Overview of the XCV300E-6FG456I FPGA

The XCV300E-6FG456I is a high-performance Field Programmable Gate Array (FPGA) from the renowned Virtex-E family, manufactured by Xilinx (now AMD). This versatile programmable logic device delivers exceptional processing capabilities with 82,944 equivalent gates and 6,912 logic cells, making it an ideal solution for complex digital design applications requiring high-speed performance and flexibility.

Originally designed using advanced 0.18μm CMOS technology, this FPGA operates at impressive clock frequencies up to 357 MHz, providing the computational power needed for demanding applications in telecommunications, industrial automation, medical devices, and aerospace systems.

Key Technical Specifications

Core Performance Parameters

Package and Pin Configuration

Electrical Characteristics

Advanced Features and Capabilities

Programmable Logic Architecture

The XCV300E-6FG456I incorporates Xilinx’s proven Virtex-E architecture, which represents an evolutionary advancement in programmable logic design. The device features:

• Rich Interconnect Hierarchy: Fast and flexible routing resources optimized for place-and-route efficiency
• Advanced 6-Layer Metal Process: Enhanced signal integrity and reduced propagation delays
• High Silicon Efficiency: Optimized architecture delivering superior logic density
• Embedded Memory Blocks: Distributed RAM and dedicated block RAM for data storage

System-Level Features

This Xilinx FPGA offers comprehensive system integration capabilities including:

• Multiple I/O standards support (LVTTL, LVCMOS, PCI, GTL+)
• Dedicated carry logic for high-speed arithmetic operations
• Digital clock management with phase-locked loops (PLLs)
• IEEE 1149.1 (JTAG) boundary-scan support
• SelectRAM memory resources for flexible data buffering

Application Areas

Primary Applications

The XCV300E-6FG456I excels in diverse application domains:

Communications and Networking

• Wireless infrastructure equipment
• Network routers and switches
• Protocol conversion systems
• Signal processing modules

Industrial Automation

• Process control systems
• Motion control applications
• Industrial vision systems
• PLCs and industrial computers

Consumer Electronics

• Digital video processing
• Audio signal processing
• Display controllers
• Set-top boxes

Automotive and Aerospace

• Body electronics and lighting control
• Advanced driver assistance systems (ADAS)
• Avionics systems
• In-vehicle infotainment

Medical Equipment

• Medical imaging devices
• Patient monitoring systems
• Diagnostic equipment
• Laboratory instruments

Design Resources and Development Tools

Software Development Environment

Designers working with the XCV300E-6FG456I can leverage Xilinx’s comprehensive development toolchain:

ISE Design Suite: The legacy integrated development environment supporting Virtex-E devices, providing synthesis, implementation, and simulation capabilities.

Key Tool Features:

• HDL synthesis (VHDL, Verilog)
• Logic simulation and timing analysis
• Place and route optimization
• Bitstream generation
• ChipScope Pro for embedded logic analysis

Development Boards and Evaluation Kits

While the XCV300E-6FG456I is an obsolete/legacy component, compatible development platforms include:

• Custom evaluation boards from third-party vendors
• General-purpose FPGA prototyping boards
• Application-specific reference designs

Pin Configuration and Interface Options

I/O Standards Supported

Thermal Management Considerations

Ordering Information and Availability

Part Number Breakdown

XCV300E-6FG456I

• XC: Xilinx Commercial Product
• V300E: Virtex-E 300K gates
• -6: Speed grade (6 = 357 MHz max)
• FG456: Package type (456-pin Fine BGA)
• I: Industrial temperature range

Lifecycle Status

Important Note: The XCV300E-6FG456I is classified as an obsolete/legacy product by AMD/Xilinx. While still available through authorized distributors and surplus component suppliers, designers should consider:

• Long-term availability constraints
• Transition to current-generation FPGA families (7-Series, UltraScale, Versal)
• Last-time buy opportunities from distributors
• Alternative pin-compatible or functional equivalent devices

Quality and Compliance

Performance Optimization Guidelines

Design Best Practices

To maximize performance from the XCV300E-6FG456I:

1. Clock Domain Management: Properly constrain clock domains and minimize clock domain crossings
2. Pipelining: Insert pipeline registers in high-speed data paths to meet timing
3. Resource Utilization: Balance CLB and routing resource usage for optimal performance
4. Power Distribution: Implement robust power delivery with adequate decoupling capacitors
5. Thermal Design: Ensure adequate cooling to maintain junction temperature within specifications

Timing Closure Strategies

• Utilize timing-driven place and route algorithms
• Apply appropriate timing constraints (period, offset, path)
• Analyze critical paths using static timing analysis
• Implement clock management using dedicated DCM resources
• Consider physical placement constraints for timing-critical logic

Migration and Upgrade Path

Recommended Alternatives

For new designs or product upgrades, consider these modern FPGA families:

Current AMD/Xilinx Families:

• Artix-7: Cost-optimized, lower power consumption
• Spartan-7: Budget-friendly with enhanced features
• Kintex-7: Mid-range performance and capability
• Zynq-7000: SoC with ARM processor and FPGA fabric

Technical Support and Documentation

Available Resources

• Product datasheet with detailed electrical specifications
• User guides for Virtex-E architecture
• Application notes for specific design scenarios
• PCB layout guidelines and reference designs
• IBIS models for signal integrity simulation
• BSDL files for boundary-scan testing

Community and Support

• Xilinx Community Forums (legacy product support)
• Application engineering support from AMD/Xilinx
• Third-party FPGA design service providers
• Online design resources and tutorials

Packaging and Handling

ESD Precautions

The XCV300E-6FG456I is sensitive to electrostatic discharge. Observe proper ESD handling procedures:

• Use grounded ESD wrist straps during handling
• Store devices in ESD-protective packaging
• Work on ESD-safe workstations
• Follow ANSI/ESD S20.20 standards

Storage Recommendations

• Store in moisture barrier bags with desiccant
• Maintain storage temperature: -40°C to +125°C
• Relative humidity: ≤90% non-condensing
• Avoid exposure to corrosive atmospheres
• Bake devices if MSL level is exceeded

Competitive Analysis

Comparison with Contemporary FPGAs

Frequently Asked Questions

Is the XCV300E-6FG456I still available for purchase?

While classified as obsolete, the device remains available through authorized distributors and surplus component suppliers, though availability may be limited.

What development tools support this FPGA?

The Xilinx ISE Design Suite (versions up to 14.7) provides complete design support for Virtex-E devices.

Can this FPGA be used in new designs?

It’s not recommended for new designs due to obsolescence status. Consider current-generation alternatives like Artix-7 or Spartan-7 families.

What is the difference between XCV300E-6FG456I and XCV300E-6FG456C?

The suffix indicates temperature range: ‘I’ = Industrial (-40°C to +100°C), ‘C’ = Commercial (0°C to +85°C).

What PCB design considerations are important?

Critical factors include proper power distribution, decoupling capacitor placement, controlled impedance routing for high-speed signals, and thermal management through vias and copper planes.

Conclusion

The XCV300E-6FG456I represents a proven FPGA solution from Xilinx’s legacy Virtex-E family, offering robust performance for established designs requiring 82K gate equivalents and 357 MHz operation. While newer FPGA architectures provide enhanced capabilities and lower power consumption, this device continues to serve in mature applications where reliability and proven performance are paramount.

For ongoing production support, system maintenance, or legacy design upgrades, the XCV300E-6FG456I remains a viable option through authorized distribution channels. However, forward-looking designs should evaluate contemporary FPGA families that offer superior performance-per-watt, enhanced features, and guaranteed long-term availability.