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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCV100E-8PQG240C: High-Performance Virtex-E FPGA for Advanced Digital Design

Product Details

Overview of XCV100E-8PQG240C FPGA

The XCV100E-8PQG240C is a high-performance Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Virtex-E family. This advanced programmable logic device delivers exceptional speed, capacity, and flexibility for demanding digital design applications. Engineered with cutting-edge 0.18µm CMOS technology, the XCV100E-8PQG240C represents a powerful solution for embedded systems, telecommunications, industrial automation, and digital signal processing applications.

Key Features and Specifications

Core Performance Characteristics

The XCV100E-8PQG240C FPGA provides robust computational capabilities through its advanced architecture:

  • Logic Capacity: 128,236 system gates providing extensive design flexibility
  • Logic Cells: 2,700 configurable logic cells for complex digital implementations
  • Speed Grade: -8 performance grade offering maximum operating frequency of 416MHz
  • CLB Configuration: 600 Configurable Logic Blocks (CLBs) for optimal resource utilization
  • RAM Resources: 81,920 total RAM bits (10KB) for embedded memory applications
  • Process Technology: Advanced 0.18µm 6-layer metal CMOS process

Package and I/O Specifications

Specification Details
Package Type 240-Pin PQFP (Plastic Quad Flat Pack)
Package Code PQG240
User I/O Pins 158 configurable I/O pins
Total Pins 240 pins
Mounting Type Surface Mount Technology (SMT)
Package Dimensions Industry-standard PQFP footprint

Electrical Characteristics

Parameter Specification
Supply Voltage (VCCINT) 1.8V (Core voltage)
Operating Voltage Range 1.71V to 1.89V
I/O Voltage (VCCO) Configurable per bank (1.8V to 3.3V)
Operating Temperature 0°C to +85°C (Commercial grade)
Junction Temperature (TJ) 0°C to +85°C

Advanced FPGA Architecture

Configurable Logic Block Structure

The XCV100E-8PQG240C employs Xilinx’s sophisticated CLB architecture, where each CLB contains four logic cells (LCs) with look-up tables (LUTs), flip-flops, and multiplexers. This structure enables efficient implementation of combinatorial and sequential logic functions.

Embedded Memory Capabilities

With 81,920 RAM bits distributed throughout the device, designers can implement:

  • Distributed RAM configurations (16×1, 16×2, 32×1 bit)
  • Synchronous dual-port RAM
  • FIFO buffers
  • Look-up tables
  • Small data buffers

I/O Banking and Standards

I/O Feature Capability
I/O Banks Two independent banks with separate VCCO
Supported Standards LVTTL, LVCMOS, GTL, GTL+, SSTL, HSTL
Differential Pairs Supported for high-speed signaling
SelectI/O™ Programmable I/O standards per bank

Performance Specifications

Timing and Speed

The -8 speed grade of the XCV100E-8PQG240C delivers:

Performance Metric Specification
Maximum Frequency 416MHz (internal logic)
System Performance Up to 357MHz for complex designs
Propagation Delay Optimized for high-speed applications
Clock Management Delay-Locked Loop (DLL) for precise timing

Application Areas

Industrial Automation and Control

The XCV100E-8PQG240C excels in industrial environments where reliability and performance are critical:

  • Process control systems
  • Motor control applications
  • Programmable logic controllers (PLCs)
  • Industrial networking equipment
  • Real-time monitoring systems

Telecommunications Infrastructure

Ideal for telecommunications applications requiring high-speed data processing:

  • Digital signal processing
  • Protocol conversion
  • Data encryption/decryption
  • Multiplexing and demultiplexing
  • Network interface controllers

Embedded Systems Development

Perfect for sophisticated embedded system implementations:

  • Custom processor interfaces
  • Peripheral controllers
  • System-on-Chip (SoC) prototyping
  • Hardware acceleration
  • Real-time data acquisition

Digital Signal Processing (DSP)

Optimized for DSP applications:

  • Digital filtering
  • Fast Fourier Transform (FFT) implementations
  • Image processing
  • Audio/video processing
  • Mathematical computations

Design Tools and Software Support

Development Environment

The XCV100E-8PQG240C is fully supported by Xilinx’s comprehensive design tools:

  • ISE Design Suite: Complete FPGA design flow
  • Vivado Design Suite: Advanced synthesis and implementation
  • FPGA Editor: Visual placement and routing
  • ChipScope Pro: Integrated logic analyzer
  • CORE Generator: IP core library access

Programming and Configuration

Configuration Mode Description
Master Serial FPGA controls configuration process
Slave Serial External controller manages configuration
SelectMAP Parallel byte-wide configuration
JTAG Boundary-scan configuration and debugging

Comparison with Similar Devices

XCV100E Speed Grade Comparison

Part Number Speed Grade Max Frequency Package
XCV100E-8PQG240C -8 (Fastest) 416MHz 240-PQFP
XCV100E-7PQG240C -7 357MHz 240-PQFP
XCV100E-6PQG240C -6 (Standard) 312MHz 240-PQFP

Package Variants

Package I/O Count Dimensions Application
PQG240 158 Standard PQFP General purpose
FG256 176 Fine-pitch BGA High I/O density
BG352 196 Ball Grid Array Maximum I/O
CS144 94 Chip-scale BGA Space-constrained

Quality and Reliability

Manufacturing Standards

  • RoHS Compliant: Lead-free manufacturing
  • Quality Grade: Industrial commercial grade
  • Reliability Testing: Full AEC-Q100 qualification
  • ESD Protection: Human Body Model (HBM) and Charged Device Model (CDM)

Traceability and Documentation

Each XCV100E-8PQG240C device includes:

  • Unique lot traceability
  • Date code identification
  • Country of origin marking
  • Full technical documentation

Procurement and Availability

Package Information

Attribute Specification
Packaging Anti-static tray
Moisture Sensitivity MSL 3 (Moisture Sensitivity Level)
Storage Temperature -55°C to +150°C
Shelf Life Industry standard (with proper storage)

Integration and Design Considerations

PCB Layout Guidelines

For optimal performance when using the XCV100E-8PQG240C:

  1. Power Distribution: Implement proper power plane design with adequate decoupling
  2. Signal Integrity: Follow high-speed design practices for critical signals
  3. Thermal Management: Ensure adequate heat dissipation for continuous operation
  4. Ground Planes: Use solid ground planes for noise reduction

Recommended Decoupling

Capacitor Type Value Quantity Location
Bulk Capacitor 10µF 2 Near power input
Bypass Capacitor 0.1µF 10-15 Close to VCCINT pins
High-Frequency 0.01µF 5-7 Critical power pins

Technical Support Resources

Available Documentation

  • Complete device datasheet
  • Application notes
  • Reference designs
  • PCB layout guidelines
  • Configuration user guides

Online Resources

Access comprehensive support through authorized Xilinx FPGA distributors and technical documentation portals.

Frequently Asked Questions

Q: What is the difference between XCV100E-8PQG240C and XCV100E-6PQG240C? A: The primary difference is the speed grade. The -8 version offers higher maximum frequencies (416MHz) compared to the -6 version (312MHz), making it suitable for more demanding high-speed applications.

Q: What development tools are required? A: The XCV100E-8PQG240C requires Xilinx ISE Design Suite or compatible FPGA development software, along with a JTAG programming cable for configuration.

Q: Is the XCV100E-8PQG240C suitable for industrial applications? A: Yes, with its commercial temperature range (0°C to +85°C) and robust design, it’s well-suited for many industrial control and automation applications.

Q: What configuration modes are supported? A: The device supports Master Serial, Slave Serial, SelectMAP (parallel), and JTAG boundary-scan configuration modes.

Q: Can this FPGA be reprogrammed? A: Yes, the XCV100E-8PQG240C is fully reprogrammable and supports in-system reconfiguration through various configuration modes.

Conclusion

The XCV100E-8PQG240C represents a powerful, versatile FPGA solution from AMD Xilinx’s proven Virtex-E family. With its combination of high-speed performance (-8 speed grade), substantial logic resources (128,236 gates), and comprehensive I/O capabilities (158 user I/O), this device delivers exceptional value for demanding digital design applications. Whether you’re developing telecommunications infrastructure, industrial control systems, or embedded computing solutions, the XCV100E-8PQG240C provides the performance, flexibility, and reliability needed for successful implementation.

The device’s mature architecture, extensive tool support, and widespread industry adoption make it a reliable choice for both new designs and legacy system upgrades. Combined with competitive pricing and broad availability through authorized distributors, the XCV100E-8PQG240C continues to serve as a cornerstone component in programmable logic design.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.