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XCV300E-6PQG240C: Xilinx Virtex-E FPGA – Complete Specifications & Buying Guide

Product Details

The XCV300E-6PQG240C is a high-performance Field Programmable Gate Array (FPGA) from the Xilinx Virtex-E family. Manufactured using an advanced 0.18 µm CMOS process, this IC delivers 300,000 system gates in a compact 240-pin HSPQFP package. Whether you are designing embedded systems, digital signal processing pipelines, or high-speed communication interfaces, the XCV300E-6PQG240C offers the programmable logic capacity, speed, and I/O flexibility your project demands.

Looking for the full Xilinx FPGA product range, including compatible families and alternatives? Visit our dedicated resource page for in-depth comparison guides and selection tools.


What Is the XCV300E-6PQG240C?

The XCV300E-6PQG240C is a member of the Xilinx Virtex-E 1.8 V FPGA family — an evolutionary advancement over the original Virtex series. The “6” in the part number denotes the speed grade, “PQG240” identifies the 240-pin Plastic Quad Flat Pack (PQFP) package variant, and “C” indicates commercial temperature range operation (0°C to +85°C).

This device is built on a 6-layer metal 0.18 µm CMOS process technology, which delivers exceptional silicon efficiency by optimizing the architecture for place-and-route performance. The result is a programmable logic solution competitive with mask-programmed gate arrays in both speed and density.

Note: The XCV300E-6PQG240C is not recommended for new designs (NRND). Engineers designing new systems should evaluate current-generation Xilinx/AMD FPGA families. However, this part remains widely used in maintenance, legacy system support, and production runs already qualified on this device.


XCV300E-6PQG240C Key Specifications at a Glance

Parameter Value
Part Number XCV300E-6PQG240C
Manufacturer Xilinx (AMD)
Family Virtex-E
System Gates 300,000
Logic Cells 6,912
CLBs (Configurable Logic Blocks) 1,536
User I/O Pins 158
Package 240-Pin HSPQFP (Plastic QFP)
Process Technology 0.18 µm CMOS (6-layer metal)
Core Voltage (VCCINT) 1.8 V
I/O Voltage (VCCIO) 1.5 V – 3.3 V (SelectIO™)
Speed Grade -6
Maximum Frequency Up to 357 MHz (internal)
Temperature Range 0°C to +85°C (Commercial)
Block RAM 131,072 bits (16 × 4K-bit RAMs)
Delay-Locked Loops (DLLs) 4
Status Not Recommended for New Designs (NRND)

XCV300E-6PQG240C Package & Ordering Information

Attribute Detail
Package Type HSPQFP (Heat Spreader Plastic Quad Flat Pack)
Pin Count 240
Package Code PQG240
Temperature Grade C = Commercial (0°C to +85°C)
Speed Grade -6 (fastest commercial grade in this family)
RoHS Compliance Check distributor listing for RoHS variant availability
DigiKey Part Number XCV300E-6PQ240C-ND
Manufacturer Part Number XCV300E-6PQG240C

Architecture & Features

High-Density Configurable Logic Blocks (CLBs)

The XCV300E-6PQG240C contains 1,536 CLBs, each consisting of two slices. Each slice provides two 4-input Look-Up Tables (LUTs) configurable as:

  • 16-bit RAM
  • 32-bit RAM
  • 16-bit dual-ported RAM
  • 16-bit shift register

This flexibility allows designers to implement complex logic, memory-mapped registers, and FIFOs directly within the CLB fabric — reducing resource overhead and maximizing utilization.

Block RAM – Hierarchical Memory System

The device integrates 16 dedicated synchronous dual-port 4K-bit Block RAMs, providing a total of 131,072 bits (16 KB) of true dual-port on-chip memory. These block RAMs:

  • Support independent read and write operations on both ports simultaneously
  • Operate at full device speed
  • Provide fast interfaces to external high-performance SRAMs and ZBTRAMs
  • Eliminate the need for external memory in many small data-buffer applications

Clock Management with Delay-Locked Loops (DLLs)

The XCV300E-6PQG240C features four dedicated Delay-Locked Loops (DLLs) that provide advanced clock management capabilities, including:

  • Clock deskew and duty-cycle correction
  • Clock multiplication and division
  • Phase shifting for source-synchronous designs
  • Low-skew global clock distribution over four primary clock nets and 24 secondary local clock nets

SelectIO™ Multi-Standard Interface Support

One of the standout features of the Virtex-E family is the SelectIO™ interface technology, supporting up to 16 high-performance I/O standards. This allows the XCV300E-6PQG240C to interface directly with a wide variety of logic families and memory devices without external level translators.

Supported I/O Standards
LVTTL
LVCMOS 3.3V / 2.5V / 1.8V
PCI (3.3V, 5V tolerant)
GTL / GTL+
HSTL (Class I/II/III/IV)
SSTL2 (Class I/II)
SSTL3 (Class I/II)
CTT
AGP
LVDS (differential)
BLVDS (differential)
LVPECL (differential)

PCI Compliance & Hot-Swap Support

The XCV300E-6PQG240C is 66 MHz PCI compliant and supports hot-swapping for CompactPCI applications. This makes it directly suitable for bus-based industrial computer architectures where live board insertion and removal is required.


XCV300E-6PQG240C Electrical Characteristics

Parameter Min Typical Max Unit
Core Supply Voltage (VCCINT) 1.71 1.80 1.89 V
I/O Supply Voltage (VCCIO) 1.4 3.465 V
Input Low Voltage (VIL) 0.8 V
Input High Voltage (VIH) 2.0 V
Operating Temperature 0 85 °C
Static ICC (quiescent) 50 mA (typ.)

XCV300E-6PQG240C Performance Summary

Metric Value
Internal Clock Frequency Up to 357 MHz
System Performance Up to 200 MHz (system-level, including routing)
Pin-to-Pin Logic Delay 6 ns (speed grade -6)
PCI Bus Frequency Support 66 MHz
Block RAM Read/Write Speed Full device clock rate

Typical Applications

The XCV300E-6PQG240C is suited for a broad range of embedded and industrial applications where medium-density programmable logic, multiple I/O standards, and reliable clock management are required.

Application Area Use Case
Telecom & Networking Packet processing, framing, routing logic
Industrial Automation Real-time control logic, sensor data aggregation
Defense & Aerospace Signal processing, data encryption
Test & Measurement High-speed data acquisition, pattern generation
Embedded Computing Custom CPU/DSP co-processors, memory controllers
Digital Signal Processing FIR/IIR filters, FFT engines, codec pipelines
Communications Serial protocol bridges (UART, SPI, I2C), LVDS links
CompactPCI Systems Hot-swap PCI cards, backplane interfaces

Part Number Decoder: Understanding XCV300E-6PQG240C

Breaking down the part number helps you understand exactly what variant you are purchasing.

Segment Meaning
XCV Xilinx Virtex family
300E 300,000 system gates, Virtex-E generation
-6 Speed grade (-6 is the fastest commercial grade; higher number = slower)
PQ Plastic Quad Flat Pack (PQFP) package type
G Green / RoHS-compliant lead-free variant indicator (in some revisions)
240 240-pin count
C Commercial temperature range (0°C to +85°C)

For industrial temperature range (-40°C to +100°C), look for the “I” suffix variant: XCV300E-6PQG240I.


XCV300E-6PQG240C vs. Similar Virtex-E Variants

Part Number Package Pins Speed Grade Temp
XCV300E-6PQG240C HSPQFP 240 -6 Commercial
XCV300E-6PQG240I HSPQFP 240 -6 Industrial
XCV300E-7FG256C FBGA 256 -7 Commercial
XCV300E-6BG352C FBGA 352 -6 Commercial
XCV300E-6BG432C FBGA 432 -6 Commercial
XCV300E-8BG432C FBGA 432 -8 Commercial

Configuration & Programming

The XCV300E-6PQG240C supports multiple configuration modes to suit different system architectures:

  • Master Serial – Uses a serial PROM (e.g., Xilinx XC18V series)
  • Slave Serial – Configured by an external controller
  • Master Parallel – Uses a byte-wide parallel PROM
  • Slave Parallel – For processor-driven configuration
  • JTAG Boundary Scan – IEEE 1149.1 compliant for in-system programming and testing

Recommended Design Tools

Tool Use Case
Xilinx ISE Design Suite Legacy synthesis and implementation for Virtex-E devices
ModelSim / ISIM Functional and timing simulation
ChipScope Pro In-system logic analysis and debugging
iMPACT Device programming and configuration file generation

Note: Xilinx Vivado does not support Virtex-E devices. Use the ISE 14.7 toolchain (the final ISE release) for XCV300E-6PQG240C design and programming.


Design Considerations & PCB Guidelines

When designing with the XCV300E-6PQG240C, the following PCB and power supply guidelines help ensure reliable operation:

  • Decouple VCCINT and VCCIO with 100 nF ceramic capacitors placed as close as possible to each power pin, supplemented by bulk electrolytic capacitors on the power planes.
  • Separate VCCINT (1.8 V) and VCCIO (variable) power rails to allow independent I/O voltage selection per bank.
  • Use matched-length traces for differential I/O pairs (LVDS, LVPECL) to minimize skew.
  • HSPQFP thermal management: The heat spreader pad on the top of the package can be used with a clip-on heatsink for thermally demanding applications.
  • JTAG chain placement: Position the JTAG header close to the FPGA for reliable boundary scan access during production test.

Frequently Asked Questions (FAQ)

Q: Is the XCV300E-6PQG240C still in production? A: The XCV300E-6PQG240C is classified as Not Recommended for New Designs (NRND). It is no longer in active production but may be available through authorized distributors and component brokers for legacy system support.

Q: What is the difference between XCV300E-6PQ240C and XCV300E-6PQG240C? A: The “G” in XCV300E-6PQG240C typically denotes a green/RoHS-compliant lead-free variant of the same device. Core functionality and pin compatibility are identical.

Q: What programming software supports the XCV300E-6PQG240C? A: Use Xilinx ISE 14.7 for synthesis and implementation, and iMPACT for device programming. Vivado does not support this device.

Q: What is the maximum operating frequency of the XCV300E-6PQG240C? A: Internal logic can operate at up to 357 MHz. System-level performance, including routing delays, is typically up to 200 MHz depending on design complexity.

Q: What package alternatives are available for the XCV300E-6PQG240C? A: The same XCV300E die is also available in FBGA packages with 256, 352, and 432 pins, providing more I/O options at the cost of more complex PCB routing.


Summary

The XCV300E-6PQG240C is a proven, mature FPGA delivering 300,000 system gates, 158 user I/O pins, built-in DLLs, and multi-standard SelectIO™ interfaces in a 240-pin HSPQFP package. Operating on a 1.8 V core supply and fabricated in 0.18 µm CMOS technology, it remains a reliable choice for legacy system maintenance, sustained production builds, and applications already qualified on this part. Its 66 MHz PCI compliance, hot-swap capability, and rich I/O standard support make it particularly well suited to CompactPCI, telecom, and industrial control environments.

For engineers evaluating alternatives or building new platforms, explore the full Xilinx FPGA portfolio for current-generation solutions.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.