Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XCV300E-6BG352I: High-Performance Virtex-E FPGA for Advanced Digital Design Applications

Product Details

Overview of XCV300E-6BG352I FPGA

The XCV300E-6BG352I is a powerful Field Programmable Gate Array (FPGA) from AMD Xilinx’s acclaimed Virtex-E family. This industrial-grade programmable logic device delivers exceptional performance for complex digital signal processing, embedded systems, and high-reliability applications. With 6,912 logic cells and 260 I/O pins, the XCV300E-6BG352I represents a proven solution for engineers requiring robust, reconfigurable hardware in demanding environments.

Key Technical Specifications

Electrical and Logic Characteristics

Specification Value
Part Number XCV300E-6BG352I
Manufacturer AMD Xilinx
Product Family Virtex-E
Logic Elements/Cells 6,912
Number of LABs/CLBs 1,536
System Gates 300,000 (nominal) / 411,955 (actual)
Total RAM Bits 131,072 (128 Kbit)
Block RAM 288 Kbit
Number of I/O Pins 260
Maximum Frequency 450 MHz
Supply Voltage 1.71V ~ 1.89V (1.8V nominal)

Package and Environmental Specifications

Specification Details
Package Type 352-LBGA (Land Grid Ball Array)
Package Configuration Exposed Pad, Metal
Supplier Package 352-MBGA (35×35 mm)
Mounting Type Surface Mount
Operating Temperature Range -40°C to +100°C (TJ)
Product Status Obsolete (Legacy support available)
Packaging Tray

Advanced Features and Capabilities

Hardware Architecture

The XCV300E-6BG352I incorporates several advanced architectural features that make it suitable for sophisticated digital design projects:

  • High-Density Logic Resources: With nearly 7,000 logic cells, this FPGA provides ample resources for complex state machines, arithmetic functions, and custom digital circuits
  • Configurable Block RAM: The 131 Kbit of total RAM supports efficient data buffering, FIFO implementations, and memory-intensive applications
  • Flexible I/O Standards: The 260 I/O pins support multiple voltage standards and signaling protocols for seamless interface with various components
  • Phase-Locked Loop (PLL): Internal clock management resources enable precise timing control and frequency synthesis

Speed Grade and Performance

The “-6” speed grade designation indicates this device offers balanced performance characteristics suitable for most industrial applications. Operating at frequencies up to 450 MHz, the XCV300E-6BG352I delivers adequate processing speed for:

  • Digital signal processing (DSP) algorithms
  • Real-time data acquisition systems
  • High-speed communications protocols
  • Embedded control systems
  • Industrial automation applications

Application Areas for XCV300E-6BG352I

Primary Use Cases

Application Domain Typical Implementation
Telecommunications Protocol converters, data packet processing, baseband processing
Industrial Control PLC functionality, motor control, sensor interfacing
Automotive Systems Electronic control units (ECU), dashboard controllers, safety systems
Medical Equipment Signal processing for diagnostic devices, patient monitoring systems
Test & Measurement Logic analyzers, oscilloscopes, protocol analyzers
Consumer Electronics Video processing, audio DSP, interface controllers

Sample Implementation: Digital Clock Design

The XCV300E-6BG352I’s reconfigurable architecture makes it ideal for educational and prototyping applications. A digital clock implementation might utilize:

  1. Clock Generation: Internal PLL resources generate stable timing signals
  2. Time Keeping Logic: Counters and state machines track hours, minutes, and seconds
  3. Display Interface: I/O pins drive seven-segment displays or LCD modules
  4. Additional Features: Alarm functionality, stopwatch modes, calendar features

Technical Advantages of Virtex-E FPGAs

Why Choose Virtex-E Technology

The Xilinx FPGA Virtex-E family revolutionized programmable logic by introducing high-performance capabilities in a cost-effective package. Key advantages include:

  • Proven Reliability: Extensive field deployment across multiple industries
  • Rich Ecosystem Support: Comprehensive development tools, IP cores, and documentation
  • Design Flexibility: Full reconfigurability allows design modifications without hardware changes
  • Lower Power Consumption: 1.8V core voltage reduces power requirements compared to earlier generations
  • Extensive IP Library: Access to pre-verified design blocks accelerates development

Power Management Features

The XCV300E-6BG352I incorporates intelligent power management capabilities:

  • Dynamic power scaling based on utilization
  • Low-power standby modes
  • Optimized voltage regulation (1.71V – 1.89V range)
  • Reduced power consumption through advanced 0.18μm process technology

Design and Development Considerations

Programming and Configuration

Engineers working with the XCV300E-6BG352I typically use:

  • Hardware Description Languages: Verilog, VHDL, or SystemVerilog
  • Development Tools: Xilinx ISE Design Suite (legacy) or compatible toolchains
  • Configuration Methods: JTAG programming, master/slave serial configuration
  • Simulation: ModelSim, ISIM, or other HDL simulators

Pin Assignment and I/O Planning

I/O Feature Specification
Total User I/O 260 pins
Bank Architecture Multiple I/O banks for voltage flexibility
I/O Standards Supported LVTTL, LVCMOS, SSTL, HSTL, and others
Differential Pairs Support for LVDS and other differential standards

Procurement and Availability

Product Status and Support

While the XCV300E-6BG352I carries an “obsolete” designation from the manufacturer, this FPGA remains available through:

  • Authorized distributors with existing inventory
  • Independent component suppliers and brokers
  • Electronic component marketplaces
  • Legacy support programs

Quality Assurance

Reputable suppliers provide:

  • Authenticity Verification: Anti-counterfeit measures and traceability
  • Pre-Shipment Inspection: Quality control testing before delivery
  • Original Packaging: Factory-sealed, anti-static packaging
  • Warranty Coverage: Typically 90 days to 1 year depending on supplier

Ordering Information

Component Details
Base Part Number XCV300E
Speed Grade -6 (commercial speed)
Package Code BG352 (352-ball BGA)
Temperature Range I (Industrial: -40°C to +100°C)
Full Part Number XCV300E-6BG352I

Comparison with Similar FPGAs

Virtex-E Family Variants

Part Number Logic Cells I/O Pins Package Key Difference
XCV300E-6BG352I 6,912 260 352-BGA Standard industrial variant
XCV300E-6BG432C 6,912 316 432-BGA More I/O pins, commercial temp
XCV300E-6FG456I 6,912 316 456-BGA Fine-pitch BGA package
XCV300E-4BG352I 6,912 260 352-BGA Slower speed grade (-4)

Installation and Integration Guidelines

PCB Design Recommendations

When integrating the XCV300E-6BG352I into circuit board designs:

  1. Thermal Management: Ensure adequate heat dissipation for the exposed pad package
  2. Power Supply Design: Provide clean, stable 1.8V core voltage with proper decoupling
  3. Signal Integrity: Follow high-speed design practices for clock and critical signals
  4. Ground Planes: Implement solid ground planes for EMI reduction
  5. Ball Grid Array Layout: Use appropriate PCB stackup and via structures for BGA mounting

Reference Design Resources

Developers can leverage:

  • Application notes from AMD Xilinx
  • Reference schematics for Virtex-E boards
  • Community forums and design examples
  • Third-party development boards and evaluation kits

Troubleshooting and Common Issues

Design Challenges and Solutions

Challenge Solution
Timing Closure Optimize synthesis settings, use pipelining, adjust placement constraints
Resource Utilization Efficient HDL coding, resource sharing, block RAM usage optimization
Configuration Issues Verify bitstream generation, check JTAG connections, validate configuration mode
I/O Standard Mismatch Carefully specify IOSTANDARD constraints in UCF file

Long-Term Support and Alternatives

Legacy Product Considerations

For new designs, engineers should consider:

  • Current Availability: Assess long-term supply chain for XCV300E-6BG352I
  • Lifecycle Planning: Plan for potential obsolescence and component sourcing
  • Alternative Devices: Evaluate newer Xilinx families (Spartan, Artix, Kintex) for new projects
  • Stock Management: Maintain adequate inventory for ongoing production

Migration Path Options

Organizations using XCV300E-6BG352I can explore:

  • Direct drop-in replacements (if available)
  • Pin-compatible alternatives from the Virtex-E family
  • Design migration to newer FPGA architectures
  • Last-time-buy opportunities from suppliers

Frequently Asked Questions

What is the XCV300E-6BG352I used for?

The XCV300E-6BG352I serves applications requiring reconfigurable digital logic, including telecommunications equipment, industrial control systems, automotive electronics, medical devices, and embedded systems requiring custom processing capabilities.

Is the XCV300E-6BG352I still in production?

The XCV300E-6BG352I is classified as obsolete by AMD Xilinx, meaning active production has ceased. However, inventory remains available through distributors, surplus suppliers, and independent component brokers.

What development tools support XCV300E-6BG352I?

This FPGA is supported by Xilinx ISE Design Suite (legacy toolchain). Modern tools like Vivado do not support Virtex-E devices, so designers must use ISE version 14.7 or earlier.

What is the difference between XCV300E-6BG352I and XCV300E-6BG352C?

The primary difference is temperature range: the “I” suffix indicates industrial temperature range (-40°C to +100°C), while “C” denotes commercial temperature range (0°C to +85°C).

Can I replace XCV300E-6BG352I with a newer FPGA?

Direct replacement depends on your specific application. While newer FPGAs offer better performance, pin compatibility, voltage requirements, and software tools differ. A design migration would likely be necessary rather than a simple swap.

Conclusion: Reliable FPGA Solution for Industrial Applications

The XCV300E-6BG352I remains a valuable programmable logic solution for maintenance, repair, and legacy system support. Its combination of 6,912 logic cells, 260 I/O pins, and industrial temperature range makes it suitable for demanding applications where proven technology and reliability are paramount.

While classified as obsolete, the extensive installed base and continued availability ensure that engineers can confidently specify this device for legacy product support and specific applications where its capabilities align with project requirements. For organizations maintaining existing XCV300E-6BG352I-based systems, reputable suppliers continue to provide authentic components with quality assurance and warranty support.

When evaluating FPGAs for new projects, designers should assess current-generation alternatives while recognizing that the XCV300E-6BG352I’s proven track record in industrial environments represents decades of field-tested reliability.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.