Complete Technical Overview and Specifications
The XCV2000E-6FGG680C represents AMD’s (formerly Xilinx) flagship offering in the Virtex-E family of field-programmable gate arrays. This high-density FPGA delivers exceptional performance for complex digital designs, combining 518.4K system gates with advanced 0.18µm CMOS technology to meet the demanding requirements of modern electronic applications.
Product Description
The XCV2000E-6FGG680C is a professional-grade FPGA engineered for high-performance applications requiring substantial logic capacity and flexible I/O configurations. Built on AMD’s proven Virtex-E architecture, this device offers designers a powerful platform for implementing complex digital systems with maximum efficiency and reliability.
This Xilinx FPGA features 43,200 logic cells configured in a 680-pin Fine-Pitch Ball Grid Array (FBGA) package, providing 512 user I/O pins for extensive connectivity options. The -6 speed grade ensures optimal performance for time-critical applications, while the industrial-grade temperature range makes it suitable for demanding environments.
Key Technical Specifications
Core Architecture Features
| Specification |
Value |
| System Gates |
518,400 (518.4K) |
| Logic Cells |
43,200 |
| CLB Array |
120 x 90 |
| Block RAM Bits |
655,360 bits |
| Maximum User I/O |
512 |
| Speed Grade |
-6 |
| Operating Frequency |
Up to 357 MHz |
Physical and Electrical Characteristics
| Parameter |
Specification |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Pin Count |
680 pins |
| Package Code |
FGG680 |
| Technology Node |
0.18µm CMOS, 6-layer metal |
| Supply Voltage (VCCINT) |
1.8V ± 5% |
| I/O Voltage (VCCO) |
1.5V to 3.3V |
| Operating Temperature |
0°C to +85°C (Commercial) |
| Package Dimensions |
27mm x 27mm |
| Moisture Sensitivity Level |
MSL 3 |
Advanced FPGA Capabilities
Logic Resources
The XCV2000E-6FGG680C provides comprehensive logic resources optimized for complex digital designs:
- 43,200 Logic Cells: Each cell contains a 4-input lookup table (LUT) and flip-flop
- 2,700 Configurable Logic Blocks (CLBs): Four slices per CLB for flexible logic implementation
- 655,360 Bits of Block RAM: Organized in 324 dual-port 2,048-bit blocks
- Dedicated Multipliers: 40 embedded 18×18 multipliers for DSP applications
- Global Clock Buffers: Eight dedicated low-skew clock distribution networks
I/O and Interconnect Features
| Feature |
Description |
| I/O Standards |
LVTTL, LVCMOS, GTL, GTL+, HSTL, SSTL, PCI, PCI-X |
| Differential I/O |
LVDS, LVPECL, Bus LVDS support |
| SelectIO Technology |
Programmable impedance, slew rate control |
| Input Delay |
Programmable input registers |
| Output Drive |
2mA to 24mA per I/O |
| Routing Resources |
Hierarchical interconnect with hex, double, and longlines |
Design and Performance Benefits
High-Performance Processing
The XCV2000E-6FGG680C delivers exceptional performance metrics critical for advanced applications:
- Maximum Toggle Frequency: 357 MHz internal logic frequency
- Low Propagation Delay: Speed grade -6 ensures minimal signal delay
- Fast Carry Logic: Dedicated carry chains for high-speed arithmetic
- Block RAM Performance: Dual-port access with independent clocks up to 200 MHz
Flexibility and Scalability
This FPGA provides remarkable design flexibility through:
- Partial Reconfiguration: Modify portions of the design without interrupting operation
- IEEE 1149.1 JTAG Boundary Scan: Built-in testing and debug capabilities
- Multiple Configuration Modes: Master Serial, Slave Serial, Master SelectMAP, Slave SelectMAP, JTAG
- Configuration Memory: External PROM, Flash, or embedded processor support
Applications and Use Cases
Industrial Control Systems
The XCV2000E-6FGG680C excels in industrial automation applications:
- Programmable Logic Controllers (PLC)
- Motion control systems
- Machine vision processing
- Industrial networking protocols
Communications Infrastructure
Ideal for telecommunications equipment:
- Digital signal processing
- Protocol conversion and bridging
- Network packet processing
- Software-defined radio (SDR)
Aerospace and Defense
Military and aerospace applications benefit from:
- Radar signal processing
- Avionics control systems
- Secure communications
- High-reliability computing
Medical Imaging
Medical device applications include:
- Ultrasound image processing
- CT scan reconstruction
- Real-time image enhancement
- Medical instrument control
Comparison Table: Virtex-E Family
| Part Number |
System Gates |
Logic Cells |
Block RAM |
User I/O |
Package |
| XCV50E |
57,344 |
1,728 |
32 Kbits |
176 |
FG256 |
| XCV300E |
322,560 |
10,368 |
131 Kbits |
316 |
FG456 |
| XCV1000E |
1,036,800 |
27,648 |
393 Kbits |
404 |
BG560 |
| XCV2000E |
518,400 |
43,200 |
655 Kbits |
512 |
FGG680 |
| XCV3200E |
3,359,232 |
74,448 |
1,179 Kbits |
644 |
FG1156 |
Design Tools and Support
Software Compatibility
The XCV2000E-6FGG680C is supported by comprehensive development tools:
- Vivado Design Suite: Advanced synthesis and implementation
- ISE Design Suite: Legacy support for existing designs
- Chipscope Pro: Integrated logic analyzer
- ModelSim: Simulation and verification
- Synplify Pro: Third-party synthesis option
IP Cores and Libraries
Accelerate development with pre-verified IP:
- MicroBlaze soft processor core
- PicoBlaze 8-bit microcontroller
- DSP cores (FFT, FIR filters)
- Communication protocols (PCIe, Ethernet, USB)
- Memory controllers (DDR, SDRAM)
Package and Ordering Information
Part Number Breakdown
XCV2000E-6FGG680C
- XCV: Virtex-E family designation
- 2000E: Device size (2 million system gates)
- -6: Speed grade (fastest commercial grade)
- FGG: Fine-pitch Ball Grid Array package
- 680: Pin count
- C: Commercial temperature range (0°C to +85°C)
Alternative Versions
| Part Number |
Temperature Range |
Application |
| XCV2000E-6FGG680C |
0°C to +85°C |
Commercial applications |
| XCV2000E-6FGG680I |
-40°C to +100°C |
Industrial applications |
| XCV2000E-7FGG680C |
0°C to +85°C |
Slightly slower, lower power |
| XCV2000E-8FGG680C |
0°C to +85°C |
Economy speed grade |
Technical Resources
Documentation and Support
- Datasheet: Complete electrical and timing specifications
- User Guide: Architecture overview and design guidelines
- Application Notes: Design best practices and optimization techniques
- Reference Designs: Pre-built examples for common applications
- Development Boards: Evaluation platforms available
Quality and Reliability
AMD maintains stringent quality standards:
- Qualification: AEC-Q100 automotive grade available
- Reliability: MTBF > 1 million hours
- RoHS Compliant: Lead-free package options
- Moisture Sensitivity: MSL 3 per JEDEC J-STD-020
- ESD Protection: 2000V Human Body Model
Power Consumption Characteristics
Typical Power Budget
| Power Component |
Typical Value |
Maximum Value |
| Static Power (Quiescent) |
0.5W |
1.2W |
| Dynamic Power (50% toggle) |
3.5W |
6.0W |
| I/O Power |
Varies |
Depends on standard |
| Total Device Power |
4.0W |
7.2W |
Power Management Features
- Individual power-down of unused block RAM
- Programmable slew rate control for I/O
- Optional I/O pre-emphasis for signal integrity
- Low-power configuration modes
Migration and Upgrade Path
Compatible Devices
Designers can migrate between Virtex-E family members:
- Downgrade Path: XCV1000E, XCV600E for cost optimization
- Upgrade Path: XCV3200E for increased capacity
- Next Generation: Virtex-II family for advanced features
Pin Compatibility
The FGG680 package maintains compatibility with:
- Same footprint across speed grades
- Common I/O assignment structure
- Consistent power pin locations
- Simplified PCB reuse
Procurement and Availability
Stock Status
The XCV2000E-6FGG680C is available through authorized distributors:
- Lead Time: Typically 8-12 weeks for large quantities
- Minimum Order: Varies by distributor
- Package Quantity: Trays of 30 or 60 units
- Samples: Available for qualified customers
Quality Assurance
All units undergo comprehensive testing:
- 100% electrical testing
- Burn-in testing available
- Lot traceability
- Certificate of Conformance (C of C) provided
Frequently Asked Questions
What is the difference between -6, -7, and -8 speed grades?
The speed grade indicates the maximum operating frequency, with -6 being the fastest and -8 being the slowest. Faster speed grades allow higher clock frequencies but typically consume more power and cost more.
Can this FPGA be used in automotive applications?
While the commercial temperature version (-C) is suitable for many automotive applications, the industrial temperature version (-I) is recommended for extended temperature ranges. AEC-Q100 qualified versions are available for safety-critical automotive systems.
What configuration memory is required?
The XCV2000E requires approximately 8.5 Mbit of configuration data. Compatible configuration PROMs include the XC18V04 or larger, or platform Flash devices like the XCF08P.
Is this device 5V tolerant?
No, the XCV2000E I/O pins are not 5V tolerant. Maximum VCCO voltage is 3.6V. Use level shifters or voltage translation devices when interfacing with 5V systems.
What development tools are required?
Xilinx ISE Design Suite (version 14.7 or earlier) or Vivado Design Suite provides complete support for design entry, synthesis, implementation, and programming of the XCV2000E-6FGG680C.
Conclusion
The XCV2000E-6FGG680C delivers outstanding performance and flexibility for demanding FPGA applications. With 518.4K system gates, 512 I/O pins, and advanced Virtex-E architecture, this device provides the resources needed for complex digital designs across industrial, communications, aerospace, and medical applications. Its proven reliability, comprehensive tool support, and extensive IP library make it an excellent choice for mission-critical systems requiring high-performance programmable logic solutions.