The XCV200E-6FG256I is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Virtex-E family, designed for demanding industrial and commercial applications. Built on an advanced 0.18 µm CMOS process and operating at 1.8V, this device delivers exceptional speed, flexibility, and programmable logic density in a compact 256-pin Fine-Pitch Ball Grid Array (FBGA) package. Whether you’re designing for communications, signal processing, or embedded control systems, the XCV200E-6FG256I offers the gate density, I/O capability, and reliability needed to meet rigorous engineering requirements.

For engineers seeking a comprehensive selection of Xilinx FPGA solutions, the XCV200E-6FG256I represents one of the most capable members of the proven Virtex-E family.

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What Is the XCV200E-6FG256I?

The XCV200E-6FG256I is an industrial-grade Xilinx Virtex-E 1.8V FPGA manufactured on a 0.18 µm process technology. The part number can be decoded as follows:

This device is the industrial-temperature variant of the XCV200E, making it suitable for use in environments that exceed the standard commercial temperature range. The “-6” speed grade designates the fastest timing specification available within the XCV200E lineup.

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XCV200E-6FG256I Key Specifications

Core Electrical & Logic Parameters

Package & Physical Specifications

Memory & Interconnect

Environmental & Compliance

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XCV200E-6FG256I Speed Grade & Performance

The -6 speed grade is the highest performance tier available for the XCV200E device. This means the XCV200E-6FG256I offers the lowest propagation delays and highest toggle frequencies among all XCV200E variants. The 357 MHz maximum operating frequency makes it well-suited for high-speed digital designs, including:

• High-throughput data pipeline architectures
• DSP signal chains requiring tight clock timing
• Multi-channel interface bridging and protocol conversion
• High-frequency bus arbitration logic

When comparing speed grades within the XCV200E family, the “-6” part consistently provides tighter setup and hold margins and faster combinational paths than the “-5” or “-4” alternatives.

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XCV200E-6FG256I: Virtex-E Family Architecture Overview

Configurable Logic Blocks (CLBs)

The Virtex-E architecture organizes logic resources into Configurable Logic Blocks, each containing four slices. Every slice includes two 4-input Look-Up Tables (LUTs), two flip-flops, and dedicated carry logic. The XCV200E-6FG256I contains 1,176 CLBs providing 5,292 logic cells of usable design capacity.

Block RAM Architecture

The device integrates dedicated block RAM structures that can be configured as synchronous dual-port memories. Each block provides 4K bits of storage (with parity), and the total on-chip memory capacity of 114,688 bits supports local buffering and FIFO implementations without consuming CLB resources.

Clock Management with DLLs

The XCV200E-6FG256I includes four Delay-Locked Loop (DLL) circuits strategically placed at the edges of the device. These DLLs enable:

• Zero-delay clock distribution
• Clock multiplication and division
• Phase shifting and deskewing
• Jitter reduction for sensitive timing domains

SelectIO Technology

With 176 user I/O pins, the device supports Xilinx’s SelectIO technology, allowing each bank of I/Os to be independently configured for a wide range of signaling standards. Supported I/O standards include LVTTL, LVCMOS, GTL, SSTL, HSTL, PCI, and AGP.

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Part Number Comparison: XCV200E-6FG256I vs Related Variants

Understanding the variants available helps engineers make the right procurement decision. The table below compares the key differentiators:

The XCV200E-6FG256I is the only variant combining the highest speed grade with the industrial temperature rating in the FG256 package — making it the preferred choice for rugged, high-performance designs.

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XCV200E-6FG256I Applications & Use Cases

Industrial Control Systems

The industrial temperature rating (−40°C to +100°C) and surface-mount 256-FBGA package make the XCV200E-6FG256I ideal for use in factory automation controllers, motion control systems, and programmable logic controllers (PLCs) that must operate reliably across extreme thermal environments.

Communications & Networking Equipment

With 357 MHz maximum clock speeds and 176 flexible I/O pins supporting multiple I/O standards, this FPGA excels in line cards, network switches, and baseband processing units. The block RAM and hardware multipliers support efficient MAC-layer and FEC (Forward Error Correction) implementations.

Test & Measurement Instrumentation

The high-speed parallel data paths enabled by the DLL clock management and fast logic fabric make the XCV200E-6FG256I a strong fit for logic analyzers, oscilloscope front-ends, and automated test equipment (ATE) platforms requiring deterministic timing.

Aerospace & Defense (with appropriate qualification)

While not a military-grade device, the industrial temperature rating and Xilinx’s mature Virtex-E heritage means this component has been deployed in pre-qualified, legacy defense programs requiring long-term availability and process stability.

Legacy System Maintenance & Re-design

The XCV200E-6FG256I remains in demand as a direct replacement part for existing production systems originally designed around the Virtex-E family. Engineers maintaining or upgrading equipment built in the early 2000s frequently require this exact part to maintain design compatibility.

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Design Tools & Programming Support

Xilinx ISE Design Suite

The XCV200E-6FG256I is supported by the Xilinx ISE Design Suite (now archived), which includes:

• XST – Xilinx Synthesis Technology for RTL synthesis
• ISE Project Navigator – Complete design flow management
• Timing Analyzer – Static timing analysis and constraint verification
• ChipScope Pro – On-chip logic analysis

Note: The Xilinx Vivado Design Suite does not support Virtex-E devices. Designers must use ISE 14.7 (the final ISE release) for XCV200E-6FG256I implementation.

JTAG Configuration & Programming

The device supports IEEE 1149.1 (JTAG) boundary scan for configuration and board-level testing. Configuration modes supported include:

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Ordering Information & Product Availability

Standard Ordering Details

Important Notice: The XCV200E-6FG256I is an end-of-life (EOL) / obsolete part. Xilinx has issued a Product Discontinuation Notice (PDN) for this device. Engineers are advised to secure adequate inventory from authorized distributors or evaluate migration paths to current-generation Xilinx devices such as the Artix-7 or Kintex-7 families if new designs are being initiated.

Authorized Distribution Channels

The XCV200E-6FG256I is stocked by several global authorized and independent distributors. Always verify authenticity and provenance when purchasing legacy FPGAs through non-franchised channels, as counterfeit Xilinx devices are a known industry concern.

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XCV200E-6FG256I vs Modern Xilinx FPGA Alternatives

For engineers evaluating the XCV200E-6FG256I for a new design, the following table provides a high-level migration comparison to current Xilinx FPGA families:

While modern alternatives offer dramatically higher capacity and performance, the XCV200E-6FG256I remains the only compatible replacement for systems already designed around its pinout, timing, and configuration bitstream format.

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Frequently Asked Questions (FAQ)

What does the “I” suffix mean in XCV200E-6FG256I?

The “I” at the end of the part number designates the Industrial temperature range, meaning the device is tested and guaranteed to operate correctly with junction temperatures from −40°C to +100°C. This contrasts with the “C” suffix (Commercial grade), which covers 0°C to +85°C Tj.

Is the XCV200E-6FG256I still in production?

No. Xilinx has issued an end-of-life product discontinuation notice for the XCV200E series. Production of new units has ceased. Availability is limited to existing distributor inventory and the secondary market. Engineers should plan accordingly for long-term supply chain needs.

Can I use Vivado to program the XCV200E-6FG256I?

No. The Xilinx Vivado Design Suite does not support Virtex-E devices. You must use Xilinx ISE 14.7 for synthesis, implementation, and bitstream generation for the XCV200E-6FG256I.

What is the equivalent gate count of the XCV200E?

The XCV200E-6FG256I has a gate density of 306,393 equivalent gates based on the FPGA logic resources available. Some data sources cite 63,504K “system gates” which includes logic, routing, and RAM resources.

What package does the XCV200E-6FG256I use?

The device uses a 256-pin Fine-Pitch Ball Grid Array (FBGA) measuring 17 mm × 17 mm. The ball pitch is 1.0 mm.

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Summary

The XCV200E-6FG256I is a proven, high-performance Xilinx Virtex-E FPGA combining the fastest available speed grade (-6), a compact 256-pin FBGA package, and an industrial-grade temperature range in a single device. With 306,393 equivalent gates, 176 user I/Os, 357 MHz maximum frequency, and 114 Kbits of on-chip RAM, it remains the go-to choice for maintaining legacy industrial, communications, and control systems that were designed around the Virtex-E architecture.

Engineers sourcing this component should act promptly given its end-of-life status and confirm supply through reputable authorized distributors to ensure component authenticity and traceability.