Product Overview: AMD XCV1600E-6FG900I Field Programmable Gate Array
The XCV1600E-6FG900I is a high-performance Field Programmable Gate Array (FPGA) from AMD’s Virtex-E series, designed to deliver exceptional processing power for mission-critical digital signal processing, data encryption, and industrial automation applications. This advanced IC FPGA features 700 I/O pins in a 900-FBGA package, making it an ideal solution for complex embedded systems requiring robust logic density and superior performance.
As part of AMD’s renowned Xilinx FPGA family, the XCV1600E-6FG900I represents a powerful alternative to traditional mask-programmed gate arrays, offering unprecedented flexibility and reconfigurability for modern electronic designs.
Technical Specifications: XCV1600E-6FG900I Key Features
| Specification |
Details |
| Part Number |
XCV1600E-6FG900I |
| Manufacturer |
AMD (formerly Xilinx Inc.) |
| Product Series |
Virtex®-E 1.8V FPGA |
| Package Type |
900-FBGA (31x31mm) |
| Mounting Type |
Surface Mount Technology |
| Number of I/O Pins |
700 |
| Logic Elements/Cells |
34,992 |
| Number of LABs/CLBs |
7,776 |
| Total RAM Bits |
589,824 |
| System Gates |
2,188,742 |
| Supply Voltage |
1.71V ~ 1.89V |
| Operating Temperature |
-40°C ~ 100°C (TJ) |
| Part Status |
Active (Limited Availability) |
What is the XCV1600E-6FG900I FPGA?
Understanding Virtex-E Field Programmable Gate Arrays
The XCV1600E-6FG900I is a member of the Virtex-E FPGA family, engineered using advanced 0.18 μm CMOS technology with a 6-layer metal process. This FPGA delivers exceptional silicon efficiency through optimized architecture designed for superior place-and-route performance. The device represents an evolutionary advancement in programmable logic design, building upon the proven reliability of the original Virtex FPGA platform.
Core Architecture and Design Philosophy
Built on AMD’s industry-leading FPGA architecture, the XCV1600E-6FG900I integrates a rich hierarchy of fast, flexible interconnect resources with massive logic capacity. The device’s 34,992 logic elements provide designers with the computational power needed for demanding applications while maintaining the flexibility that makes FPGAs superior to fixed-function ASICs.
XCV1600E-6FG900I Applications and Use Cases
Primary Application Areas
| Application Category |
Specific Use Cases |
| Digital Signal Processing |
High-speed filtering, FFT processing, adaptive algorithms |
| Data Encryption |
AES/DES encryption engines, secure key management, cryptographic accelerators |
| Network Routing |
Packet processing, protocol conversion, network interface controllers |
| Industrial Automation |
PLC functionality, motion control, sensor data processing |
| Computer Vision |
Image preprocessing, edge detection, pattern recognition |
| Artificial Intelligence |
Neural network inference, feature extraction, data preprocessing |
| Machine Learning |
Hardware acceleration for ML algorithms, model inference engines |
| Communication Systems |
Baseband processing, modulation/demodulation, error correction coding |
Industry-Specific Applications
Consumer Electronics: The XCV1600E-6FG900I excels in high-definition video processing, audio signal enhancement, and smart home automation controllers where real-time processing and low power consumption are critical.
Automotive Systems: Ideal for advanced driver assistance systems (ADAS), infotainment processors, and vehicle network controllers requiring reliable operation across extreme temperature ranges.
Aerospace & Defense: Perfect for radar signal processing, secure communications, and mission-critical control systems where reliability and radiation tolerance are paramount.
Performance Characteristics and Advantages
High-Density Logic Capabilities
With nearly 35,000 logic elements and over 2.1 million system gates, the XCV1600E-6FG900I provides substantial computational resources for complex algorithms. This high logic density enables designers to implement sophisticated functionality in a single chip, reducing system complexity and cost.
Advanced Memory Architecture
The integrated 589,824 bits of distributed RAM provide fast, localized storage for buffering, lookup tables, and temporary data storage. This embedded memory architecture eliminates the need for external memory in many applications, reducing latency and power consumption.
Superior I/O Capabilities
The 700 I/O pins support a wide range of interface standards, enabling seamless integration with various peripheral devices, memory systems, and communication protocols. The flexible I/O architecture supports multiple voltage standards and signaling types.
Design Considerations for XCV1600E-6FG900I Implementation
Power Management and Thermal Design
| Power Specification |
Value/Range |
| Core Voltage (VCCINT) |
1.8V ± 5% (1.71V – 1.89V) |
| I/O Voltage (VCCO) |
1.5V to 3.3V (bank-dependent) |
| Typical Power Consumption |
Application-dependent, optimizable through design |
| Junction Temperature Range |
-40°C to +100°C |
| Recommended PCB Layers |
6-8 layers for optimal signal integrity |
PCB Layout Best Practices
When designing with the XCV1600E-6FG900I, engineers should consider:
- Decoupling: Place multiple decoupling capacitors (0.1μF and 10μF) close to each power pin
- Power Planes: Dedicated power and ground planes for clean power delivery
- Signal Integrity: Controlled impedance routing for high-speed signals
- Thermal Management: Adequate copper pour and thermal vias for heat dissipation
- Configuration: Proper JTAG chain design for programming and debugging
Virtex-E Series Advantages Over Competing FPGAs
Why Choose XCV1600E-6FG900I?
Proven Reliability: The Virtex-E architecture has been deployed in millions of systems worldwide, demonstrating exceptional reliability across diverse applications and operating conditions.
Cost-Effective Solution: Compared to ASIC development, FPGAs like the XCV1600E-6FG900I offer significantly lower non-recurring engineering costs and faster time-to-market.
Future-Proof Design: Field programmability allows for firmware updates and feature additions throughout the product lifecycle without hardware changes.
Comprehensive Tool Support: Full compatibility with AMD Vivado Design Suite and legacy ISE tools ensures robust design flow and extensive IP libraries.
Package Information: 900-FBGA Configuration
Physical Characteristics
| Package Parameter |
Specification |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Ball Count |
900 balls |
| Package Dimensions |
31mm × 31mm |
| Ball Pitch |
1.0mm |
| Shipping Container |
Anti-static tray |
| MSL Rating |
Moisture Sensitivity Level 3 |
| Peak Reflow Temperature |
260°C (lead-free compatible) |
Assembly and Manufacturing Considerations
The 900-FBGA package requires careful PCB design and professional assembly capabilities. The 1.0mm ball pitch demands precision manufacturing processes, including:
- Solder paste stencil design with appropriate aperture ratios
- X-ray inspection for BGA void detection
- Thermal profiling for lead-free soldering processes
- Advanced rework capabilities for field repairs
XCV1600E-6FG900I vs. Modern FPGA Alternatives
Comparison with Current FPGA Technologies
While the XCV1600E-6FG900I is a mature product, it continues to offer compelling advantages for certain applications:
Legacy System Support: Essential for maintaining and upgrading existing designs where form, fit, and function compatibility is required.
Cost Optimization: For established production designs, the Virtex-E provides excellent performance-per-dollar compared to newer, more expensive alternatives.
Proven Design Libraries: Extensive verified IP cores and reference designs accelerate development cycles.
Availability: While newer FPGAs offer advanced features, the XCV1600E-6FG900I remains available for designs requiring this specific part number.
Configuration and Programming
Configuration Methods Supported
| Configuration Mode |
Description |
Typical Use Case |
| Master Serial |
FPGA controls configuration device |
Standalone systems |
| Slave Serial |
External processor controls configuration |
Processor-based systems |
| JTAG |
Industry-standard test access port |
Development and debugging |
| SelectMAP |
Parallel configuration interface |
Fast configuration requirements |
Programming Tools and Support
The XCV1600E-6FG900I is fully supported by AMD development tools:
- Vivado Design Suite: Synthesis, implementation, and timing analysis
- ISE Design Suite: Legacy tool support for existing projects
- ChipScope Pro: Embedded logic analyzer for debugging
- Hardware Debugger: Real-time system verification
Quality and Reliability Standards
Manufacturing Excellence
AMD manufactures the XCV1600E-6FG900I under stringent quality control processes:
- ISO 9001 Certified: Quality management system compliance
- Automotive Grade Options: AEC-Q100 qualified versions available
- RoHS Compliance: Lead-free manufacturing for environmental standards
- Extensive Testing: 100% functionality testing before shipment
- Traceability: Full lot tracking and device serialization
Reliability Testing
| Test Category |
Standard |
Result |
| Temperature Cycling |
JESD22-A104 |
Qualified |
| High Temperature Operating Life |
JESD22-A108 |
>1000 hours |
| Electrostatic Discharge |
JESD22-A114 |
HBM Class 2 |
| Latch-up |
JESD78 |
>100mA |
Procurement and Availability
Sourcing the XCV1600E-6FG900I
The XCV1600E-6FG900I is available through authorized distributors and specialized semiconductor suppliers. When procuring this component:
Verify Authenticity: Purchase only from authorized AMD distributors to ensure genuine parts and full warranty coverage.
Lead Times: As a mature product, lead times may vary based on demand. Contact suppliers for current availability.
Minimum Order Quantities: MOQs typically start at 1 piece for prototyping, with volume pricing available for production runs.
Storage Requirements: Store in original anti-static packaging at <30°C and <60% RH to maintain MSL compliance.
Technical Support and Resources
Documentation and Design Resources
Engineers working with the XCV1600E-6FG900I have access to comprehensive technical resources:
- Datasheet: Complete electrical and timing specifications
- User Guides: Detailed application information and design guidelines
- Application Notes: Specific implementation guidance for common use cases
- Reference Designs: Proven starting points for new designs
- PCB Layout Guidelines: Best practices for board design
- Thermal Design Guide: Power estimation and cooling recommendations
Community and Expert Support
- AMD Developer Forums: Community-driven technical discussions
- Technical Support: Direct access to AMD engineering support
- Training Resources: Online courses and webinars for FPGA design
- Design Services: Authorized AMD design partners for turnkey solutions
Frequently Asked Questions About XCV1600E-6FG900I
What is the difference between XCV1600E-6FG900I and XCV1600E-6FG900C?
The primary difference is the speed grade and temperature range. The “-6” indicates the speed grade, while the “I” suffix designates the industrial temperature range (-40°C to +100°C). The “C” version has a commercial temperature range (0°C to +85°C).
Is the XCV1600E-6FG900I suitable for new designs?
While the Virtex-E series is a mature product line, it remains suitable for applications requiring proven technology, cost optimization, or compatibility with existing systems. For cutting-edge applications requiring the latest features, consider newer AMD FPGA families.
What development tools are required?
The XCV1600E-6FG900I is supported by both AMD Vivado Design Suite and the legacy ISE Design Suite. Both tools are available for download from AMD’s website, with various licensing options.
Can this FPGA be used in safety-critical applications?
Yes, with proper design methodology and qualification. AMD offers automotive-grade versions and extensive reliability data to support safety-critical applications in aerospace, automotive, and medical devices.
Conclusion: Why XCV1600E-6FG900I Remains Relevant
The AMD XCV1600E-6FG900I Virtex-E FPGA continues to serve as a reliable, high-performance solution for demanding digital applications. With its combination of substantial logic resources, flexible I/O capabilities, and proven reliability, this FPGA provides excellent value for industrial automation, signal processing, and embedded control applications.
Whether you’re maintaining an existing design, optimizing for cost in production, or requiring the specific capabilities of the Virtex-E architecture, the XCV1600E-6FG900I delivers the performance and reliability demanded by professional engineers worldwide. Its extensive support ecosystem, including comprehensive documentation, development tools, and global distribution network, ensures successful implementation from prototype through volume production.
For engineers seeking a proven Xilinx FPGA solution with exceptional logic density and industrial-grade reliability, the XCV1600E-6FG900I represents a compelling choice that balances performance, cost, and long-term availability.
