Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCV2000E-6FG680C: High-Performance Virtex-E FPGA Solution for Advanced Digital Systems

Product Details

Overview of XCV2000E-6FG680C FPGA

The XCV2000E-6FG680C is a powerful field-programmable gate array (FPGA) from the renowned Virtex-E family, manufactured by AMD (formerly Xilinx). This advanced programmable logic device delivers exceptional performance with 518.4K gates and 43,200 logic cells, making it an ideal choice for telecommunications, high-speed data processing, and complex embedded applications. With its 680-pin Fine-Pitch Ball Grid Array (FBGA) package and 512 I/O pins, this Xilinx FPGA provides the flexibility and scalability needed for demanding design requirements.

Key Technical Specifications

Core Performance Features

Specification Details
Part Number XCV2000E-6FG680C
Manufacturer AMD (Xilinx)
Product Family Virtex-E 1.8V FPGAs
Logic Elements 43,200 cells
System Gates 518,400 (518.4K)
Total Gate Capacity 2,541,952 gates
Operating Voltage 1.8V
Process Technology 0.18µm CMOS
Maximum Frequency 357 MHz

Package and I/O Configuration

Feature Specification
Package Type 680-Pin FBGA (Fine-Pitch Ball Grid Array)
Total I/O Pins 512 user I/O
Total RAM Bits 655,360 bits
Temperature Range -40°C to +100°C (Industrial)
Speed Grade -6 (Standard Performance)
Metal Layers 6-layer metal interconnect

Product Features and Benefits

Advanced Programmable Logic Architecture

The XCV2000E-6FG680C FPGA leverages Xilinx’s optimized Virtex-E architecture, which significantly enhances silicon efficiency through advanced place-and-route capabilities. The aggressive 6-layer metal 0.18µm CMOS process technology enables this FPGA to serve as a powerful alternative to traditional mask-programmed gate arrays.

High-Speed Performance Capabilities

Operating at frequencies up to 357 MHz, this FPGA delivers the processing power required for:

  • High-speed telecommunications equipment
  • Advanced signal processing applications
  • Real-time data acquisition systems
  • Industrial automation and control
  • Video and image processing
  • Network switching and routing

Flexible I/O and Memory Resources

With 512 user I/O pins and over 655K RAM bits, the XCV2000E-6FG680C provides:

  • Extensive connectivity options for complex system integration
  • Ample internal memory for data buffering and storage
  • Support for various I/O standards and voltage levels
  • Flexibility in interface design for multi-protocol applications

Applications and Use Cases

Primary Application Areas

Industry Application Examples
Telecommunications Base station equipment, digital switching, protocol conversion
Industrial PLCs, motor control, sensor interfaces, factory automation
Data Processing Server acceleration, data center equipment, network processors
Medical Electronics Imaging systems, diagnostic equipment, patient monitoring
Aerospace/Defense Radar systems, secure communications, signal intelligence
Test & Measurement High-speed oscilloscopes, logic analyzers, signal generators

Design and Development Support

Compatible Design Tools

The XCV2000E-6FG680C is fully supported by AMD’s (Xilinx’s) comprehensive development tool suite, including:

  • Vivado Design Suite
  • ISE Design Suite (legacy support)
  • IP Core libraries
  • Simulation and verification tools
  • Programming and debugging utilities

Development Resources

Engineers working with this FPGA have access to:

  • Complete datasheets and technical documentation
  • Reference designs and application notes
  • Online design support forums
  • Technical training resources
  • Third-party IP cores and design services

Package and Thermal Characteristics

Physical Specifications

Parameter Value
Package Body Size 27mm x 27mm (nominal)
Ball Pitch Fine pitch (1.0mm typical)
Total Ball Count 680
Package Height Low-profile design
Moisture Sensitivity MSL 3 (Moisture Sensitivity Level)

Thermal Management

The XCV2000E-6FG680C operates across the industrial temperature range (-40°C to +100°C), ensuring reliable performance in harsh environments. Proper thermal management through heatsinks or forced-air cooling may be required for sustained high-performance operation.

Quality and Reliability

Manufacturing Standards

AMD (Xilinx) FPGAs are manufactured to the highest quality standards:

  • ISO 9001 certified manufacturing
  • RoHS compliant
  • REACH compliant
  • Conflict-free sourcing
  • Automotive-grade options available

Reliability Features

  • Extended operational lifetime
  • Built-in error correction capabilities
  • Low failure rates (FIT rates available in datasheets)
  • Extensive qualification testing
  • Production lot traceability

Comparison with Related Products

Virtex-E Family Variants

Part Number Logic Cells I/O Pins Package Speed Grade
XCV1600E 34,560 404 Various -6, -7, -8
XCV2000E-6FG680C 43,200 512 680-FBGA -6
XCV2600E 55,296 644 Various -6, -7, -8
XCV3200E 69,120 804 Various -6, -7, -8

Procurement and Availability

Ordering Information

When ordering the XCV2000E-6FG680C, ensure you specify:

  • Complete part number with speed grade and package code
  • Quantity requirements
  • Lead time expectations
  • Required certifications or documentation
  • Special packaging requirements (tape and reel, trays, etc.)

Typical Lead Times

  • Standard orders: Contact authorized distributors
  • Volume orders: May require factory lead time
  • Development samples: Often available with shorter lead times

Technical Support and Resources

Getting Started

For engineers new to the XCV2000E-6FG680C or Virtex-E family:

  1. Download the complete datasheet from AMD’s website
  2. Review the Virtex-E User Guide
  3. Explore reference designs related to your application
  4. Consider evaluation boards for rapid prototyping
  5. Utilize AMD’s technical support forums

Additional Documentation

Essential documentation for the XCV2000E-6FG680C includes:

  • Product datasheet with DC and AC specifications
  • Package mechanical drawings
  • IBIS models for signal integrity analysis
  • Power estimation tools and guidelines
  • Programming file formats and generation

Conclusion

The XCV2000E-6FG680C represents a mature, proven FPGA solution for applications requiring substantial logic resources, high I/O count, and reliable performance. Its combination of 43,200 logic cells, 512 I/O pins, and industrial-grade temperature operation makes it suitable for demanding applications in telecommunications, industrial control, and high-speed data processing. While newer FPGA families offer additional features, the Virtex-E series continues to serve critical applications where proven reliability and extensive design heritage are paramount.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.