Contact Sales & After-Sales Service

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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XCV300E-6BG352C: High-Performance Virtex-E FPGA for Advanced Digital Design

Product Details

Overview of XCV300E-6BG352C Field Programmable Gate Array

The XCV300E-6BG352C is a powerful Field Programmable Gate Array (FPGA) from AMD Xilinx’s Virtex-E family, designed to deliver exceptional performance for complex digital applications. This advanced programmable logic device combines high-speed processing capabilities with flexible configuration options, making it an ideal choice for engineers developing sophisticated embedded systems, telecommunications equipment, and high-performance computing solutions.

Originally manufactured by Xilinx (now part of AMD), this FPGA represents a significant advancement in programmable logic technology, offering enhanced capabilities over standard gate array solutions while maintaining the flexibility that makes FPGAs invaluable in modern electronic design.

Key Technical Specifications

Core Performance Features

Specification Value
Part Number XCV300E-6BG352C
Manufacturer AMD (formerly Xilinx)
Product Family Virtex-E
System Gates 82,944K Gates
Logic Cells 6,912 Cells
Maximum Frequency 357 MHz
RAM Bits 131,072 bits
I/O Pins 260 I/O

Package and Physical Characteristics

Feature Specification
Package Type 352-LBGA (Low-Profile Ball Grid Array)
Package Configuration Metal BGA with Exposed Pad
Pin Count 352 Terminals
Mounting Type Surface Mount
Manufacturing Technology 0.18μm CMOS Process
Metal Layers 6-layer metal construction

Electrical Specifications

Parameter Rating
Supply Voltage 1.8V nominal
Voltage Range 1.71V ~ 1.89V
Speed Grade -6 (6ns)
Operating Temperature -40°C to +100°C (Junction Temperature)

Why Choose XCV300E-6BG352C for Your FPGA Applications?

Advanced Architecture Benefits

The XCV300E-6BG352C leverages Xilinx’s optimized Virtex-E architecture, which delivers dramatic increases in silicon efficiency. The aggressive 6-layer metal 0.18μm CMOS process technology enables this FPGA to serve as a powerful and flexible alternative to traditional mask-programmed gate arrays.

Superior Design Flexibility

With 6,912 configurable logic cells and 131,072 RAM bits, the XCV300E-6BG352C provides extensive resources for implementing complex digital designs. The 260 I/O pins offer ample connectivity options for interfacing with various peripheral devices and systems.

High-Speed Performance

Operating at frequencies up to 357 MHz with a -6 speed grade, this Virtex-E FPGA delivers the performance needed for demanding real-time applications, digital signal processing, and high-throughput data processing tasks.

Common Applications and Use Cases

Telecommunications Systems

The XCV300E-6BG352C excels in telecommunications infrastructure, where its high-speed capabilities and programmable nature make it ideal for:

  • Digital signal processing in communication systems
  • Protocol conversion and data routing
  • Software-defined radio implementations
  • Network processing equipment

Industrial Automation

Engineers utilize this FPGA in industrial control systems for:

  • Motion control applications
  • Machine vision processing
  • Real-time data acquisition systems
  • Industrial networking interfaces

High-Performance Computing

The device’s architecture supports:

  • Custom compute accelerators
  • Parallel processing implementations
  • Algorithm acceleration
  • High-speed data processing pipelines

Embedded Systems Development

Perfect for embedded applications requiring:

  • Custom peripheral interfaces
  • System-on-chip (SoC) prototyping
  • Legacy system modernization
  • Complex state machine implementations

Technical Advantages of Virtex-E FPGA Technology

Enhanced Silicon Efficiency

The Virtex-E family architecture optimizes place-and-route efficiency, allowing designers to achieve higher utilization rates and better performance compared to earlier FPGA generations.

Rich Interconnect Resources

The XCV300E-6BG352C features a hierarchical interconnect structure that provides:

  • Fast signal routing between logic blocks
  • Flexible connectivity options
  • Reduced routing congestion
  • Predictable timing characteristics

Advanced Process Technology

Built on a 0.18-micron CMOS process with 6 metal layers, this FPGA achieves:

  • Lower power consumption
  • Higher integration density
  • Improved signal integrity
  • Better thermal performance

Design Considerations and Implementation Guidelines

Power Supply Requirements

When designing with the XCV300E-6BG352C, ensure proper power supply implementation:

  • Maintain 1.8V core voltage within ±5% tolerance
  • Implement appropriate decoupling capacitors
  • Consider power sequencing requirements
  • Plan for adequate thermal management

PCB Design Recommendations

For optimal performance:

  • Use controlled impedance routing for high-speed signals
  • Implement proper ground plane strategies
  • Maintain adequate clearance around the BGA package
  • Follow manufacturer’s footprint guidelines
  • Consider signal integrity for critical paths

Development Tool Support

The XCV300E-6BG352C is supported by industry-standard FPGA development tools, enabling efficient design, simulation, and implementation workflows.

Comparison with Related Virtex-E Family Devices

XCV300E Package Variants

Part Number Package I/O Count Key Difference
XCV300E-6BG352C 352-BGA 260 Standard commercial grade
XCV300E-6BG432C 432-BGA Higher I/O Larger package option
XCV300E-6FG256C 256-FBGA 176 Compact footprint
XCV300E-6FG456C 456-FBGA Higher I/O Maximum I/O configuration

Speed Grade Options

The Virtex-E family offers different speed grades to match performance requirements and budget constraints. The -6 speed grade provides an excellent balance of performance and cost-effectiveness for most applications.

Procurement and Availability Information

Product Status

Important Note: The XCV300E-6BG352C is currently classified as an obsolete/discontinued product by the original manufacturer. However, it remains available through authorized distributors and electronic component suppliers who maintain inventory for legacy system support and existing design continuity.

Quality Assurance

When sourcing the XCV300E-6BG352C:

  • Verify authenticity through authorized distributors
  • Request proper documentation and certificates
  • Ensure parts meet original datasheet specifications
  • Check for proper ESD protection packaging
  • Confirm date codes and manufacturing lots

Alternative Solutions

For new designs, consider exploring current-generation Xilinx FPGA options that offer enhanced features, improved performance, and long-term availability. Modern Xilinx and AMD FPGA families provide backward-compatible development tools and migration paths from Virtex-E designs.

Integration and Support Resources

Design Resources

Successful implementation of the XCV300E-6BG352C requires:

  • Access to complete datasheet documentation
  • Reference design examples
  • Application notes specific to the Virtex-E family
  • Timing and power analysis tools
  • Simulation models for system verification

Technical Support Considerations

When working with this legacy FPGA:

  • Maintain documentation from original designs
  • Archive development tool versions
  • Preserve configuration bitstreams
  • Document any custom IP cores
  • Plan for potential future migrations

Environmental and Compliance Information

RoHS Status

The XCV300E-6BG352C is classified as RoHS non-compliant, which is important to consider for:

  • New product development in regulated markets
  • Export requirements
  • Environmental compliance obligations
  • End-of-life disposal planning

Handling and Storage

To maintain device reliability:

  • Store in ESD-protective packaging
  • Control humidity and temperature exposure
  • Follow moisture sensitivity level (MSL) guidelines
  • Implement proper ESD control procedures during handling
  • Use appropriate reflow soldering profiles

Frequently Asked Questions About XCV300E-6BG352C

What makes the Virtex-E family suitable for high-performance applications?

The Virtex-E architecture combines optimized logic cell design, abundant routing resources, and advanced process technology to deliver superior performance. The 0.18μm process enables higher operating frequencies while the hierarchical interconnect structure ensures efficient signal routing.

Can the XCV300E-6BG352C be used in new designs?

While technically possible, using discontinued components in new designs presents long-term support challenges. For new projects, consider current-generation FPGAs that offer better performance, improved tools, and guaranteed long-term availability.

What is the difference between speed grades?

Speed grades indicate the maximum performance capabilities of the FPGA. The -6 designation represents a specific timing grade, with lower numbers indicating faster performance. Speed grade selection should balance performance requirements with system cost.

How does BGA package impact board design?

The 352-pin BGA package requires specific PCB design considerations including controlled impedance traces, adequate via design, and proper thermal management. Professional PCB layout tools and expertise are recommended for successful implementation.

What development tools support this device?

The XCV300E-6BG352C is supported by Xilinx ISE (Integrated Software Environment) design tools. Ensure compatibility with your specific tool version, as newer tool releases may have limited support for legacy devices.

Conclusion: XCV300E-6BG352C for Legacy System Support

The XCV300E-6BG352C represents proven FPGA technology that has powered countless applications across telecommunications, industrial automation, and embedded systems. While classified as obsolete for new designs, this Virtex-E family device remains crucial for maintaining and supporting existing systems.

For engineers supporting legacy equipment or completing designs already utilizing this component, the XCV300E-6BG352C delivers reliable performance with well-understood characteristics. The extensive documentation and design resources available make it possible to maintain and modify existing implementations effectively.

Organizations planning long-term product lifecycles should explore migration paths to current-generation Xilinx FPGA solutions while maintaining support for existing XCV300E-6BG352C deployments. This balanced approach ensures both immediate operational continuity and future system sustainability.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.