Overview of the XCV200E-6BG352C FPGA

The XCV200E-6BG352C is a premium Field Programmable Gate Array (FPGA) from AMD’s (formerly Xilinx) Virtex-E family, designed to deliver exceptional programmable logic performance for demanding industrial and commercial applications. This advanced FPGA leverages cutting-edge 0.18µm CMOS technology with a sophisticated 6-layer metal architecture, providing engineers with a powerful, flexible alternative to traditional mask-programmed gate arrays.

Built on the proven foundation of Xilinx’s Virtex architecture, this FPGA represents an evolutionary leap in programmable logic design. The device combines high-density logic resources, extensive memory capabilities, and advanced interconnect architecture to enable complex digital designs with superior timing performance and routing efficiency.

Key Technical Specifications

Architecture and Performance Features

Advanced FPGA Architecture

The XCV200E-6BG352C incorporates several architectural innovations that maximize silicon efficiency and system performance:

• Optimized CLB Structure: Each Configurable Logic Block contains four logic cells with dedicated fast carry logic and distributed RAM capability
• Hierarchical Interconnect: Multi-level routing architecture provides both local and global connectivity with predictable timing
• Embedded Memory Blocks: SelectRAM+ dual-port block RAM enables efficient memory implementation
• Digital Clock Manager (DCM): Provides clock multiplication, division, phase shifting, and deskewing capabilities
• Dedicated Carry Chains: Enables high-speed arithmetic operations with minimal routing delay

Performance Characteristics

Package and Pin Configuration

BGA-352 Package Details

The XCV200E-6BG352C utilizes a robust 352-ball Metal Ball Grid Array (MBGA) package that provides:

• Enhanced Thermal Performance: Exposed pad metal construction for superior heat dissipation
• High Pin Density: 260 user I/O pins in a compact 35mm x 35mm footprint
• Excellent Signal Integrity: Controlled impedance and minimal inductance
• Manufacturing Compatibility: Industry-standard BGA footprint for automated assembly

I/O Banking and Standards Support

The device supports multiple I/O standards including:

• LVTTL/LVCMOS (3.3V, 2.5V, 1.8V, 1.5V)
• GTL/GTL+
• SSTL (Class I and II)
• HSTL (Class I and II)
• Differential signaling standards (LVDS, LVPECL)

Application Areas and Use Cases

Primary Applications

The XCV200E-6BG352C Xilinx FPGA excels in various demanding applications:

1. Communications Infrastructure

• Wireless base station processing
• Network packet routing and switching
• Protocol conversion and bridging
• Digital signal processing (DSP) acceleration

2. Automotive Electronics

• Advanced Driver Assistance Systems (ADAS)
• Engine control units (ECU)
• In-vehicle networking
• Sensor fusion processing

3. Enterprise Computing

• Data center acceleration
• Server offload processing
• Storage controller implementation
• Network security appliances

4. Industrial Automation

• Machine vision systems
• Motion control processing
• PLC replacement and enhancement
• Real-time monitoring and control

5. Test and Measurement

• High-speed data acquisition
• Protocol analysis equipment
• Automated test equipment (ATE)
• Signal generation and analysis

Design Resources and Development Support

Development Tools Compatibility

Design Flow Advantages

• Comprehensive IP core library access
• Proven timing closure methodologies
• Extensive constraint templates
• Reference designs available
• Active technical support community

Comparison with Alternative Devices

XCV200E Family Variants

Competitive Advantages

• High Integration Density: More logic resources per unit area than competing devices
• Proven Reliability: Mature architecture with extensive field deployment history
• Cost-Effective: Optimal balance of performance and pricing for mid-range applications
• Ecosystem Support: Extensive third-party IP cores and reference designs available

Power Management and Thermal Considerations

Power Consumption Profile

The XCV200E-6BG352C implements several power optimization techniques:

• Static Power Reduction: Advanced process technology minimizes leakage current
• Dynamic Power Scaling: Clock gating and resource shutdown capabilities
• I/O Power Optimization: Selectable I/O standards for power-sensitive applications

Thermal Management Guidelines

Quality and Reliability

Manufacturing Standards

• Process Node: Industry-standard 0.18µm CMOS technology
• Quality Certifications: ISO 9001 certified manufacturing
• Reliability Testing: JEDEC-compliant qualification
• Product Lifecycle: Obsolete status – confirm availability with authorized distributors

Environmental Compliance

• RoHS Compliant: Lead-free construction meets environmental standards
• REACH Compliance: Substance restriction compliant
• Halogen-Free: Available in halogen-free versions (verify with manufacturer)

Ordering Information and Availability

Part Number Breakdown

XCV200E-6BG352C

• XCV: Xilinx Virtex family identifier
• 200E: Device density (Virtex-E 200K gates)
• 6: Speed grade (fastest commercial grade)
• BG352: Package type (352-ball BGA)
• C: Commercial temperature range

Procurement Considerations

Important Note: The XCV200E-6BG352C is classified as obsolete by the manufacturer. When sourcing this component:

• Verify stock availability with authorized distributors
• Consider alternative Xilinx/AMD FPGAs for new designs
• Evaluate lifecycle status for long-term production planning
• Source from reputable suppliers to ensure authenticity
• Request certificates of conformance for critical applications

Lead Time and MOQ

• Typical Lead Time: Varies by distributor (subject to availability)
• Minimum Order Quantity: Consult with distributor
• Packaging: Tray packaging standard
• Sample Availability: Limited due to obsolescence status

Technical Support and Documentation

Available Documentation

• Datasheet: Complete electrical and timing specifications
• User Guide: Architecture and design methodology documentation
• Application Notes: Implementation guidelines for specific use cases
• PCB Design Guide: Layout recommendations and footprint information
• Thermal Management Guide: Cooling solution design assistance

Community and Support Resources

• Xilinx/AMD technical support forums
• Legacy ISE Design Suite documentation
• Third-party FPGA development communities
• University and academic research resources
• Independent design consultants specializing in Virtex-E

Migration and Upgrade Path

Recommended Alternatives for New Designs

For engineers requiring similar capabilities in current-generation FPGAs:

• Artix-7 Family: Cost-optimized 28nm devices with higher performance
• Spartan-7 Family: Value-oriented alternative with modern toolchain
• Kintex-7 Family: Higher performance for demanding applications

Design Migration Considerations

• Review I/O standard compatibility
• Evaluate clock management differences
• Assess tool version requirements
• Plan for potential timing re-closure
• Budget for design verification effort

Best Practices for Implementation

Design Guidelines

1. Timing Closure: Use timing constraints early in the design process
2. Resource Utilization: Monitor CLB and I/O utilization to avoid routing congestion
3. Clock Design: Leverage DCM resources for optimal clock distribution
4. I/O Banking: Group related signals within compatible I/O banks
5. Power Planning: Implement proper decoupling and power distribution

Common Applications Tips

• High-Speed Interfaces: Use dedicated I/O resources for critical signals
• Memory Implementation: Utilize block RAM for efficient memory structures
• DSP Functions: Leverage distributed arithmetic for filter implementations
• State Machines: Use one-hot encoding for high-performance FSMs

Frequently Asked Questions

Is the XCV200E-6BG352C suitable for new designs?

Due to its obsolete status, this device is not recommended for new designs. Consider modern alternatives from AMD’s 7-series or UltraScale families for better performance, lower power consumption, and long-term availability.

What development tools are required?

The XCV200E-6BG352C requires Xilinx ISE Design Suite (version 14.7 or compatible). The device is not supported in newer Vivado tools, which target 7-series and later architectures.

How does the -6 speed grade compare to slower variants?

The -6 speed grade represents the fastest commercial temperature variant, offering maximum system clock frequencies and minimum propagation delays. Slower speed grades (-7, -8) have reduced performance but may be more cost-effective for less demanding applications.

What is the expected product lifetime?

As an obsolete part, manufacturing has been discontinued. Available stock is limited to distributor inventory and aftermarket sources. Plan for end-of-life considerations in long-term product strategies.

Conclusion

The XCV200E-6BG352C represents mature, proven FPGA technology from AMD’s Virtex-E lineage. With 306,393 equivalent gates, 260 I/O pins, and 114,688 RAM bits in a compact 352-ball BGA package, this device offers substantial programmable logic resources for a wide range of embedded applications.

While classified as obsolete, the XCV200E-6BG352C continues to serve in legacy systems requiring maintenance, repair, and operational support. Its robust architecture, comprehensive I/O capabilities, and well-documented design flow make it a reliable choice for sustaining existing products.

For procurement inquiries, technical specifications, or design support regarding the XCV200E-6BG352C Xilinx FPGA, consult with authorized distributors who can verify current stock availability and provide authentic components with proper traceability and quality assurance.