The XCV200E-6FG256C is a high-performance Field Programmable Gate Array (FPGA) from the Xilinx Virtex-E family, now distributed under AMD. Designed for demanding logic design applications, the XCV200E-6FG256C delivers 63,504 system gates, 5,292 logic cells, and a maximum operating frequency of 357 MHz — all in a compact 256-pin Fine-Pitch Ball Grid Array (FBGA) package. Whether you are building wireless infrastructure systems, industrial automation controllers, or high-speed data processing pipelines, this Xilinx FPGA provides the performance and flexibility required for modern embedded designs.

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What Is the XCV200E-6FG256C?

The XCV200E-6FG256C belongs to the Virtex-E family, an evolutionary advancement over the original Virtex series. Manufactured using a 6-layer metal 0.18 µm CMOS process at 1.8V core voltage, this FPGA achieves dramatically improved silicon efficiency through an architecture optimized for place-and-route performance. It is a powerful and flexible alternative to mask-programmed gate arrays in high-density, time-sensitive design environments.

The “6” in the part number denotes the -6 speed grade — the fastest commercial-grade variant available in this device family — making it ideal for applications demanding maximum clock throughput.

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XCV200E-6FG256C Key Specifications

The table below summarizes the core technical parameters of the XCV200E-6FG256C:

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XCV200E-6FG256C Package & Ordering Information

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XCV200E-6FG256C Architecture & Features

Configurable Logic Blocks (CLBs)

The XCV200E-6FG256C contains 1,176 Configurable Logic Blocks, each housing two slices. Every slice includes two 4-input Look-Up Tables (LUTs) and two flip-flops, along with dedicated carry logic for high-speed arithmetic. Each CLB can implement functions of up to six inputs using the F5 multiplexer output, enabling efficient implementation of complex logic in minimal area. The CLB architecture counts as 4.5 Logic Cells per CLB, supporting the 5,292 total logic cell figure.

Block SelectRAM Memory

The XCV200E-6FG256C incorporates on-chip Block SelectRAM resources organized in columns along the device edges. Each block is a configurable 4 Kbit synchronous dual-port RAM supporting independently controlled read and write ports. The total on-chip RAM is 114,688 bits, configurable in multiple aspect ratios including 4096×1, 2048×2, 1024×4, 512×8, or 256×16.

Distributed SelectRAM

In addition to block RAM, the LUTs within each CLB slice can be configured as 16-bit synchronous distributed RAM or 32-bit shift registers, providing shallow memory structures tightly coupled to the logic fabric for minimal latency access.

Delay-Locked Loops (DLLs)

The XCV200E-6FG256C includes four dedicated Delay-Locked Loops (DLLs) for advanced clock control and management:

• Eliminate clock distribution skew between input pad and internal flip-flops
• Drive up to two global clock networks each
• Support clock phase shifting and frequency division/multiplication
• Enable board-level clock deskewing across multiple FPGAs

Multi-Standard SelectIO Interfaces

The device supports 16 high-performance I/O standards through its SelectIO architecture, organized into eight independent I/O banks (two per edge). Each bank has a dedicated VCCO power supply, allowing multiple voltage standards to coexist within the same device:

Global Clock Distribution

The FPGA provides four primary low-skew global clock distribution networks, plus 24 secondary local clock nets for regional clock management. This hierarchical clock structure minimizes routing delay and skew for timing-critical designs.

IEEE 1149.1 Boundary Scan (JTAG)

All XCV200E-6FG256C I/O Blocks support IEEE 1149.1-compatible boundary scan, enabling in-system testing, configuration, and board-level diagnostics. The device integrates a full Test Access Port (TAP) controller, boundary scan register, IDCODE, USERCODE, and HIGHZ instructions.

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XCV200E-6FG256C Logic Resource Summary

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XCV200E-6FG256C Configuration Modes

The XCV200E-6FG256C supports four standard configuration modes, providing design flexibility for prototyping and production environments:

The SelectMAP mode is the fastest option, using an 8-bit wide data bus with a BUSY flag for flow control. Multiple XCV200E devices can be daisy-chained for serial configuration from a single PROM source.

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Applications of the XCV200E-6FG256C

The XCV200E-6FG256C is well-suited for a wide range of high-performance embedded applications requiring flexible programmable logic with multi-standard I/O support:

Communications & Wireless Infrastructure

The 357 MHz maximum clock frequency and multi-standard SelectIO support make the XCV200E-6FG256C highly effective in base station modems, protocol bridges, packet processors, and wireless MAC layer controllers. Its 66 MHz PCI-compliant interface and hot-swap capability support Compact PCI backplane designs.

Industrial Automation & Control

With a full commercial temperature range (0°C to +85°C) and robust I/O flexibility, the XCV200E-6FG256C is widely deployed in motion controllers, PLC co-processors, real-time sensor fusion systems, and industrial communication gateways.

Digital Signal Processing (DSP)

The dedicated carry logic, cascade chain for wide-input functions, and distributed RAM structures enable efficient implementation of FIR/IIR filters, FFT engines, digital up/down converters, and correlation processors directly in the FPGA fabric.

Enterprise Computing & Storage

The block SelectRAM and high-speed I/O support make this device suitable as a RAID controller assist chip, PCIe interface bridge, or memory controller in enterprise server and storage designs.

Embedded Data Acquisition

With configurable LUT-based memory and DLL-managed clocking, the XCV200E-6FG256C is a strong fit for waveform capture systems, ADC/DAC interface controllers, and custom sensor interface logic.

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XCV200E-6FG256C vs. XCV200E-6FG256I: Commercial vs. Industrial Grade

The “C” suffix in XCV200E-6FG256C designates the commercial temperature grade, while the “I” suffix variant is intended for industrial operating environments. For designs requiring operation below 0°C or above 85°C, the XCV200E-6FG256I should be selected.

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Design Tools for the XCV200E-6FG256C

The XCV200E-6FG256C is supported by Xilinx legacy design tools. For new designs targeting this device, the following tool chains are recommended:

Note: The XCV200E-6FG256C is not supported by Vivado (which requires Virtex-6 and newer devices). ISE 14.7 is the final software version with Virtex-E support and remains available from AMD’s legacy archive.

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Frequently Asked Questions (FAQ)

What does XCV200E-6FG256C mean?

The part number breaks down as follows: XCV = Virtex family identifier; 200E = 200K-gate density Virtex-E device; 6 = speed grade (-6, fastest); FG = Fine-pitch Ball Grid Array package; 256 = 256 pin count; C = commercial temperature grade (0°C to +85°C).

Is the XCV200E-6FG256C still in production?

The XCV200E-6FG256C is listed as obsolete/end-of-life by AMD Xilinx. It remains available through authorized distributors and component brokers for legacy board repair and maintenance. New designs should consider migrating to Spartan-7, Artix-7, or newer Xilinx families.

What is the maximum I/O count on the XCV200E-6FG256C?

The XCV200E-6FG256C in the FG256 package provides 176 user I/O pins across 8 independent I/O banks. This represents the pin-limited maximum for this package; the same die in a larger package (e.g., FG456) supports more I/Os.

What voltage does the XCV200E-6FG256C operate at?

The XCV200E-6FG256C uses a 1.8V core supply voltage (VCCINT). I/O voltage (VCCO) is bank-specific and can be independently set per bank to match the target I/O standard, ranging from 1.5V to 3.3V depending on the chosen standard.

Can the XCV200E-6FG256C be used in PCI designs?

Yes. The XCV200E-6FG256C is 66 MHz PCI-compliant and supports hot-swap operation for Compact PCI environments when using appropriate SelectIO standard configurations and VCCO settings.

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Summary

The XCV200E-6FG256C is a mature, proven Xilinx Virtex-E FPGA offering 63,504 system gates, 357 MHz maximum performance, 176 user I/Os, 114,688 bits of block RAM, and four DLLs in a 256-pin FBGA package. Originally manufactured on a 0.18 µm process at 1.8V, this device remains a capable solution for legacy system maintenance, industrial controller designs, and specialized embedded applications where proven programmable logic reliability is essential.

For procurement, design support, and compatible Xilinx FPGA alternatives, refer to the full product line at the distributor or consult the AMD Xilinx legacy datasheet archive for complete timing and electrical specifications.