application-dependent (contact manufacturer)
Application Areas and Use Cases
Industrial and Embedded Systems
The XCV300E-6PQG240I excels in demanding industrial applications:
- Industrial Automation Controllers
- PLC (Programmable Logic Controller) implementations
- Motion control systems
- Factory automation interfaces
- Real-time data acquisition systems
- Embedded Digital Systems
- Custom processor implementations
- Hardware acceleration engines
- Protocol converters and bridges
- System-on-Chip (SoC) prototyping
Communications and Networking
This FPGA is ideal for high-speed communication applications:
- Network Packet Processing: High-throughput data handling
- Protocol Implementation: Custom communication protocols
- Signal Routing: Advanced crosspoint switching
- Interface Bridging: Multiple protocol conversion
Signal Processing Applications
Digital signal processing benefits from the XCV300E-6PQG240I’s capabilities:
- Digital Filters: FIR/IIR filter implementations
- Image Processing: Real-time video/image manipulation
- Audio Processing: Multi-channel audio DSP
- Data Compression: Hardware-accelerated algorithms
Test and Measurement Equipment
Professional test equipment designers leverage this FPGA for:
- High-speed data capture and analysis
- Custom waveform generation
- Protocol analyzers
- Automated test equipment (ATE) systems
Design and Development Resources
Software Support and Tools
| Tool Category |
Software Solution |
| Design Entry |
Vivado Design Suite, ISE Foundation |
| Simulation |
ModelSim, Vivado Simulator |
| Synthesis |
Vivado Synthesis, XST |
| Place & Route |
Vivado Implementation |
| Programming |
iMPACT, Vivado Hardware Manager |
Configuration Options
The XCV300E-6PQG240I supports multiple configuration modes:
- Master Serial Mode: SPI Flash configuration
- Slave Serial Mode: External controller configuration
- JTAG Mode: In-system programming and debugging
- SelectMAP Mode: Parallel configuration interface
Comparison with Related Virtex-E Family Members
XCV300E Variant Comparison
| Part Number |
Package |
I/O Count |
Temperature Grade |
Key Difference |
| XCV300E-6PQ240I |
240-HSPQFP |
158 |
Industrial (-40°C to +100°C) |
Featured product |
| XCV300E-6PQ240C |
240-PQFP |
158 |
Commercial (0°C to +85°C) |
Commercial temp |
| XCV300E-6FG456I |
456-FBGA |
312 |
Industrial |
Higher I/O count |
| XCV300E-6BG352I |
352-BGA |
252 |
Industrial |
Ball Grid Array |
When to Choose the XCV300E-6PQG240I
Select this specific variant when you need:
- ✅ Industrial temperature reliability for harsh environments
- ✅ 158 I/O configuration matching your application requirements
- ✅ QFP package for easier PCB assembly and inspection
- ✅ Cost-effective solution compared to higher pin-count variants
- ✅ Proven thermal performance with heat sink capability
Ordering Information and Availability
Part Number Breakdown
XCV300E-6PQ240I decodes as follows:
- XCV: Virtex product line
- 300E: Device size (300K gates, Enhanced version)
- -6: Speed grade (fastest)
- PQ: Package type (Plastic Quad Flat Pack)
- 240: Pin count (240 pins)
- I: Temperature grade (Industrial)
Package Marking and Identification
Standard package markings include:
- Part number: XCV300E-6PQ240I
- Date code: YYWW format
- Lot traceability code
- Country of origin
- Xilinx/AMD logo
Quality and Reliability Standards
Manufacturing Quality
| Quality Aspect |
Specification |
| Manufacturing Process |
0.18μm 5-Layer Metal CMOS |
| Quality Standard |
ISO 9001 Certified |
| RoHS Compliance |
RoHS Directive 2011/65/EU |
| Moisture Sensitivity |
MSL 3 (168 hours at 30°C/60% RH) |
| Lead-Free |
Yes (Sn96.5Ag3.0Cu0.5) |
Reliability Testing
AMD/Xilinx subjects the XCV300E-6PQG240I to rigorous testing:
- Temperature Cycling: -65°C to +150°C
- High Temperature Operating Life (HTOL): 1000+ hours
- Electrostatic Discharge (ESD): Class 1C (>1000V HBM)
- Latch-Up: >200mA (JEDEC JESD78)
PCB Design Considerations
Layout Best Practices
When designing with the XCV300E-6PQG240I:
- Power Plane Design
- Dedicated power planes for VCCINT (1.8V)
- Separate I/O voltage planes per bank
- Low-inductance decoupling capacitor placement
- Thermal Management
- Heat sink attachment area provided
- Thermal vias to inner ground planes
- Adequate airflow consideration
- Signal Integrity
- Controlled impedance for high-speed signals
- Length matching for differential pairs
- Guard traces for sensitive signals
Recommended Decoupling Scheme
| Capacitor Type |
Quantity |
Placement |
| 100μF Bulk |
1-2 |
Near power entry |
| 10μF Ceramic |
3-5 |
Distributed around device |
| 0.1μF Ceramic |
15-20 |
One per power pin group |
| 0.01μF Ceramic |
10-15 |
High-frequency bypass |
Frequently Asked Questions (FAQs)
Q1: Is the XCV300E-6PQG240I suitable for new designs?
While the Virtex-E family is mature, this FPGA remains suitable for cost-sensitive industrial applications. For new high-performance designs, consider newer families like Artix-7 or Spartan-7. However, the XCV300E-6PQG240I offers excellent value for legacy system maintenance and proven applications.
Q2: What programming cables are compatible?
The XCV300E-6PQG240I supports:
- Platform Cable USB II
- Digilent HS2/HS3 cables
- JTAG-compatible third-party programmers
- Custom JTAG interfaces (4-wire: TDI, TDO, TMS, TCK)
Q3: Can this FPGA be reprogrammed in-system?
Yes, the XCV300E-6PQG240I supports in-system programming through JTAG interface, allowing field updates and reconfiguration without device removal.
Q4: What is the difference between industrial and commercial temperature grades?
- Industrial (-I suffix): -40°C to +100°C operation, higher reliability
- Commercial (-C suffix): 0°C to +85°C operation, lower cost
The industrial grade provides superior performance in extreme environments.
Q5: How much configuration memory is required?
The XCV300E requires approximately 1.5 Mbit of configuration data. A suitable SPI Flash memory would be 2 Mbit or larger (e.g., M25P20).
Storage and Handling Guidelines
ESD Protection
The XCV300E-6PQG240I is sensitive to electrostatic discharge:
- Store in ESD-protective packaging until ready for assembly
- Use grounded workstations for handling
- Wear ESD wrist straps during manual handling
- Follow ANSI/ESD S20.20 standards
Environmental Storage
| Parameter |
Specification |
| Storage Temperature |
-55°C to +150°C |
| Relative Humidity |
<85% non-condensing |
| Shelf Life |
Unlimited (with proper storage) |
| Baking Requirements |
If MSL exposure exceeded |
Support and Documentation Resources
Technical Documentation
- Datasheet: Virtex-E 1.8V Field Programmable Gate Arrays
- User Guide: Virtex-E Configuration Guide
- Application Notes: XAPP series relevant to Virtex-E
- PCB Design Guidelines: Layout recommendations and reference designs
Technical Support Channels
For XCV300E-6PQG240I technical assistance:
- AMD/Xilinx Online Support Portal
- Community Forums (TechForum)
- Authorized distributor technical teams
- Field Application Engineers (FAEs)
Conclusion: Why Choose the XCV300E-6PQG240I
The XCV300E-6PQG240I represents a proven, reliable FPGA solution for industrial and embedded applications requiring:
✓ Industrial-grade temperature performance (-40°C to +100°C)
✓ High-speed operation (357 MHz capability)
✓ Flexible I/O configuration (158 user I/O pins)
✓ Cost-effective implementation for moderate-complexity designs
✓ Mature, stable platform with extensive design resources
✓ Excellent thermal characteristics with heat sink support
Whether you’re developing industrial automation systems, embedded controllers, signal processing equipment, or communication interfaces, this FPGA delivers the performance, reliability, and flexibility required for mission-critical applications.
