Overview: AMD Xilinx XCV1600E-6BG560C Field Programmable Gate Array

The XCV1600E-6BG560C is a powerful field-programmable gate array (FPGA) from AMD Xilinx’s renowned Virtex-E family, designed to deliver exceptional performance for complex digital systems. This advanced FPGA chip combines high-density logic, substantial memory resources, and flexible I/O capabilities, making it an ideal choice for telecommunications, industrial automation, aerospace, and high-performance computing applications.

As part of the industry-leading Xilinx FPGA product line, the XCV1600E-6BG560C represents proven technology that engineers worldwide trust for mission-critical applications requiring reliability and performance.

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Key Features and Specifications

Core Architecture Specifications

Memory and I/O Configuration

Operating Conditions and Performance

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Technical Capabilities and Performance

Advanced FPGA Architecture

The XCV1600E-6BG560C leverages Xilinx’s proven Virtex-E architecture, which features:

• VersaBlock Technology: Optimized configurable logic blocks that provide superior logic density and routing efficiency
• General Routing Matrix (GRM): Advanced interconnect architecture enabling high-performance signal routing with minimal delay
• Distributed RAM: Flexible memory implementation using LUTs (Look-Up Tables) for efficient data storage
• Block SelectRAM: Dedicated memory blocks for high-capacity data buffering and FIFO implementation

SelectI/O Technology

The FPGA supports multiple I/O standards through Xilinx’s SelectI/O technology, allowing designers to interface with various voltage levels and signaling protocols:

• LVTTL (Low Voltage TTL)
• LVCMOS (Low Voltage CMOS)
• PCI (Peripheral Component Interconnect)
• GTL/GTL+ (Gunning Transceiver Logic)
• HSTL (High-Speed Transceiver Logic)
• SSTL (Stub Series Terminated Logic)

This flexibility enables seamless integration with different system components and legacy interfaces.

Clock Management and Distribution

The XCV1600E-6BG560C incorporates advanced clock management features:

• Digital Delay-Locked Loops (DLLs): Precise clock deskewing and multiplication
• Global Clock Distribution: Low-skew clock networks for synchronous operation across the entire device
• Multiple Clock Domains: Support for complex multi-clock designs

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Application Areas and Use Cases

Telecommunications and Networking

The XCV1600E-6BG560C excels in telecommunications infrastructure:

• Protocol Processing: Implement complex communication protocols with hardware acceleration
• Packet Processing: High-speed data packet inspection and routing
• Base Station Controllers: Digital signal processing for wireless communication systems
• Network Interface Cards: Custom networking solutions with programmable logic

Industrial Automation and Control

Industrial applications benefit from the FPGA’s reliability and flexibility:

• Motion Control Systems: Real-time servo control and trajectory planning
• Machine Vision: Image processing and pattern recognition algorithms
• PLC Replacement: Flexible logic control for manufacturing equipment
• Process Control: Complex control algorithms with deterministic timing

Aerospace and Defense

Mission-critical applications leverage the device’s performance:

• Radar Signal Processing: Real-time digital signal processing for radar systems
• Software-Defined Radio: Reconfigurable radio frequency processing
• Avionics Systems: Flight control and navigation processing
• Secure Communications: Custom encryption and data security implementations

High-Performance Computing

Research and computational applications utilize the FPGA’s capabilities:

• Algorithm Acceleration: Hardware implementation of compute-intensive algorithms
• Data Acquisition Systems: High-speed data capture and preprocessing
• Scientific Instrumentation: Custom signal processing for research equipment
• Cryptographic Processing: Hardware-accelerated encryption/decryption

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Design and Development Resources

Configuration Options

The XCV1600E-6BG560C supports multiple configuration modes for flexible system integration:

1. Master Serial Mode: FPGA controls configuration timing
2. Slave Serial Mode: External controller manages configuration
3. Master SelectMAP Mode: Parallel configuration for faster startup
4. Slave SelectMAP Mode: Host-controlled parallel configuration
5. JTAG Mode: Boundary-scan and in-system programming

Development Tools

Engineers can leverage industry-standard Xilinx development tools:

• ISE Design Suite: Complete design environment for Virtex-E devices
• Timing Analyzer (TRCE): Static timing analysis for performance verification
• ChipScope Pro: In-system debugging and verification
• EDIF Support: Standard interface for third-party synthesis tools

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Package Information and PCB Design Considerations

Physical Characteristics

PCB Layout Recommendations

For optimal performance, designers should consider:

• Power Plane Design: Separate power planes for core voltage (1.8V) and I/O banks
• Decoupling Capacitors: Multiple ceramic capacitors near each power pin
• Thermal Management: Adequate copper pour beneath thermal pad with thermal vias
• Signal Integrity: Controlled impedance routing for high-speed signals
• EMI Considerations: Proper grounding and shielding techniques

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Product Status and Availability

Important Notice

Status: Obsolete – Not Recommended for New Designs

While the XCV1600E-6BG560C has reached end-of-life status, it remains available through authorized distributors for legacy system support and maintenance. Engineers working on new projects should consider current-generation FPGA families such as:

• Xilinx 7-Series FPGAs (Artix-7, Kintex-7, Virtex-7)
• Xilinx UltraScale/UltraScale+ families
• AMD Versal ACAP (Adaptive Compute Acceleration Platform)

Supply Chain Information

The XCV1600E-6BG560C is available through:

• Authorized semiconductor distributors
• Electronic component brokers specializing in legacy parts
• Direct from AMD Xilinx for qualified accounts

Stock levels vary, and lead times may be extended for this obsolete component. Engineers should plan accordingly for production requirements.

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Comparison with Related Devices

Virtex-E Family Variants

Speed Grade Comparison

The “-6” speed grade indicates:

• Balanced performance and power consumption
• Suitable for most commercial applications
• Middle option between -5 (slower) and -8 (faster) speed grades
• Cost-effective choice for applications not requiring maximum speed

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Frequently Asked Questions (FAQ)

What is the main difference between XCV1600E-6BG560C and XCV1600E-7BG560I?

The primary difference is the operating temperature range. The XCV1600E-6BG560C is specified for commercial temperature (0°C to 85°C), while the XCV1600E-7BG560I variant supports industrial temperature (-40°C to 100°C). Both have identical logic resources and I/O count.

Can I use modern Vivado tools to program this FPGA?

No, the Virtex-E family requires Xilinx ISE Design Suite (version 14.7 or earlier). Vivado tools support only 7-Series and newer FPGA families. ISE software is still available from AMD Xilinx for legacy device support.

What voltage levels are required to operate the XCV1600E-6BG560C?

The device requires:

• VCCINT (Core voltage): 1.8V ±5% (1.71V to 1.89V)
• VCCO (I/O voltage): Varies by bank and I/O standard selected (typically 1.5V to 3.3V)
• VCCAUX (Auxiliary voltage): 2.5V or 3.3V depending on configuration

Is this FPGA RoHS compliant?

Most production units of the XCV1600E-6BG560C are RoHS compliant. However, as an obsolete product, specific compliance should be verified with your supplier for each lot.

What programming methods are supported?

The FPGA supports JTAG programming via IEEE 1149.1 boundary-scan interface, as well as multiple configuration modes including Master/Slave Serial and SelectMAP. Configuration data can be stored in external PROM or loaded from a microcontroller.

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Reliability and Quality Assurance

Quality Standards

AMD Xilinx FPGAs, including the XCV1600E-6BG560C, are manufactured under strict quality control:

• ISO 9001 certified manufacturing facilities
• Automotive-grade quality for critical applications (select variants)
• Comprehensive electrical and functional testing
• RoHS and REACH compliance

Reliability Features

The device incorporates several reliability enhancements:

• ESD Protection: Built-in electrostatic discharge protection on all pins
• Latch-up Immunity: CMOS design prevents destructive latch-up conditions
• Over-voltage Protection: Input protection circuitry on I/O pins
• Temperature Monitoring: On-chip thermal sensors (accessible through configuration)

Handling and Storage

Proper handling ensures device longevity:

• Store in anti-static packaging with humidity control
• Follow IPC/JEDEC standards for moisture sensitivity (MSL 3)
• Observe proper ESD precautions during assembly
• Use recommended reflow temperature profiles for BGA mounting

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Conclusion: Why Choose XCV1600E-6BG560C

The XCV1600E-6BG560C FPGA represents a proven solution for embedded system designers requiring substantial logic capacity, flexible I/O, and reliable performance. While classified as obsolete for new designs, this device continues to serve critical roles in legacy system maintenance and specialized applications where its specific capabilities align with project requirements.

For engineers supporting existing designs, the XCV1600E-6BG560C offers:

✓ Extensive logic resources (34,992 cells) ✓ Substantial on-chip memory (589,824 bits) ✓ Flexible I/O configuration (404 pins) ✓ Proven reliability in deployed systems ✓ Comprehensive development tool support through ISE

Whether you’re maintaining a telecommunications system, upgrading industrial equipment, or supporting aerospace applications, the XCV1600E-6BG560C provides the performance and features needed for success.

For new designs, consider migrating to current-generation Xilinx FPGA devices that offer enhanced performance, lower power consumption, and modern development tools while maintaining design methodology compatibility.