The XCV2000E-6FG680I is a high-performance, high-density field-programmable gate array (FPGA) from the Xilinx Virtex-E family. Designed for demanding industrial and embedded applications, this device delivers up to 518,400 system gates across 43,200 logic cells, operating on a low-power 1.8 V supply with an advanced 0.18 µm, 6-layer metal CMOS process. Whether you are developing communications infrastructure, signal processing pipelines, or industrial control systems, the XCV2000E-6FG680I offers the capacity, speed, and I/O flexibility required for complex programmable logic designs.

---

What Is the XCV2000E-6FG680I?

The XCV2000E-6FG680I is a member of the Virtex-E 1.8 V FPGA family manufactured by Xilinx (now AMD). The part number breaks down as follows:

• XCV2000E — Virtex-E family, approximately 2,000,000 system gates capacity
• -6 — Speed grade 6 (standard performance tier within the Virtex-E family)
• FG680 — Fine-pitch Ball Grid Array (FBGA) package with 680 pins
• I — Industrial temperature range (–40°C to +100°C)

As part of the broader Xilinx FPGA product ecosystem, the Virtex-E series was engineered specifically to push the boundaries of programmable logic density and speed, making this device suitable for applications that demand maximum gate utilization in a compact BGA form factor.

---

XCV2000E-6FG680I Key Specifications

The table below summarizes the most important electrical and mechanical specifications for the XCV2000E-6FG680I:

---

XCV2000E-6FG680I Detailed Technical Description

Logic Architecture and Configurable Logic Blocks

The core of the XCV2000E-6FG680I is its array of Configurable Logic Blocks (CLBs). Each CLB contains four slices, and each slice includes two look-up tables (LUTs) and two flip-flops. With 43,200 logic cells available, this device provides enough capacity to implement complex state machines, DSP pipelines, multi-channel data paths, and large finite-state automata without running out of logic resources.

The Virtex-E architecture features a regular, tiled structure that simplifies routing and helps place-and-route tools achieve high utilization. Dramatic increases in silicon efficiency result from optimizing the new architecture for place-and-route efficiency and exploiting an aggressive 6-layer metal 0.18 µm CMOS process, making Virtex-E FPGAs powerful and flexible alternatives to mask-programmed gate arrays.

Block RAM and Distributed Memory

The XCV2000E-6FG680I includes dedicated block RAM resources distributed throughout the device. These on-chip memories can be configured as single-port or dual-port RAM, ROM, or FIFO structures, supporting a wide range of memory-intensive applications such as packet buffers, frame buffers, and lookup tables for networking or image processing.

Distributed RAM is also available within the CLB slices, providing low-latency, high-bandwidth memory storage close to the logic resources that need it.

SelectI/O+ Technology and I/O Flexibility

The 512 user I/O pins on the XCV2000E-6FG680I support Xilinx’s SelectI/O+ technology, which allows each I/O bank to be independently configured for a wide range of I/O voltage standards. This makes it straightforward to interface with different logic families on the same board without external level-shifting circuitry.

Supported I/O standards include LVTTL, LVCMOS, SSTL, GTL, CTT, PCI, and others. The device is also PCI compliant at both 33 MHz and 66 MHz, enabling direct integration into PCI bus systems.

Clock Resources and DLL Support

The XCV2000E-6FG680I integrates Delay-Locked Loop (DLL) circuits that provide clock deskew, frequency synthesis, and phase shifting. These DLLs eliminate clock distribution skew across the device, enabling synchronous designs to run at the highest possible speeds. The architecture supports both global and regional clock networks for fine-grained clock management in large, multi-clock domain designs.

Speed Grade -6 Performance

The “-6” speed grade designates a standard performance version within the Virtex-E family. The XCV2000E-6FG680I operates at up to 357 MHz internal performance. This level of performance makes the device well-suited for applications such as high-speed data acquisition, communications protocol processing, and digital signal processing (DSP) functions that require rapid computation.

---

Package Information: 680-Pin FBGA

The XCV2000E-6FG680I comes in a 680-pin Fine-Pitch Ball Grid Array (FBGA) package, also referenced as 680-LBGA Exposed Pad. The table below outlines the package characteristics:

The compact BGA footprint minimizes PCB board area consumption while the exposed pad enhances thermal performance, helping the device meet junction temperature requirements in high-power-density designs.

---

Operating Conditions and Electrical Characteristics

The table below summarizes the recommended operating conditions for the XCV2000E-6FG680I:

---

XCV2000E-6FG680I Applications

The XCV2000E-6FG680I is ideally suited for a broad range of professional and industrial applications. Its combination of high gate count, fast internal clock speed, and flexible I/O standards makes it a versatile choice across multiple market segments:

Communications and Networking

The device’s large logic capacity and high-speed I/O are well suited for implementing network switch fabrics, protocol processing engines (Ethernet, SONET/SDH), and traffic management logic for telecom line cards and data center switching equipment.

Industrial Automation and Control

With its industrial temperature rating (–40°C to +100°C), the XCV2000E-6FG680I is a reliable choice for programmable industrial controllers, motor drives, servo controllers, and real-time data acquisition systems operating in harsh factory environments.

Signal Processing and Image Processing

The on-chip block RAM, DLLs, and fast CLB array make the device well-suited for DSP pipelines, FIR/IIR filters, FFT engines, and image processing algorithms used in radar, medical imaging, and machine vision systems.

Automotive and Embedded Systems

The industrial-grade temperature range and flexible I/O support make the XCV2000E-6FG680I a candidate for advanced driver assistance systems (ADAS), infotainment platforms, and other automotive embedded designs requiring high logic density.

Data Center and High-Performance Computing

The device can serve as an accelerator card fabric for data centers, implementing functions such as data compression, encryption, and custom compute offload that benefit from the flexibility of reconfigurable logic.

---

XCV2000E-6FG680I vs. Other Virtex-E Variants

The table below compares the XCV2000E-6FG680I with other closely related Virtex-E parts, helping engineers select the right device for their design:

The -I suffix on the XCV2000E-6FG680I identifies the industrial temperature grade, making it the preferred choice over the commercial-grade variants (suffix -C) when the operating environment includes temperature extremes below 0°C or above 85°C.

---

Part Number Decoder: Understanding XCV2000E-6FG680I

---

Design Tools and Programming

The XCV2000E-6FG680I is supported by Xilinx’s legacy ISE Design Suite. While the newer Vivado Design Suite targets UltraScale and later Xilinx families, ISE remains the recommended tool chain for Virtex-E designs. Typical design flow includes:

1. RTL design entry in VHDL or Verilog
2. Synthesis using XST (Xilinx Synthesis Technology) within ISE
3. Implementation (translate, map, place-and-route) targeting the XCV2000E device
4. Timing analysis and Static Timing Analysis (STA)
5. Bitstream generation and download via JTAG or configuration memory

Configuration modes supported include Master Serial, Slave Serial, SelectMAP, and JTAG (IEEE 1149.1 boundary scan), providing flexible system-level configuration options.

---

Ordering Information and Availability

The XCV2000E-6FG680I is classified as an obsolete part by Xilinx/AMD, meaning it is no longer in active production. However, it remains available through authorized and independent electronic component distributors worldwide, including DigiKey, Heisener, Worldway Electronics, and others.

When sourcing obsolete components, always verify authenticity through traceable supply chain partners. Pre-shipment inspection (PSI) and batch testing are recommended practices when procuring from the secondary market.

---

Frequently Asked Questions (FAQ)

What is the XCV2000E-6FG680I used for?

The XCV2000E-6FG680I is used in applications requiring high-density programmable logic, including communications equipment, industrial automation, signal processing, image processing, data center acceleration, and automotive embedded systems.

What does the “-I” suffix mean on the XCV2000E-6FG680I?

The -I indicates the industrial temperature grade, meaning the device is rated to operate from –40°C to +100°C ambient temperature. This distinguishes it from the commercial grade (-C suffix) rated from 0°C to 85°C.

Is the XCV2000E-6FG680I still in production?

No. The XCV2000E-6FG680I is classified as an obsolete component by Xilinx/AMD. Stock continues to be available from component distributors and independent stocking agents, but new production runs are no longer scheduled.

What package does the XCV2000E-6FG680I use?

The device is packaged in a 680-pin Fine-Pitch Ball Grid Array (FBGA), also referred to as 680-LBGA Exposed Pad. This surface-mount package provides a compact footprint and improved thermal performance.

What design tools support the XCV2000E-6FG680I?

The XCV2000E-6FG680I is supported by Xilinx ISE Design Suite. Designers can use ISE for RTL entry, synthesis, place-and-route, timing analysis, and bitstream generation targeting the Virtex-E family.

What I/O voltage standards does the XCV2000E-6FG680I support?

The device supports a wide range of I/O standards including LVTTL, LVCMOS (3.3 V, 2.5 V, 1.8 V), SSTL2, SSTL3, GTL, GTL+, CTT, PCI (3.3 V, 33/66 MHz), and AGP, thanks to Xilinx’s SelectI/O+ technology.

---

Summary

The XCV2000E-6FG680I is a proven, high-capacity Xilinx Virtex-E FPGA offering approximately 518,400 system gates, 43,200 logic cells, 512 I/O pins, and industrial-grade temperature performance in a 680-pin FBGA package. Its 0.18 µm 6-layer metal CMOS process and 357 MHz internal clock speed make it a powerful solution for communications, industrial, signal processing, and embedded computing designs. While the part is now obsolete in terms of new production, it remains widely available through the distribution channel and continues to be used in legacy system maintenance, product sustaining, and new designs where proven Virtex-E technology is specified.

For engineers and procurement specialists sourcing Virtex-E devices, the XCV2000E-6FG680I remains one of the highest-density, most flexible members of its family, combining large logic capacity with a robust, field-proven architecture.