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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCV2000E-6FG1156C: High-Performance Virtex-E FPGA for Advanced Digital Systems

Product Details

Overview of XCV2000E-6FG1156C FPGA

The XCV2000E-6FG1156C is a high-density Field Programmable Gate Array (FPGA) from Xilinx’s renowned Virtex-E family, now manufactured under AMD. This powerful programmable logic device delivers exceptional performance for complex digital designs, offering 518,400 gates and 43,200 logic cells in a compact 1156-pin FBGA package. Designed for mission-critical applications in telecommunications, industrial automation, and advanced driver assistance systems (ADAS), the XCV2000E-6FG1156C represents the pinnacle of Xilinx FPGA technology from the early 2000s era.

Key Specifications and Technical Features

Core Architecture Specifications

Specification Value
Part Number XCV2000E-6FG1156C
Manufacturer Xilinx (AMD)
Product Family Virtex-E
Logic Cells 43,200 cells
System Gates 518,400 gates
Total RAM Bits 655,360 bits
User I/O Pins 804 I/O

Package and Physical Characteristics

Parameter Specification
Package Type FBGA (Fine-Pitch Ball Grid Array)
Pin Count 1156 pins
Package Dimensions 34mm x 34mm
Seated Height 2.6mm (max)
Technology Node 0.18μm CMOS
Metal Layers 6-layer metal process

Electrical Characteristics

Characteristic Value
Core Voltage 1.8V
Speed Grade -6 (357 MHz internal performance)
Temperature Range Commercial (0°C to 85°C)
Power Operation Low-power optimized design

Understanding the XCV2000E-6FG1156C Part Number

The XCV2000E-6FG1156C designation provides critical information about this FPGA:

  • XCV = Xilinx Virtex family prefix
  • 2000E = 2 million system gate equivalent, Virtex-E generation
  • -6 = Speed grade (fastest commercial grade)
  • FG = Fine-pitch Ball Grid Array package
  • 1156 = Pin count (1156 balls)
  • C = Commercial temperature range (0°C to 85°C)

Advanced Features of the Virtex-E FPGA Family

High-Performance Programmable Logic

The XCV2000E-6FG1156C leverages Virtex-E architecture optimized for:

  • Enhanced Place-and-Route Efficiency: Advanced routing architecture reduces congestion and improves timing closure
  • 130 MHz Internal Performance: Four LUT (Look-Up Table) levels enable high-speed operation
  • Flexible Interconnect Hierarchy: Rich interconnection resources support complex design requirements
  • Silicon Efficiency: Aggressive 6-layer metal 0.18μm CMOS process maximizes logic density

SelectIO+ Technology

The XCV2000E-6FG1156C features Xilinx’s SelectIO+ technology, providing:

  • Multiple I/O standards support (LVTTL, LVCMOS, GTL, HSTL, SSTL, and more)
  • PCI compliant interface for 33MHz and 66MHz operation
  • Programmable drive strength and slew rate control
  • Support for both single-ended and differential signaling

On-Chip Memory Resources

Memory Type Capacity
Block RAM 655,360 total bits
Distributed RAM Available in CLBs
Configuration Flexible dual-port configurations

Applications for XCV2000E-6FG1156C

Automotive and ADAS Systems

The XCV2000E-6FG1156C excels in automotive applications requiring high reliability:

  • Advanced Driver Assistance Systems (ADAS)
  • Sensor fusion processing
  • Real-time image and radar signal processing
  • Vehicle communication gateways

Communications Infrastructure

Ideal for telecommunications and networking equipment:

  • Wireless base station controllers
  • Protocol processing engines
  • High-speed data packet routing
  • Digital signal processing (DSP) applications

Industrial and Enterprise Systems

Perfect for demanding industrial applications:

  • Industrial automation controllers
  • Machine vision systems
  • Enterprise-grade projectors
  • High-performance embedded computing

Design Advantages and Benefits

Why Choose XCV2000E-6FG1156C?

  1. Proven Reliability: Mature Virtex-E architecture with extensive field deployment
  2. Cost-Effective Alternative: Competitive alternative to mask-programmed gate arrays
  3. Design Flexibility: Reconfigurable logic allows for design updates and iterations
  4. Fast Time-to-Market: Programmable nature eliminates lengthy ASIC fabrication cycles
  5. Comprehensive Tool Support: Compatible with Xilinx ISE Design Suite

Performance Comparison Table

Feature XCV2000E-6FG1156C Typical Gate Array
Development Time Weeks Months
NRE Costs Minimal $100K+
Flexibility Fully reconfigurable Fixed
Time to Market Rapid Extended
Design Iterations Unlimited Costly

Technical Resources and Support

Design Tools and Software

The XCV2000E-6FG1156C is supported by:

  • Xilinx ISE Design Suite (legacy support)
  • FPGA Editor for detailed placement control
  • ChipScope Pro for in-system debugging
  • ModelSim for HDL simulation

Development Platforms

Compatible with various development boards and evaluation kits designed for Virtex-E FPGAs, enabling rapid prototyping and system validation.

Procurement and Availability

Product Status and Sourcing

Status Details
Lifecycle Mature/Legacy product
RoHS Compliance Compliant (Lead-free available)
REACH Compliance Compliant
Quality Grade Industrial grade

Package and Shipping

Products are shipped with:

  • Anti-static ESD protection packaging
  • Moisture sensitivity level (MSL) appropriate handling
  • Full traceability documentation
  • Manufacturer authenticity guarantee

XCV2000E-6FG1156C vs. Modern FPGA Alternatives

While the XCV2000E-6FG1156C remains a capable solution for legacy system support and cost-sensitive applications, designers should consider:

Aspect XCV2000E-6FG1156C Modern FPGAs
Power Efficiency Good (1.8V, 0.18μm) Excellent (sub-1V, 7nm+)
Logic Density 518K gates Multi-million gates
DSP Performance Limited Dedicated DSP blocks
I/O Standards Legacy standards Latest SerDes, PCIe
Best Use Case Legacy support, proven designs New high-performance designs

Installation and Implementation Guidelines

PCB Design Considerations

When designing with XCV2000E-6FG1156C:

  1. Power Distribution: Ensure robust 1.8V core power delivery with adequate decoupling
  2. Thermal Management: Plan for appropriate heatsinking based on utilization
  3. Signal Integrity: Follow high-speed design practices for critical I/O
  4. Package Footprint: Use manufacturer-recommended land pattern for 1156-FBGA

Programming and Configuration

The XCV2000E-6FG1156C supports multiple configuration modes:

  • Master Serial mode
  • Slave Serial mode
  • Boundary Scan (JTAG)
  • SelectMAP parallel configuration

Quality Assurance and Reliability

Manufacturing Quality

All XCV2000E-6FG1156C units undergo:

  • Comprehensive electrical testing
  • Temperature cycling validation
  • Visual inspection standards
  • Compliance with JEDEC specifications

Reliability Metrics

Parameter Specification
MTBF >1 million hours (typical)
Operating Life 20+ years
Storage Temp -55°C to 150°C
ESD Protection HBM Class 1C (>2000V)

Frequently Asked Questions

Is the XCV2000E-6FG1156C suitable for new designs?

While capable and reliable, this FPGA is best suited for legacy system maintenance, cost-sensitive applications, or projects requiring proven Virtex-E architecture. New designs may benefit from modern FPGA families with enhanced features.

What is the difference between -6FG1156C and -6FG1156I?

The suffix indicates temperature range: ‘C’ denotes Commercial grade (0°C to 85°C), while ‘I’ represents Industrial grade (-40°C to 100°C).

Can I migrate from XCV2000E to newer Xilinx FPGAs?

Yes, Xilinx provides migration guides and design porting tools, though some redesign may be required due to architectural differences.

Conclusion: XCV2000E-6FG1156C Performance Summary

The XCV2000E-6FG1156C represents a mature, reliable FPGA solution from Xilinx’s celebrated Virtex-E family. With its 804 I/O pins, 518,400 gates, and robust 1156-pin FBGA package, this device continues to serve in critical applications worldwide. Whether you’re maintaining legacy systems, developing cost-optimized solutions, or require the proven reliability of Virtex-E architecture, the XCV2000E-6FG1156C delivers consistent performance backed by decades of field deployment.

For engineers and procurement professionals seeking authentic XCV2000E-6FG1156C components, partnering with authorized distributors ensures genuine products, technical support, and comprehensive documentation for successful project implementation.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.