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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
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Notes:
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XCV200E-7PQ240I: High-Performance Virtex-E FPGA for Advanced Embedded Systems

Product Details

Product Overview: XCV200E-7PQ240I FPGA Solution

The XCV200E-7PQ240I represents a powerful field-programmable gate array (FPGA) from the renowned Virtex-E family, manufactured by Xilinx (now AMD). This industrial-grade programmable logic device delivers exceptional performance for complex digital designs, offering engineers a reliable solution for high-speed data processing, embedded system development, and custom logic implementation.

As part of the Virtex-E series, the XCV200E-7PQ240I combines advanced 0.18μm CMOS technology with 1.8V core voltage operation, making it an energy-efficient choice for industrial applications requiring robust performance in challenging temperature conditions.

Technical Specifications

Core Features and Parameters

Specification Details
Part Number XCV200E-7PQ240I
Manufacturer Xilinx Inc. (AMD)
Product Family Virtex-E FPGAs
Package Type PQ240 (240-Pin Plastic Quad Flat Pack)
Temperature Grade Industrial (-40°C to +100°C)
Speed Grade -7 (High Performance)
Core Voltage 1.8V
Logic Cells Approximately 4,704 cells
I/O Count 176 User I/Os
System Gates 200,000 gates

Package and Pin Configuration

Parameter Specification
Package Style PQFP (Plastic Quad Flat Pack)
Total Pins 240 pins
Mounting Type Surface Mount
Pin Pitch 0.5mm
Package Dimensions 32mm x 32mm (nominal)
Body Thickness Standard JEDEC compliant

Memory and Logic Resources

Resource Type Capacity
CLB Slices 2,352
Block RAM 56 Kbits
Distributed RAM Available in CLBs
DLLs (Digital Delay Lock Loops) 4
Maximum User I/O 176
Differential I/O Pairs Up to 88 pairs

Key Features and Benefits

Advanced FPGA Architecture

The XCV200E-7PQ240I leverages the proven Virtex-E architecture, delivering superior place-and-route efficiency through optimized silicon design. This Xilinx FPGA incorporates a rich hierarchy of interconnect resources, enabling high-speed signal routing and minimal propagation delays across complex designs.

Architecture Highlights:

  • Five-layer metal CMOS process for enhanced signal integrity
  • Dedicated carry chains for high-speed arithmetic operations
  • Flexible logic block configuration supporting multiple design topologies
  • Advanced clock management with integrated DLL technology

Industrial Temperature Range Performance

The “I” designation in the XCV200E-7PQ240I part number signifies industrial temperature grade certification, ensuring reliable operation across extended temperature ranges from -40°C to +100°C. This makes the device ideal for:

  • Automotive electronics systems
  • Industrial control and automation
  • Outdoor telecommunications equipment
  • Military and aerospace applications
  • Medical instrumentation

Speed Grade -7 Performance

The speed grade -7 designation indicates high-performance timing characteristics, providing:

  • Fast propagation delays for time-critical paths
  • High maximum operating frequencies
  • Reduced setup and hold times
  • Enhanced throughput for data-intensive applications

Application Areas

Industrial Automation and Control

The XCV200E-7PQ240I excels in industrial environments where programmable logic provides flexibility for:

  • Motor control systems
  • PLC (Programmable Logic Controller) implementations
  • Factory automation interfaces
  • Real-time monitoring systems
  • Process control applications

Communications Infrastructure

This FPGA solution supports various communication protocols and standards:

  • Digital signal processing (DSP) functions
  • Protocol conversion and bridging
  • Network packet processing
  • Telecommunications base stations
  • Data acquisition systems

Embedded System Development

Engineers leverage the XCV200E-7PQ240I for custom embedded solutions:

  • Custom processor cores
  • Co-processor acceleration
  • Peripheral interface controllers
  • System-on-chip (SoC) prototyping
  • Embedded vision processing

Performance Specifications

Electrical Characteristics

Parameter Min Typ Max Unit
Core Voltage (VCCINT) 1.71 1.8 1.89 V
I/O Voltage (VCCO) 1.4 Various 3.6 V
Static Power (Typ) 300 mW
Junction Temperature -40 +125 °C

Timing Performance

The -7 speed grade delivers competitive timing performance:

  • Internal clock frequencies exceeding 200 MHz for many designs
  • Low input-to-output delays
  • Minimal clock-to-output times
  • Fast configuration times for rapid system initialization

Design and Development Support

Compatible Development Tools

The XCV200E-7PQ240I integrates seamlessly with Xilinx development environments:

Software Support:

  • Xilinx ISE Design Suite (legacy support)
  • Xilinx Vivado (for migration planning)
  • Third-party synthesis tools
  • VHDL and Verilog HDL support
  • Schematic capture interfaces

Programming Options:

  • JTAG boundary scan programming
  • Master Serial configuration mode
  • Slave Serial configuration mode
  • SelectMAP parallel configuration
  • Configuration PROM support

IP Core Compatibility

Designers can leverage extensive IP core libraries:

  • Memory controllers (SDRAM, DDR)
  • Communication interfaces (UART, SPI, I2C)
  • DSP functions and filters
  • PCI bus interfaces
  • Custom IP integration

Package Information: PQ240

PQ240 Package Advantages

The 240-pin Plastic Quad Flat Pack offers several benefits:

Space Efficiency:

  • Compact 32mm x 32mm footprint
  • Suitable for dense PCB layouts
  • Four-sided pin arrangement maximizing I/O density

Manufacturing Benefits:

  • Standard SMT assembly processes
  • Industry-standard package dimensions
  • Proven thermal characteristics
  • Cost-effective production scaling

Design Flexibility:

  • Adequate pin count for medium-complexity designs
  • Manageable routing complexity
  • Standard 0.5mm pin pitch
  • Compatible with automated optical inspection (AOI)

Quality and Reliability

Manufacturing Standards

The XCV200E-7PQ240I adheres to stringent quality standards:

  • ISO 9001 certified manufacturing
  • JEDEC standard compliance
  • Automotive-grade quality processes (where applicable)
  • RoHS compliant versions available
  • Full traceability and quality documentation

Reliability Metrics

Xilinx FPGAs undergo extensive reliability testing:

  • HTOL (High Temperature Operating Life) testing
  • Temperature cycling qualification
  • Moisture sensitivity level (MSL) classification
  • ESD protection testing
  • Latch-up immunity verification

Comparison with Related Devices

Virtex-E Family Comparison

Device System Gates CLB Slices Block RAM Max I/Os
XCV50E 50,000 384 32 Kbits 176
XCV100E 100,000 1,200 40 Kbits 176
XCV200E 200,000 2,352 56 Kbits 176
XCV300E 300,000 3,456 72 Kbits 316
XCV400E 400,000 4,704 96 Kbits 404

Package Variants

The XCV200E is available in multiple package options:

Package Pins I/Os Form Factor
CS144 144 97 Chip Scale
PQ240 240 176 Plastic Quad Flat Pack
FG256 256 176 Fine-Pitch BGA
BG352 352 260 Ball Grid Array
FG456 456 284 Fine-Pitch BGA

Power Management Considerations

Power Supply Requirements

Proper power delivery ensures optimal XCV200E-7PQ240I performance:

Voltage Domains:

  • VCCINT (Core): 1.8V ±5% for logic operation
  • VCCO (I/O Banks): 1.4V to 3.6V depending on I/O standard
  • VCCAUX: 2.5V for DLL and auxiliary functions

Decoupling Recommendations:

  • Multiple ceramic capacitors per power domain
  • Bulk capacitance for transient response
  • Low-ESR capacitors near BGA vias
  • Proper power plane design

Thermal Management

The industrial temperature grade requires appropriate thermal design:

Thermal Characteristics:

  • Junction-to-ambient thermal resistance varies by airflow
  • Heat sink recommendations for high-utilization designs
  • Thermal simulation recommended for dense applications
  • Temperature monitoring capabilities available

Design Best Practices

PCB Layout Guidelines

Optimizing PCB design for the XCV200E-7PQ240I:

Signal Integrity:

  • Controlled impedance routing for high-speed signals
  • Differential pair matching for LVDS interfaces
  • Ground plane continuity
  • Proper via placement and routing

Power Distribution:

  • Dedicated power planes for each voltage domain
  • Adequate trace widths for current capacity
  • Strategic decoupling capacitor placement
  • Low-inductance power delivery paths

Configuration Strategy

Several configuration methods support different system requirements:

Master Mode:

  • FPGA controls configuration process
  • Reads bitstream from external memory
  • Suitable for standalone operation

Slave Mode:

  • External controller provides bitstream
  • Lower component cost
  • Simplified board design

JTAG Configuration:

  • Development and debugging
  • In-system reprogramming
  • Boundary scan testing

Migration and Obsolescence Planning

Product Lifecycle Status

The Virtex-E family has reached end-of-life status. For new designs, consider:

Migration Paths:

  • Spartan-6 family for cost-optimized designs
  • Artix-7 family for enhanced performance
  • Kintex-7 for higher logic density
  • Zynq SoC for processor integration

Legacy Support:

  • Continued availability from distribution channels
  • Design tools remain accessible
  • Technical documentation preserved
  • Third-party support ecosystem

Frequently Asked Questions

What makes the XCV200E-7PQ240I suitable for industrial applications?

The industrial temperature grade (-40°C to +100°C) and robust design make this FPGA ideal for harsh environments where commercial-grade components would fail. The extended temperature range ensures reliable operation in automotive, industrial control, and outdoor telecommunications applications.

How does speed grade -7 compare to other options?

Speed grade -7 represents high-performance timing specifications within the Virtex-E family. It offers faster propagation delays and higher maximum frequencies compared to -4, -5, and -6 speed grades, while -8 provides the absolute highest performance for the most demanding applications.

What development tools are required?

The XCV200E-7PQ240I requires Xilinx ISE Design Suite for legacy support, though migration to Vivado is recommended for long-term projects. Standard HDL languages (VHDL, Verilog) are supported along with schematic capture tools.

Is the XCV200E-7PQ240I RoHS compliant?

RoHS compliance varies by specific date code and manufacturing lot. Consult with your distributor for RoHS-compliant versions or refer to Xilinx documentation for environmental compliance information specific to your procurement requirements.

What configuration memory is recommended?

For Master Serial mode, Xilinx configuration PROMs (XCF series) are recommended. The XCV200E requires approximately 2.5 Megabits of configuration data, making the XCF04S or XCF08P suitable options depending on future design expansion needs.

Ordering Information and Availability

Part Number Nomenclature

Understanding the XCV200E-7PQ240I designation:

  • XCV = Virtex-E family identifier
  • 200 = 200K system gate equivalent
  • E = Enhanced features (DLLs, block RAM)
  • -7 = Speed grade (performance level)
  • PQ240 = Package type and pin count
  • I = Industrial temperature range

Where to Buy

The XCV200E-7PQ240I is available through:

  • Authorized Xilinx distributors
  • Electronic component retailers
  • Specialized FPGA suppliers
  • Surplus and obsolete part specialists

For comprehensive Xilinx FPGA solutions and technical support, visit Xilinx FPGA resources.

Conclusion

The XCV200E-7PQ240I delivers proven FPGA performance for industrial applications requiring reliable programmable logic in challenging environments. With its 200,000 system gates, 176 I/Os, and industrial temperature qualification, this device continues to serve legacy designs while offering a foundation for understanding modern FPGA architecture principles.

Whether you’re maintaining existing systems or evaluating migration strategies, the XCV200E-7PQ240I represents a robust solution backed by extensive documentation, proven reliability, and comprehensive development tool support from the Xilinx ecosystem.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.