Overview of XCV300E-6BGG432C FPGA
The XCV300E-6BGG432C is a powerful field-programmable gate array (FPGA) from AMD Xilinx’s renowned Virtex-E family. This advanced programmable logic device offers exceptional performance and flexibility for demanding digital design applications. With 300,000 system gates and a 432-pin BGA package, the XCV300E-6BGG432C delivers robust processing capabilities for industrial, telecommunications, and embedded systems.
As part of the Virtex-E series, this Xilinx FPGA represents a proven solution for engineers requiring high-density programmable logic with reliable performance characteristics. The -6 speed grade provides balanced performance for cost-sensitive applications where maximum speed is not critical.
Key Specifications and Technical Features
Core Technical Specifications
| Specification |
Details |
| Part Number |
XCV300E-6BGG432C |
| Manufacturer |
AMD Xilinx (formerly Xilinx Inc.) |
| Product Family |
Virtex-E FPGAs |
| System Gates |
300,000 (300K) |
| Logic Cells/Elements |
6,912 |
| Speed Grade |
-6 (Commercial) |
| Package Type |
BGA (Ball Grid Array) |
| Pin Count |
432 pins |
| Package Code |
BGG432 |
| Operating Voltage |
2.5V Core / 3.3V I/O |
| Technology Node |
0.22μm (220nm) |
| Temperature Range |
Commercial (0°C to +85°C) |
Package and Mounting Information
| Package Details |
Specifications |
| Package Style |
Ball Grid Array (BGA) |
| Pin Configuration |
432-ball BGA |
| Mounting Type |
Surface Mount Technology (SMT) |
| Package Dimensions |
27mm x 27mm (typical) |
| Ball Pitch |
1.27mm |
| Moisture Sensitivity |
MSL 3 (Moisture Sensitivity Level 3) |
Product Architecture and Design Capabilities
FPGA Architecture Overview
The XCV300E-6BGG432C features Xilinx’s advanced Virtex-E architecture, which delivers:
- 6,912 configurable logic blocks (CLBs) providing flexible logic implementation
- Dedicated block RAM for efficient memory implementation
- Digital Clock Manager (DCM) for advanced clock management
- Flexible I/O capabilities supporting multiple I/O standards
- High-speed routing architecture for optimal signal integrity
Performance Characteristics
| Performance Metric |
Specification |
| Maximum Operating Frequency |
Up to 200 MHz (design-dependent) |
| I/O Standards Support |
LVTTL, LVCMOS, PCI, GTL, SSTL, HSTL |
| Total Block RAM |
32 Kbits |
| Maximum User I/O |
344 I/O pins |
| Configuration Memory |
SRAM-based |
| Configuration Time |
Typically < 100ms |
Application Areas and Use Cases
Primary Applications
The XCV300E-6BGG432C FPGA excels in numerous applications:
- Industrial Automation – PLCs, motor control, and process automation
- Telecommunications – Protocol conversion, signal processing, and network equipment
- Data Acquisition Systems – High-speed data capture and processing
- Medical Devices – Imaging systems and diagnostic equipment
- Automotive Electronics – Advanced driver assistance and control systems
- Defense and Aerospace – Radar processing and avionics systems
Design Implementation Benefits
| Benefit |
Description |
| Rapid Prototyping |
SRAM-based configuration enables quick design iterations |
| Field Upgradeability |
Remotely update functionality via reprogramming |
| Cost-Effective |
Reduces NRE costs compared to ASIC development |
| Proven Reliability |
Mature Virtex-E architecture with extensive field deployment |
| Design Tool Support |
Compatible with Xilinx ISE Design Suite |
Programming and Development Support
Development Tools Compatibility
- Xilinx ISE (Integrated Software Environment) – Complete design suite
- EDK (Embedded Development Kit) – For embedded processor designs
- ChipScope Pro – Integrated logic analyzer
- FPGA Editor – Low-level design viewing and editing
- Impact – Configuration and programming utility
Configuration Options
| Configuration Method |
Description |
| JTAG |
Industry-standard boundary scan programming |
| Master Serial |
Direct configuration from serial PROM |
| Slave Serial |
Configuration from external microcontroller |
| SelectMAP |
High-speed parallel configuration |
| Boundary Scan |
IEEE 1149.1 compliant testing |
Competitive Advantages and Market Position
Why Choose XCV300E-6BGG432C?
- Established Technology – Proven track record in production environments
- Comprehensive Documentation – Extensive datasheets and application notes
- Wide Availability – Multiple distribution channels
- Cost-Effective Performance – Optimal price-to-performance ratio
- Long-Term Support – Xilinx legacy product support programs
Comparison with Related Models
| Model |
Gates |
Speed Grade |
Package |
Key Difference |
| XCV300E-6BGG432C |
300K |
-6 |
432-BGA |
Standard performance |
| XCV300E-7BGG432C |
300K |
-7 |
432-BGA |
Faster speed grade |
| XCV300E-8BGG432C |
300K |
-8 |
432-BGA |
Highest speed grade |
| XCV400E-6BGG432C |
400K |
-6 |
432-BGA |
Higher gate count |
| XCV300E-6FG456C |
300K |
-6 |
456-FBGA |
Different package option |
Ordering Information and Part Number Breakdown
Part Number Decoding
XCV300E-6BGG432C
- XC = Xilinx Commercial FPGA
- V300E = Virtex-E, 300K system gates
- 6 = Speed grade (-6)
- BGG = Ball Grid Array, Green (RoHS compliant)
- 432 = Pin count (432 balls)
- C = Commercial temperature range (0°C to +85°C)
Related Part Numbers
- XCV300E-6BGG432I (Industrial temperature: -40°C to +100°C)
- XCV300E-6BG432C (Standard BG package, non-green)
- XCV300E-7BGG432C (Faster -7 speed grade)
Quality and Reliability Standards
Manufacturing and Compliance
| Standard |
Compliance |
| RoHS |
Compliant (Lead-free) |
| MSL Rating |
Level 3 @ 260°C |
| Quality Standard |
ISO 9001 certified manufacturing |
| Reliability Testing |
Automotive-grade qualification available |
| Country of Origin |
Typically Malaysia or Singapore |
| Export Control |
ECCN may apply – verify current status |
Storage and Handling Recommendations
Best Practices
- Storage Conditions
- Temperature: 15°C to 30°C
- Relative Humidity: 20% to 60% RH
- Store in moisture barrier bag until ready for use
- Handling Precautions
- Use ESD-safe workstations and grounding
- Handle by edges to avoid damage to BGA balls
- Avoid exposure to moisture before reflow
- Baking Requirements
- If MSL floor life exceeded: Bake at 125°C for 24 hours
- Allow adequate cooling before processing
Design Considerations and Best Practices
Power Supply Design
The XCV300E-6BGG432C requires careful power supply design:
- Core Voltage (VCCINT): 2.5V ± 5%
- I/O Voltage (VCCO): 1.5V to 3.3V (bank-dependent)
- Auxiliary Voltage (VCCAUX): 3.3V or 2.5V
- Recommended decoupling: Multiple 0.1μF and 0.01μF capacitors per power pin
Thermal Management
| Thermal Parameter |
Specification |
| θJA (Junction-to-Ambient) |
~30°C/W (with airflow) |
| Maximum Junction Temp |
+125°C |
| Recommended Operating |
Keep junction < +100°C for reliability |
Support Resources and Documentation
Available Resources
- Product Datasheets – Complete electrical and mechanical specifications
- User Guides – Virtex-E Family documentation
- Application Notes – Design optimization techniques
- Design Constraints Files – UCF files for pin assignments
- Reference Designs – Example implementations
- Technical Support – AMD Xilinx support forums and FAQs
Frequently Asked Questions (FAQ)
Q: Is the XCV300E-6BGG432C still in production?
While the Virtex-E family is considered mature technology, the XCV300E-6BGG432C remains available through authorized distributors and may be available for new designs depending on your requirements. Contact your local distributor for current availability and lifecycle status.
Q: What development tools are required?
The XCV300E-6BGG432C is supported by Xilinx ISE Design Suite versions 6.1i through 14.7 (final release). Newer Vivado tools do not support Virtex-E devices.
Q: Can I upgrade from XCV300E-6BGG432C to a newer FPGA?
Yes, migration paths exist to newer Xilinx families such as Spartan-6, Artix-7, or Kintex-7, though design modifications will be required due to architectural differences.
Q: What is the typical lead time for ordering?
Lead times vary by distributor and market conditions. Standard delivery typically ranges from 8-16 weeks for factory orders, though some distributors maintain stock for immediate shipment.
Conclusion
The XCV300E-6BGG432C Xilinx Virtex-E FPGA delivers proven performance and reliability for a wide range of programmable logic applications. With 300,000 system gates, 432-pin BGA packaging, and comprehensive development tool support, this FPGA provides an excellent balance of capabilities and cost-effectiveness.
Whether you’re developing industrial control systems, telecommunications equipment, or embedded computing platforms, the XCV300E-6BGG432C offers the flexibility and performance needed for successful product development. Its mature architecture and extensive documentation make it an excellent choice for engineers seeking reliable, field-proven FPGA technology.
For procurement inquiries, technical support, or additional product information about the XCV300E-6BGG432C or other Xilinx FPGA solutions, consult with authorized distributors or visit AMD Xilinx’s official resources.
