The XCV200E-6FG456I is a high-performance, industrial-grade Field Programmable Gate Array (FPGA) from the Xilinx Virtex-E family. Built on an advanced 0.18 µm CMOS process, this device delivers a powerful combination of logic density, speed, and flexibility — making it a trusted solution for engineers in telecommunications, industrial control, defense, and data processing applications.

If you are sourcing or designing with Xilinx FPGA devices, the XCV200E-6FG456I stands out for its 284 user I/O pins, 5,292 logic cells, and a robust 456-pin FBGA package, all rated for industrial temperature operation from −40°C to +100°C.

---

What Is the XCV200E-6FG456I?

The XCV200E-6FG456I is a member of the Xilinx Virtex-E family — an evolutionary generation of programmable logic devices that builds on the original Virtex architecture with significant improvements in silicon efficiency, interconnect resources, and embedded memory. The “6” in the part number denotes the speed grade, “FG456” identifies the 456-pin Fine-pitch Ball Grid Array (FBGA) package, and the trailing “I” confirms industrial temperature range qualification.

This device is manufactured using a 6-layer metal, 0.18 µm CMOS process that delivers high-speed, high-capacity programmable logic in a compact surface-mount package.

---

XCV200E-6FG456I Key Specifications

The table below summarizes the core electrical and physical parameters of the XCV200E-6FG456I.

---

XCV200E-6FG456I Package & Pinout Overview

The XCV200E-6FG456I is housed in a 456-pin Fine-pitch Ball Grid Array (FBGA) package measuring 23 mm × 23 mm. This surface-mount package type enables high-density PCB designs with relatively compact board footprints.

The high pin count allows designers to interface with multiple parallel buses, memory banks, and peripheral devices simultaneously — a key advantage in data-intensive applications.

---

Logic Architecture and Internal Resources

The Virtex-E architecture at the heart of the XCV200E-6FG456I is built around a matrix of Configurable Logic Blocks (CLBs), each containing four logic slices. Each slice includes two 4-input Look-Up Tables (LUTs), two flip-flops, and carry and control logic.

CLB and Logic Cell Details

Embedded Block RAM

The XCV200E-6FG456I includes 114,688 total RAM bits of on-chip distributed and block memory resources. This embedded memory supports dual-port operation and enables efficient data buffering, FIFO queues, and lookup table implementations without consuming general-purpose CLB resources.

Interconnect Architecture

The Virtex-E family features a rich, hierarchical interconnect fabric with multiple routing tiers — local, long-line, and global clock lines — to ensure timing closure across a wide range of design densities and frequencies. The device supports up to 357 MHz maximum system clock frequency at the -6 speed grade.

---

Electrical Characteristics

Power Supply Requirements

The 1.8 V core supply reduces dynamic power consumption compared to older 2.5 V or 3.3 V FPGA generations, making the XCV200E-6FG456I suitable for power-sensitive embedded applications.

I/O Interface Standards

The SelectI/O™ technology in the Virtex-E family supports a wide range of single-ended and differential I/O standards. The 284 user I/O pins on the XCV200E-6FG456I can be individually configured to match the signaling requirements of the target interface.

---

Industrial Temperature Rating: The “-I” Suffix Explained

The trailing “I” in XCV200E-6FG456I is critical for procurement engineers and system designers. It designates industrial temperature range qualification:

The industrial grade ensures reliable operation in harsh environments including outdoor enclosures, factory automation systems, and aerospace ground support equipment where ambient temperatures can swing significantly.

---

XCV200E-6FG456I Applications

The XCV200E-6FG456I is well-suited for a wide range of embedded logic and signal processing applications:

Telecommunications & Networking

High-speed serial interfaces, protocol bridging, and line-card logic benefit from the device’s fast I/O switching and ample routing resources.

Industrial Automation & Control

Motor drive controllers, PLC co-processors, and machine vision systems leverage the FPGA’s deterministic timing and high I/O count.

Defense & Aerospace

The industrial temperature rating (−40°C to +100°C) and radiation-tolerant design heritage of the Virtex-E family makes this device attractive for defense ground systems.

Digital Signal Processing (DSP)

Image processing pipelines, radar signal conditioning, and software-defined radio front-ends can be implemented efficiently using the CLB fabric and embedded RAM.

Medical Instrumentation

High-resolution imaging systems and real-time data acquisition platforms benefit from the device’s parallel processing capability and flexible I/O.

---

Part Number Decoder: XCV200E-6FG456I

Understanding the XCV200E-6FG456I part number helps with cross-referencing and sourcing equivalent or successor devices.

---

Ordering Information & Availability

Note: The XCV200E-6FG456I is classified as obsolete and is not recommended for new designs. Engineers starting new projects should consult AMD/Xilinx’s migration resources to identify a current-generation replacement such as the Artix-7, Kintex-7, or Spartan-7 families, which offer superior performance at lower power on modern process nodes.

---

XCV200E-6FG456I vs. Related Virtex-E Variants

The Virtex-E family spans multiple density points. The table below positions the XCV200E-6FG456I within the broader family.

The XCV200E occupies the mid-range of the Virtex-E family, offering a balance between logic capacity and package size that suits many system-level designs.

---

Design Tools & Support

The XCV200E-6FG456I is supported by Xilinx legacy development tools. Designers working with this device should note the following toolchain considerations:

Designers migrating from ISE to Vivado will need to select a newer FPGA family, as Vivado does not include support for the Virtex-E architecture.

---

Frequently Asked Questions (FAQ)

What does the “I” suffix mean on XCV200E-6FG456I?

The “I” suffix indicates industrial temperature range qualification, meaning the device is tested and guaranteed to operate correctly from −40°C to +100°C junction temperature (TJ).

Is the XCV200E-6FG456I still in production?

No. This part is classified as obsolete by AMD/Xilinx. It is no longer manufactured but may be available through authorized distribution channels or component brokers with existing inventory.

What is the difference between XCV200E-6FG456I and XCV200E-6FGG456I?

These two part numbers refer to the same device. The “FGG” and “FG” designations are alternate package identifiers used by different distributors for the 456-pin FBGA package. Confirm with your supplier that the physical package dimensions match your PCB footprint.

What FPGA can replace the XCV200E-6FG456I?

For new designs, AMD recommends transitioning to a modern 7-series or UltraScale device. The Artix-7 or Spartan-7 families provide similar or greater logic capacity with substantially lower power consumption and are supported by the current Vivado toolchain.

What configuration memory does XCV200E-6FG456I use?

The Virtex-E family is SRAM-based and requires external configuration memory (such as Xilinx Platform Flash PROM or a host microcontroller) to load the bitstream on power-up.

---

Summary

The XCV200E-6FG456I is a proven, industrial-grade FPGA offering 5,292 logic cells, 284 user I/O pins, 114,688 bits of embedded RAM, and 357 MHz maximum clock speed in a compact 456-pin FBGA surface-mount package. Its −40°C to +100°C operating range makes it especially valuable for harsh-environment and industrial applications. While classified as obsolete and no longer recommended for new designs, it remains widely used in legacy systems and repair/maintenance scenarios.

Engineers procuring this device for legacy board support or system maintenance should verify component authenticity through authorized distribution channels and review AMD’s migration guides for any new development work.