The AMD XCV200E-7FG456C is a high-performance member of the Spartan®-IIE family, delivering an optimal balance of logic density, I/O flexibility, and cost efficiency. Designed for medium-complexity digital systems, this FPGA provides 200,000 system gates and operates at a 2.5V core voltage, making it ideal for industrial controls, communication interfaces, and video processing applications.
By choosing this Xilinx FPGA, engineers gain access to a mature, reliable programmable logic platform supported by decades of development tools and IP ecosystem.
Key Specifications: XCV200E-7FG456C
The table below summarizes the critical technical parameters for this device.
Package & Thermal Details
The 456-pin FBGA package offers excellent thermal performance and high interconnect density. It is specifically designed for space-constrained applications requiring significant I/O count without sacrificing signal integrity.
Architectural Highlights of the Spartan-IIE Family
The XCV200E-7FG456C leverages the proven Spartan-IIE architecture, optimized for high volume and low risk.
Core Features:
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SelectRAM+™ Memory Hierarchy: A combination of distributed LUT RAM (56 Kb) and dedicated 18 Kb Block RAM (112 Kb total) allows for true dual-port RAM, FIFOs, and ROM implementation without consuming logic resources.
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Abundant I/O Standards: Supports 19 single-ended and 6 differential I/O standards including LVTTL, LVCMOS, PCI, and SSTL. This ensures seamless interfacing with legacy and modern ASIC/ASSP devices.
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Digital Clock Manager (DCM): Four DCM blocks provide clock de-skew, frequency synthesis, and phase shifting, critical for high-speed synchronous designs.
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Dedicated Carry Logic: Accelerates arithmetic functions such as counters, adders, and comparators.
Why Choose the XCV200E-7FG456C for Your Design?
1. Proven Reliability & Long Lifecycle
AMD (formerly Xilinx) Spartan-IIE devices are known for their robust manufacturing processes and long-term availability, making them a safe choice for industrial equipment with extended product lifecycles.
2. Cost-Effective Logic Integration
With 200K system gates, this FPGA replaces multiple discrete TTL/CMOS logic devices, reducing PCB space, BOM cost, and power consumption.
3. Flexible I/O Banking
The 456-pin FBGA package organizes I/Os into eight independent banks, each capable of operating at different I/O voltages. This flexibility is crucial for mixed-voltage system designs.
4. Wide Adoption & Tool Support
Fully supported by the AMD ISE Design Suite (free WebPACK™ version available). This mature toolchain offers a low barrier to entry for students and professionals alike, with vast community knowledge and pre-built IP cores.
Technical Documentation & Design Resources
To successfully integrate the XCV200E-7FG456C, utilize the following official resources:
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Datasheet: Module 1 & 2: DC and Switching Characteristics
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User Guide: Spartan-IIE FPGA Family Data Sheet
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Package Specification: FG456 Ball Grid Array Details
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Application Notes: Power estimation, PCB layout, and I/O termination
*Note: Always verify the “-7” speed grade timing constraints in your design software to meet your specific clock rate requirements.*
Ordering & Compliance Information
Conclusion: Reliable Logic, Ready to Deploy
The XCV200E-7FG456C remains a highly capable Xilinx FPGA for engineers who need dependable, medium-density programmable logic. Its balance of memory, I/O flexibility, and mature software support ensures a smooth development experience from prototype to production.
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I hope this product description meets your SEO and technical requirements. Once you verify the DigiKey page manually, please double-check the specific RoHS status and any package marking details, as these can vary by date lot. Let me know if you need a variant for a different speed grade or temperature range.
