Contact Sales & After-Sales Service

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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XCV2000E-6FGG680C: High-Performance Virtex-E FPGA for Advanced Digital Design

Product Details

Complete Technical Overview and Specifications

The XCV2000E-6FGG680C represents AMD’s (formerly Xilinx) flagship offering in the Virtex-E family of field-programmable gate arrays. This high-density FPGA delivers exceptional performance for complex digital designs, combining 518.4K system gates with advanced 0.18µm CMOS technology to meet the demanding requirements of modern electronic applications.

Product Description

The XCV2000E-6FGG680C is a professional-grade FPGA engineered for high-performance applications requiring substantial logic capacity and flexible I/O configurations. Built on AMD’s proven Virtex-E architecture, this device offers designers a powerful platform for implementing complex digital systems with maximum efficiency and reliability.

This Xilinx FPGA features 43,200 logic cells configured in a 680-pin Fine-Pitch Ball Grid Array (FBGA) package, providing 512 user I/O pins for extensive connectivity options. The -6 speed grade ensures optimal performance for time-critical applications, while the industrial-grade temperature range makes it suitable for demanding environments.

Key Technical Specifications

Core Architecture Features

Specification Value
System Gates 518,400 (518.4K)
Logic Cells 43,200
CLB Array 120 x 90
Block RAM Bits 655,360 bits
Maximum User I/O 512
Speed Grade -6
Operating Frequency Up to 357 MHz

Physical and Electrical Characteristics

Parameter Specification
Package Type Fine-Pitch Ball Grid Array (FBGA)
Pin Count 680 pins
Package Code FGG680
Technology Node 0.18µm CMOS, 6-layer metal
Supply Voltage (VCCINT) 1.8V ± 5%
I/O Voltage (VCCO) 1.5V to 3.3V
Operating Temperature 0°C to +85°C (Commercial)
Package Dimensions 27mm x 27mm
Moisture Sensitivity Level MSL 3

Advanced FPGA Capabilities

Logic Resources

The XCV2000E-6FGG680C provides comprehensive logic resources optimized for complex digital designs:

  • 43,200 Logic Cells: Each cell contains a 4-input lookup table (LUT) and flip-flop
  • 2,700 Configurable Logic Blocks (CLBs): Four slices per CLB for flexible logic implementation
  • 655,360 Bits of Block RAM: Organized in 324 dual-port 2,048-bit blocks
  • Dedicated Multipliers: 40 embedded 18×18 multipliers for DSP applications
  • Global Clock Buffers: Eight dedicated low-skew clock distribution networks

I/O and Interconnect Features

Feature Description
I/O Standards LVTTL, LVCMOS, GTL, GTL+, HSTL, SSTL, PCI, PCI-X
Differential I/O LVDS, LVPECL, Bus LVDS support
SelectIO Technology Programmable impedance, slew rate control
Input Delay Programmable input registers
Output Drive 2mA to 24mA per I/O
Routing Resources Hierarchical interconnect with hex, double, and longlines

Design and Performance Benefits

High-Performance Processing

The XCV2000E-6FGG680C delivers exceptional performance metrics critical for advanced applications:

  • Maximum Toggle Frequency: 357 MHz internal logic frequency
  • Low Propagation Delay: Speed grade -6 ensures minimal signal delay
  • Fast Carry Logic: Dedicated carry chains for high-speed arithmetic
  • Block RAM Performance: Dual-port access with independent clocks up to 200 MHz

Flexibility and Scalability

This FPGA provides remarkable design flexibility through:

  • Partial Reconfiguration: Modify portions of the design without interrupting operation
  • IEEE 1149.1 JTAG Boundary Scan: Built-in testing and debug capabilities
  • Multiple Configuration Modes: Master Serial, Slave Serial, Master SelectMAP, Slave SelectMAP, JTAG
  • Configuration Memory: External PROM, Flash, or embedded processor support

Applications and Use Cases

Industrial Control Systems

The XCV2000E-6FGG680C excels in industrial automation applications:

  • Programmable Logic Controllers (PLC)
  • Motion control systems
  • Machine vision processing
  • Industrial networking protocols

Communications Infrastructure

Ideal for telecommunications equipment:

  • Digital signal processing
  • Protocol conversion and bridging
  • Network packet processing
  • Software-defined radio (SDR)

Aerospace and Defense

Military and aerospace applications benefit from:

  • Radar signal processing
  • Avionics control systems
  • Secure communications
  • High-reliability computing

Medical Imaging

Medical device applications include:

  • Ultrasound image processing
  • CT scan reconstruction
  • Real-time image enhancement
  • Medical instrument control

Comparison Table: Virtex-E Family

Part Number System Gates Logic Cells Block RAM User I/O Package
XCV50E 57,344 1,728 32 Kbits 176 FG256
XCV300E 322,560 10,368 131 Kbits 316 FG456
XCV1000E 1,036,800 27,648 393 Kbits 404 BG560
XCV2000E 518,400 43,200 655 Kbits 512 FGG680
XCV3200E 3,359,232 74,448 1,179 Kbits 644 FG1156

Design Tools and Support

Software Compatibility

The XCV2000E-6FGG680C is supported by comprehensive development tools:

  • Vivado Design Suite: Advanced synthesis and implementation
  • ISE Design Suite: Legacy support for existing designs
  • Chipscope Pro: Integrated logic analyzer
  • ModelSim: Simulation and verification
  • Synplify Pro: Third-party synthesis option

IP Cores and Libraries

Accelerate development with pre-verified IP:

  • MicroBlaze soft processor core
  • PicoBlaze 8-bit microcontroller
  • DSP cores (FFT, FIR filters)
  • Communication protocols (PCIe, Ethernet, USB)
  • Memory controllers (DDR, SDRAM)

Package and Ordering Information

Part Number Breakdown

XCV2000E-6FGG680C

  • XCV: Virtex-E family designation
  • 2000E: Device size (2 million system gates)
  • -6: Speed grade (fastest commercial grade)
  • FGG: Fine-pitch Ball Grid Array package
  • 680: Pin count
  • C: Commercial temperature range (0°C to +85°C)

Alternative Versions

Part Number Temperature Range Application
XCV2000E-6FGG680C 0°C to +85°C Commercial applications
XCV2000E-6FGG680I -40°C to +100°C Industrial applications
XCV2000E-7FGG680C 0°C to +85°C Slightly slower, lower power
XCV2000E-8FGG680C 0°C to +85°C Economy speed grade

Technical Resources

Documentation and Support

  • Datasheet: Complete electrical and timing specifications
  • User Guide: Architecture overview and design guidelines
  • Application Notes: Design best practices and optimization techniques
  • Reference Designs: Pre-built examples for common applications
  • Development Boards: Evaluation platforms available

Quality and Reliability

AMD maintains stringent quality standards:

  • Qualification: AEC-Q100 automotive grade available
  • Reliability: MTBF > 1 million hours
  • RoHS Compliant: Lead-free package options
  • Moisture Sensitivity: MSL 3 per JEDEC J-STD-020
  • ESD Protection: 2000V Human Body Model

Power Consumption Characteristics

Typical Power Budget

Power Component Typical Value Maximum Value
Static Power (Quiescent) 0.5W 1.2W
Dynamic Power (50% toggle) 3.5W 6.0W
I/O Power Varies Depends on standard
Total Device Power 4.0W 7.2W

Power Management Features

  • Individual power-down of unused block RAM
  • Programmable slew rate control for I/O
  • Optional I/O pre-emphasis for signal integrity
  • Low-power configuration modes

Migration and Upgrade Path

Compatible Devices

Designers can migrate between Virtex-E family members:

  • Downgrade Path: XCV1000E, XCV600E for cost optimization
  • Upgrade Path: XCV3200E for increased capacity
  • Next Generation: Virtex-II family for advanced features

Pin Compatibility

The FGG680 package maintains compatibility with:

  • Same footprint across speed grades
  • Common I/O assignment structure
  • Consistent power pin locations
  • Simplified PCB reuse

Procurement and Availability

Stock Status

The XCV2000E-6FGG680C is available through authorized distributors:

  • Lead Time: Typically 8-12 weeks for large quantities
  • Minimum Order: Varies by distributor
  • Package Quantity: Trays of 30 or 60 units
  • Samples: Available for qualified customers

Quality Assurance

All units undergo comprehensive testing:

  • 100% electrical testing
  • Burn-in testing available
  • Lot traceability
  • Certificate of Conformance (C of C) provided

Frequently Asked Questions

What is the difference between -6, -7, and -8 speed grades?

The speed grade indicates the maximum operating frequency, with -6 being the fastest and -8 being the slowest. Faster speed grades allow higher clock frequencies but typically consume more power and cost more.

Can this FPGA be used in automotive applications?

While the commercial temperature version (-C) is suitable for many automotive applications, the industrial temperature version (-I) is recommended for extended temperature ranges. AEC-Q100 qualified versions are available for safety-critical automotive systems.

What configuration memory is required?

The XCV2000E requires approximately 8.5 Mbit of configuration data. Compatible configuration PROMs include the XC18V04 or larger, or platform Flash devices like the XCF08P.

Is this device 5V tolerant?

No, the XCV2000E I/O pins are not 5V tolerant. Maximum VCCO voltage is 3.6V. Use level shifters or voltage translation devices when interfacing with 5V systems.

What development tools are required?

Xilinx ISE Design Suite (version 14.7 or earlier) or Vivado Design Suite provides complete support for design entry, synthesis, implementation, and programming of the XCV2000E-6FGG680C.

Conclusion

The XCV2000E-6FGG680C delivers outstanding performance and flexibility for demanding FPGA applications. With 518.4K system gates, 512 I/O pins, and advanced Virtex-E architecture, this device provides the resources needed for complex digital designs across industrial, communications, aerospace, and medical applications. Its proven reliability, comprehensive tool support, and extensive IP library make it an excellent choice for mission-critical systems requiring high-performance programmable logic solutions.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.