Overview of XCV2000E-6FG860CES FPGA
The XCV2000E-6FG860CES is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Virtex-E family. This high-performance programmable logic device delivers exceptional processing capabilities with 518,400 gates and operates at speeds up to 357MHz. Designed for mission-critical applications in telecommunications, industrial automation, aerospace, and embedded systems, this Xilinx FPGA represents the pinnacle of programmable logic technology.
Built on advanced 0.18μm CMOS process technology with 6-layer metal architecture, the XCV2000E-6FG860CES offers engineers unmatched flexibility and performance for complex digital designs.
Key Technical Specifications
| Specification |
Details |
| Part Number |
XCV2000E-6FG860CES |
| Manufacturer |
AMD Xilinx (formerly Xilinx Inc.) |
| Product Family |
Virtex-E 1.8V FPGAs |
| Logic Gates |
518,400 Gates |
| Configurable Logic Blocks (CLBs) |
9,600 CLBs |
| Logic Cells |
43,200 Cells |
| Maximum Frequency |
357 MHz |
| Operating Voltage |
1.8V Core |
| Process Technology |
0.18μm 6-Layer Metal CMOS |
| Package Type |
860-Pin Fine-Pitch Ball Grid Array (FBGA) |
| I/O Pins |
660 User I/O |
| Speed Grade |
-6 (Commercial Grade) |
| Temperature Range |
Commercial (0°C to +85°C) |
| RoHS Compliance |
Lead-Free / RoHS Compliant |
Product Features and Benefits
Advanced Architecture Design
The XCV2000E-6FG860CES leverages Xilinx’s revolutionary Virtex-E architecture, optimized for:
- Enhanced Place-and-Route Efficiency: Streamlined design flow reduces development time
- Silicon Efficiency: Maximum logic density per square millimeter
- Flexible Interconnect Resources: Rich hierarchy of routing options for optimal signal integrity
- High-Speed Performance: Commercial speed grade supporting 357MHz operation
Industry-Leading Capabilities
High Logic Density With 9,600 CLBs and 43,200 logic cells, this FPGA provides substantial resources for implementing complex digital systems, DSP algorithms, and embedded processors.
Abundant I/O Resources 660 user-configurable I/O pins support multiple voltage standards, enabling seamless interfacing with various peripheral devices and communication protocols.
Optimized Power Efficiency Operating at 1.8V core voltage, the device balances high performance with reasonable power consumption, ideal for battery-operated and power-sensitive applications.
Robust Package Design The 860-pin FBGA package offers excellent thermal performance and signal integrity, critical for high-frequency designs and dense PCB layouts.
Technical Performance Specifications
| Performance Parameter |
Value |
| System Gates |
518,400 |
| Distributed RAM Bits |
307,200 bits |
| Block RAM |
Available (Multiple blocks) |
| Maximum Clock Frequency |
357 MHz |
| I/O Standards Support |
LVTTL, LVCMOS, PCI, GTL, HSTL, SSTL |
| Configuration Memory |
SRAM-based |
| Configuration Time |
Fast parallel/serial configuration |
Applications and Use Cases
Telecommunications Infrastructure
The XCV2000E-6FG860CES excels in telecommunications equipment including:
- Base station controllers
- Network routers and switches
- Protocol converters
- Signal processing modules
- Digital signal transmission systems
Industrial Automation
Perfect for industrial control applications:
- Programmable Logic Controllers (PLCs)
- Motion control systems
- Machine vision processing
- Real-time monitoring equipment
- Factory automation interfaces
Aerospace and Defense
Mission-critical aerospace applications:
- Avionics systems
- Radar signal processing
- Navigation equipment
- Satellite communications
- Flight control systems
Data Processing and Computing
High-performance computing solutions:
- Hardware acceleration
- Cryptographic processors
- Video/image processing
- High-speed data acquisition
- Custom computing engines
Package and Pin Configuration
| Package Details |
Specification |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Pin Count |
860 pins |
| Package Size |
35mm x 35mm (typical) |
| Ball Pitch |
1.0mm |
| Total I/O Pins |
660 user I/O |
| Dedicated Configuration Pins |
Multiple configuration modes |
| Power/Ground Pins |
Distributed for optimal power delivery |
Design Resources and Development Tools
Compatible Design Software
- Vivado Design Suite: Modern FPGA design environment with advanced synthesis and implementation
- ISE Design Suite: Legacy support for Virtex-E family devices
- IP Core Libraries: Pre-verified functional blocks for accelerated development
Development Support
Engineers working with the XCV2000E-6FG860CES benefit from:
- Comprehensive datasheets and user guides
- Reference designs and application notes
- Technical support from authorized distributors
- Active FPGA developer community forums
Quality and Reliability Standards
| Quality Parameter |
Specification |
| RoHS Status |
Compliant (Lead-Free) |
| Moisture Sensitivity Level |
MSL 3 |
| ESD Protection |
Human Body Model (HBM) compliant |
| Operating Temperature |
0°C to +85°C (Commercial) |
| Storage Temperature |
-55°C to +150°C |
| MTBF |
High reliability for industrial applications |
Comparison with Alternative FPGA Models
| Feature |
XCV2000E-6FG860CES |
XCV2000E-8FG860C |
XCV2000E-6BG560C |
| Speed Grade |
-6 (357MHz) |
-8 (Faster) |
-6 (357MHz) |
| Package Pins |
860 FBGA |
860 FBGA |
560 BGA |
| I/O Count |
660 |
660 |
404 |
| Best For |
Balanced performance |
Maximum speed |
Space-constrained designs |
Ordering Information and Availability
Part Number Breakdown
XCV2000E-6FG860CES
- XCV: Virtex-E family identifier
- 2000E: Device density (2 million system gates)
- -6: Commercial speed grade
- FG860: Fine-pitch BGA, 860 pins
- C: Commercial temperature range
- ES: Engineering sample or specific revision
Packaging and Delivery
All XCV2000E-6FG860CES units ship with:
- Anti-static ESD protective packaging
- Moisture barrier bag with desiccant
- Product identification label
- Handling and storage guidelines
Frequently Asked Questions (FAQ)
Q: What is the difference between XCV2000E-6FG860CES and XCV2000E-6FG860I? A: The primary difference lies in the temperature grade. The “C” suffix indicates commercial temperature range (0°C to +85°C), while “I” denotes industrial temperature range (-40°C to +100°C).
Q: Is this FPGA suitable for new designs? A: While the Virtex-E family is mature technology, it remains suitable for cost-sensitive applications and legacy system upgrades. For new cutting-edge designs, consider newer Xilinx families like UltraScale+ or Versal.
Q: What development tools are required? A: Xilinx Vivado Design Suite or ISE Design Suite are the primary tools. Many engineers prefer Vivado for its modern interface and advanced features.
Q: What is the configuration method? A: The device supports multiple configuration modes including Master Serial, Slave Serial, Master SelectMAP, Slave SelectMAP, and JTAG.
Q: Are evaluation boards available? A: While specific evaluation boards for this exact model may be limited, Xilinx development boards supporting Virtex-E architecture can be used for prototyping.
Why Choose XCV2000E-6FG860CES?
Proven Technology
The Virtex-E family has powered thousands of successful products worldwide, offering:
- Mature, well-documented architecture
- Extensive design examples and reference materials
- Broad ecosystem support
- Competitive pricing for volume production
Flexibility and Scalability
This FPGA adapts to evolving requirements through:
- Reconfigurable logic resources
- Support for partial reconfiguration
- Multiple I/O standard compatibility
- Scalable performance characteristics
Cost-Effective Solution
For applications requiring:
- Proven reliability over cutting-edge performance
- Cost optimization in medium-volume production
- Legacy system compatibility
- Reduced development risk
Technical Support and Documentation
Available Resources
- Detailed product datasheet
- User guide and design tutorials
- Application notes for specific use cases
- PCB layout guidelines
- Thermal management recommendations
- Power supply design considerations
Where to Get Support
Authorized distributors and technical partners provide:
- Pre-sales technical consultation
- Design review services
- Sample units for evaluation
- Volume pricing and lead time quotes
- After-sales technical support
Conclusion
The XCV2000E-6FG860CES represents a mature, reliable FPGA solution for engineers requiring high-performance programmable logic with proven technology. With 518,400 gates, 660 I/O pins, and operation at 357MHz, this Virtex-E family device delivers the resources needed for demanding embedded applications in telecommunications, industrial automation, aerospace, and data processing.
Whether upgrading legacy systems or developing cost-optimized new products, the XCV2000E-6FG860CES offers the perfect balance of performance, flexibility, and value. Its RoHS compliance, extensive development tool support, and abundant technical documentation make it an excellent choice for professional embedded system designers.
For more information about Xilinx FPGA solutions and to request a quote for the XCV2000E-6FG860CES, contact your authorized distributor today.
