The XCV200E-6PQ240C is a powerful field-programmable gate array (FPGA) from AMD’s (formerly Xilinx) renowned Virtex-E family, designed to deliver exceptional performance and flexibility for embedded system applications. This advanced programmable logic device combines high gate density, low power consumption, and versatile I/O capabilities in a compact 240-pin PQFP package.

Product Overview

The XCV200E-6PQ240C represents a significant advancement in FPGA technology, offering engineers and designers a cost-effective solution for implementing complex digital logic functions. Built on advanced 0.18μm CMOS technology, this FPGA delivers the performance and reliability required for mission-critical applications across telecommunications, industrial control, medical devices, and embedded computing systems.

Technical Specifications

Key Features and Benefits

High Logic Density

The XCV200E-6PQ240C integrates 236,666 system gates and 5,292 logic cells, providing ample resources for implementing complex digital designs. This high gate density enables designers to consolidate multiple discrete components into a single FPGA, reducing board space and system costs.

Flexible I/O Configuration

With 166 user-configurable I/Os, this Xilinx FPGA supports various interface standards including LVTTL, LVCMOS, PCI, and more. The flexible I/O architecture allows seamless integration with diverse system components and peripherals.

Advanced Block RAM Resources

Embedded Block RAM provides efficient on-chip memory storage for data buffering, lookup tables, and FIFO implementations. This integrated memory reduces the need for external memory components and improves system performance.

High-Performance DSP Capabilities

The XCV200E-6PQ240C includes dedicated DSP resources optimized for arithmetic-intensive applications such as digital signal processing, video/image processing, and communications algorithms.

Low Power Consumption

Designed with power efficiency in mind, the Virtex-E architecture minimizes static and dynamic power consumption, making it ideal for battery-powered and thermally-constrained applications.

Architecture and Design Resources

Configurable Logic Blocks (CLBs)

Each CLB in the XCV200E-6PQ240C contains:

• Four-input lookup tables (LUTs) for combinatorial logic
• Flip-flops for sequential logic implementation
• Dedicated carry logic for efficient arithmetic operations
• Multiplexers for data routing and selection

Interconnect Resources

The hierarchical routing architecture features:

• Fast dedicated routing for critical paths
• General-purpose interconnect for flexible signal routing
• Clock distribution networks for low-skew timing
• Global routing resources for wide fanout signals

I/O Resources

Each I/O block provides:

• Programmable slew rate control
• Adjustable drive strength
• Input/output registers for improved timing performance
• Support for multiple I/O standards

Application Areas

Development Tools and Software Support

Vivado Design Suite

The XCV200E-6PQ240C is supported by AMD’s comprehensive Vivado Design Suite, which provides:

• Integrated design environment (IDE) for FPGA development
• High-level synthesis (HLS) for C/C++ to HDL conversion
• Advanced timing analysis and optimization
• Power analysis and optimization tools
• Comprehensive IP library and core generator

ISE Design Suite

Legacy support is also available through the ISE Design Suite, offering:

• HDL synthesis and implementation
• Simulation and verification tools
• Constraint management
• Device programming utilities

Programming Languages

Designers can implement logic using:

• VHDL (VHSIC Hardware Description Language)
• Verilog HDL
• SystemVerilog
• High-Level Synthesis (C/C++)

Package Information

Performance Characteristics

Timing Specifications

• Maximum System Frequency: 333 MHz
• Setup Time: Varies by I/O standard
• Clock-to-Out Delay: Optimized for high-speed operation
• Propagation Delay: Minimized through advanced routing

Power Specifications

• Core Voltage (VCCINT): 1.8V ± 5%
• I/O Voltage (VCCO): 1.2V to 3.3V (programmable)
• Static Power: Typically <500mW (design-dependent)
• Dynamic Power: Depends on design utilization and switching activity

Memory Resources

Design Considerations

Thermal Management

The XCV200E-6PQ240C requires proper thermal design to ensure reliable operation:

• Maintain junction temperature below maximum rating
• Provide adequate airflow for natural or forced convection
• Consider heatsink solutions for high-power designs
• Monitor thermal performance during system testing

Power Supply Design

Recommended power supply practices:

• Provide separate, well-regulated 1.8V and 2.5V/3.3V supplies
• Implement proper decoupling capacitors near power pins
• Use adequate power plane design for low impedance
• Consider sequencing requirements for multiple voltage rails

PCB Layout Guidelines

• Follow manufacturer’s PCB design guidelines
• Maintain controlled impedance for high-speed signals
• Implement proper grounding and power distribution
• Provide adequate clearance for package dimensions
• Consider signal integrity for critical nets

Configuration and Programming

Configuration Modes

The XCV200E-6PQ240C supports multiple configuration options:

• Master Serial Mode: FPGA controls configuration device
• Slave Serial Mode: External controller provides configuration data
• SelectMAP Mode: Parallel configuration for faster startup
• JTAG Mode: In-system programming and boundary scan

Configuration Memory

• Requires external configuration memory (PROM, Flash, or controller)
• Configuration bitstream size varies by design utilization
• Supports bitstream compression for reduced memory requirements
• Fast configuration for rapid system startup

Quality and Reliability

Manufacturing Standards

• Manufactured in ISO-certified facilities
• Complies with industry quality standards
• Rigorous testing and screening procedures
• Full traceability for production lots

Reliability Specifications

• MTBF: Exceeds 1 million hours (typical conditions)
• Operating Life: >20 years under normal conditions
• ESD Protection: Human Body Model (HBM) and Machine Model (MM) tested
• Latch-up Immunity: Meets JEDEC specifications

Ordering Information

When ordering the XCV200E-6PQ240C, specify:

• Complete part number: XCV200E-6PQ240C
• Quantity required
• Packaging type (tray, tube, or tape & reel)
• Any special testing or screening requirements
• Required documentation (datasheets, quality certificates)

Comparison with Related Products

Support and Resources

Documentation

• Datasheet (DS022): Complete technical specifications
• User Guide (UG): Design implementation guidelines
• Application Notes: Design tips and best practices
• Errata: Known issues and workarounds

Technical Support

• Online technical forums and communities
• Application engineering support
• Design consultation services
• Training and certification programs

Frequently Asked Questions

Q: What development tools are required for the XCV200E-6PQ240C? A: The primary development tool is Xilinx Vivado Design Suite or ISE Design Suite (legacy). A JTAG programmer is required for device configuration and debugging.

Q: Can the XCV200E-6PQ240C be used in industrial temperature applications? A: The standard -6PQ240C variant is rated for commercial temperature (0°C to +85°C). For extended or industrial temperature ranges, consider the -6PQ240I variant.

Q: What is the difference between speed grades -6, -7, and -8? A: Speed grades indicate performance levels. -6 is standard performance, -7 is faster, and -8 is the highest performance grade. Higher speed grades support higher operating frequencies.

Q: Is the XCV200E-6PQ240C RoHS compliant? A: RoHS compliance varies by production lot and date code. Consult the specific part marking or manufacturer documentation for your device.

Q: What configuration memory is recommended? A: Configuration memory selection depends on the application requirements. Common options include Xilinx Platform Flash PROMs or standard SPI Flash memory devices.

Conclusion

The XCV200E-6PQ240C FPGA delivers an optimal balance of performance, power efficiency, and cost-effectiveness for embedded system applications. With its substantial gate density, flexible I/O options, and comprehensive development tool support, this device enables engineers to implement complex digital designs with confidence. Whether you’re developing telecommunications equipment, industrial control systems, or medical devices, the XCV200E-6PQ240C provides the programmable logic resources and reliability required for demanding applications.

For the latest datasheets, design resources, and technical support, visit the manufacturer’s website or consult authorized distributors. The XCV200E-6PQ240C continues to serve as a proven solution for embedded FPGA applications requiring robust performance and design flexibility.