Overview of XCV1600E-8FG860C FPGA
The XCV1600E-8FG860C is a powerful field-programmable gate array (FPGA) from AMD (formerly Xilinx), designed to deliver exceptional performance for complex digital systems. This advanced device belongs to the renowned Virtex-E family, offering engineers and designers a robust platform for high-speed applications.
As a leading solution in programmable logic, the XCV1600E-8FG860C combines high gate density with superior speed performance. Moreover, it provides the flexibility needed for telecommunications, industrial automation, and aerospace applications.
Key Specifications and Features
Technical Specifications Table
| Parameter |
Specification |
| Part Number |
XCV1600E-8FG860C |
| Manufacturer |
AMD (Xilinx) |
| Product Family |
Virtex-E |
| Logic Elements/Cells |
1,600,000 |
| Speed Grade |
-8 (Fastest) |
| Package Type |
FG860 (Fine-pitch BGA) |
| Total I/O Pins |
680 |
| Operating Temperature |
0°C to +85°C (Commercial) |
| Supply Voltage |
1.8V Core, 3.3V I/O |
Performance Characteristics
| Feature |
Details |
| System Gates |
Up to 1.6 Million |
| CLB Array |
96 x 96 |
| Total Block RAM |
288 Kbits |
| Distributed RAM |
98,304 bits |
| Maximum User I/O |
680 pins |
| Clock Management |
8 DLLs (Delay-Locked Loops) |
Core Features and Capabilities
Advanced Architecture Benefits
The XCV1600E-8FG860C offers several distinctive advantages. First, its -8 speed grade represents the fastest performance tier available in the Virtex-E family. Additionally, the device incorporates advanced clock management resources that ensure signal integrity.
Furthermore, this Xilinx FPGA provides exceptional routing resources. Consequently, designers can implement complex algorithms with minimal timing constraints. The architecture also supports advanced features like block RAM and distributed RAM configurations.
Memory and Storage Options
| Memory Type |
Capacity |
Configuration |
| Block SelectRAM |
288 Kbits |
Dual-port, True dual-port |
| Distributed SelectRAM |
98,304 bits |
LUT-based memory |
| Total Available Memory |
386 Kbits |
Flexible allocation |
Application Areas and Use Cases
Primary Applications
The XCV1600E-8FG860C excels in demanding applications. For instance, it serves telecommunications infrastructure requiring high-speed data processing. Similarly, it supports complex video processing systems that need real-time performance.
In addition, the device is ideal for:
- High-speed networking equipment – Routers, switches, and packet processors
- Digital signal processing – Real-time filtering and transformation
- Industrial control systems – Advanced automation and monitoring
- Aerospace and defense – Radar systems and secure communications
- Medical imaging – CT scanners and ultrasound equipment
- Test and measurement – High-speed data acquisition systems
Industry-Specific Benefits
| Industry |
Application |
Key Benefit |
| Telecommunications |
Base stations, optical networking |
Ultra-low latency processing |
| Automotive |
ADAS, infotainment systems |
Reliable real-time operation |
| Medical |
Diagnostic equipment |
High-precision data handling |
| Industrial |
Factory automation, robotics |
Deterministic control loops |
Design and Implementation
Package Information
The FG860 package provides excellent thermal performance and signal integrity. Specifically, this fine-pitch Ball Grid Array (BGA) configuration offers:
- Package Dimensions: 35mm x 35mm
- Ball Pitch: 1.00mm
- Pin Count: 860 total pins
- Usable I/O: Up to 680 pins
Additionally, the compact footprint enables dense board layouts. Therefore, designers can optimize PCB space while maintaining high I/O count.
Power Specifications
| Power Parameter |
Typical Value |
Maximum Value |
| Core Voltage (VCCINT) |
1.8V |
1.8V ±5% |
| I/O Voltage (VCCO) |
3.3V |
2.5V-3.3V |
| Static Power |
150mW |
250mW |
| Dynamic Power |
Design-dependent |
Varies by utilization |
Development and Programming
Design Tool Support
The XCV1600E-8FG860C integrates seamlessly with industry-standard development tools. Notably, Xilinx ISE Design Suite provides comprehensive support. Furthermore, the device works with:
- Vivado Design Suite – Advanced synthesis and implementation
- ModelSim – HDL simulation and verification
- ChipScope Pro – Real-time debugging
- Third-party tools – Synopsys, Mentor Graphics support
Configuration Options
| Configuration Method |
Interface |
Speed |
| JTAG |
IEEE 1149.1 |
Standard debugging |
| SelectMAP |
Parallel 8/16/32-bit |
High-speed programming |
| Serial |
SPI/BPI flash |
Boot from external memory |
| Slave Serial |
Daisy-chain capable |
Multi-device configuration |
Quality and Reliability
Manufacturing Standards
AMD manufactures the XCV1600E-8FG860C to the highest quality standards. Consequently, the device meets stringent reliability requirements. Each unit undergoes rigorous testing procedures.
Compliance and Certifications
- RoHS Compliant – Lead-free manufacturing
- REACH Certified – Environmental safety
- AEC-Q100 – Automotive grade versions available
- MIL-STD-883 – Military/aerospace versions
Ordering and Availability
Part Number Breakdown
Understanding the XCV1600E-8FG860C part number helps ensure correct ordering:
- XCV = Xilinx Virtex-E family
- 1600E = 1.6 million system gates
- 8 = Speed grade (-8 is fastest)
- FG860 = Package type (Fine-pitch BGA, 860 pins)
- C = Commercial temperature grade (0°C to +85°C)
Alternative Variants
| Part Number |
Speed Grade |
Temperature Range |
Application |
| XCV1600E-7FG860C |
-7 (Fast) |
Commercial |
Standard applications |
| XCV1600E-8FG860C |
-8 (Fastest) |
Commercial |
High-performance needs |
| XCV1600E-8FG860I |
-8 (Fastest) |
Industrial |
Extended temperature |
Competitive Advantages
Why Choose XCV1600E-8FG860C
This FPGA stands out for several reasons. First, the -8 speed grade delivers maximum performance for timing-critical designs. Second, the extensive I/O count supports complex interface requirements. Third, proven Virtex-E architecture ensures design reliability.
Moreover, the device offers excellent cost-performance balance. Therefore, it remains popular for both new designs and legacy system maintenance.
Performance Comparison
| Feature |
XCV1600E-8FG860C |
Competing Solutions |
| System Gates |
1.6 Million |
1.0-1.5 Million |
| Speed Grade |
-8 (Fastest) |
Standard grades |
| I/O Count |
680 |
500-600 |
| Block RAM |
288 Kbits |
128-256 Kbits |
| Clock Resources |
8 DLLs |
4-6 DLLs |
Getting Started
Design Resources
Engineers can access comprehensive resources for the XCV1600E-8FG860C. Specifically, AMD provides detailed datasheets, application notes, and reference designs. Furthermore, extensive community support exists through forums and user groups.
Evaluation and Prototyping
Development boards featuring the XCV1600E-8FG860C enable rapid prototyping. Additionally, evaluation kits include example designs and IP cores. Consequently, time-to-market reduces significantly.
Conclusion
The XCV1600E-8FG860C represents a powerful solution for high-performance FPGA applications. Its combination of speed, capacity, and I/O resources makes it ideal for demanding digital designs. Whether you’re developing telecommunications equipment, industrial controllers, or aerospace systems, this device delivers the performance you need.
Furthermore, the extensive tool support and proven architecture ensure successful project completion. Therefore, consider the XCV1600E-8FG860C for your next high-performance programmable logic application.
